Xilinx Inc. XC4VFX100-10FF1152I
XC4VFX100-10FF1152I
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Xilinx Inc. XC4VFX100-10FF1152I information
Type
Parameter
Factory Lead Time
10 Weeks
Contact Plating
Lead, Tin
Mount
Surface Mount
Mounting Type
Surface Mount
Package / Case
1152-BBGA, FCBGA
Number of Pins
1152
Supplier Device Package
1152-CFCBGA (35x35)
Operating Temperature
-40°C~100°C TJ
Packaging
Tray
Published
1999
Series
Virtex®-4 FX
Part Status
Active
Moisture Sensitivity Level (MSL)
4 (72 Hours)
Max Operating Temperature
100°C
Min Operating Temperature
-40°C
Voltage - Supply
1.14V~1.26V
Base Part Number
XC4VFX100
Operating Supply Voltage
1.2V
Max Supply Voltage
1.26V
Min Supply Voltage
1.14V
Number of I/O
576
RAM Size
846kB
Number of Logic Elements/Cells
94896
Total RAM Bits
6930432
Number of LABs/CLBs
10544
Number of Logic Blocks (LABs)
10544
Speed Grade
10
RoHS Status
Non-RoHS Compliant
- Datasheets :
- PCN Design/Specification :
- PCN Packaging :
XC4VFX100-10FF1152I Overview
This package is included in the 1152-BBGA, FCBGA package and is available for purchase. There are 576 I/Os for better data transfer. A fundamental building block contains 94896 logic elements or cells. An attachment Surface Mount allows the FPGA module to be attached to the development board. In order for it to operate, the supply voltage must be 1.14V~1.26V . FPGAs belonging to the Virtex?-4 FX series are a type of FPGA that belong to the Virtex?-4 FX series of FPGAs. During the operation of the system, the operating temperature should remain within the range of -40°C~100°C TJ. There is an FPGA model contained in Tray in order to conserve space. The RAM bits that are offered by this fpga chips are 6930432. Its base part number XC4VFX100 can be used to find related parts. It is crucial that the RAM si846kBe of this FPGA module reaches 846kB so that the program can run normally. The device is designed with 1152 pins in total. 10544 LABs and CLBs are built into this FPGA. In order for this FPGA to work properly in accordance with its specifications, it is necessary that it is mounted in Surface Mount. Design engineers can fully take advantage of its flexibility when operating at 1.2V supply voltage. When this module is operated at its maximum operating temperature, it reaches 100°C. Fpga electronics is necessary to maintain an operating temperature higher than -40°C. Its basic building block is composed of 10544 logic blocks (LABs). The maximum supply voltage it supports is 1.26V. With a minimum supply voltage of 1.14V, it is able to function. Its supplier package is called 1152-CFCBGA (35x35).
XC4VFX100-10FF1152I Features
576 I/Os
Up to 6930432 RAM bits
1152 LABs/CLBs
100°C gates
10544 logic blocks (LABs)
XC4VFX100-10FF1152I Applications
There are a lot of Xilinx Inc. XC4VFX100-10FF1152I FPGAs applications.
- Wired Communications
- Audio
- Electronic Warfare
- Video & Image Processing
- Development Boards and Shields for Microcontrollers
- ADAS
- Industrial,Medical and Scientific Instruments
- Defense Applications
- Image processing
- Computer hardware emulation
- ImagePart NumberManufacturerPackage / CaseNumber of PinsNumber of Logic Blocks (LABs)Number of Logic Elements/CellsNumber of I/ORAM SizeMin Supply VoltageMax Supply VoltageView Compare
XC4VFX100-10FF1152I
Xilinx Inc.1152-BBGA, FCBGA
1152
10544
94896
576
846 kB
1.14 V
1.26 V
LFE2M100E-6FN1152CLattice Semiconductor Corporation1152-BBGA
1152
-
95000
520
663.5 kB
-
-
XC4VFX100-10FF1152I
VS
LFE2M100E-6FN1152C
XC5VFX100T-1FF1136IXilinx Inc.1136-BBGA, FCBGA
1136
-
102400
640
1 MB
-
-
XC4VFX100-10FF1152I
VS
XC5VFX100T-1FF1136I
- XC5VFX100T-1FFG1136IXilinx Inc.
1136-BBGA, FCBGA
1136
-
102400
640
1 MB
-
-
XC4VFX100-10FF1152I
VS
XC5VFX100T-1FFG1136I
- XC5VLX110T-3FF1136CXilinx Inc.
1136-BBGA, FCBGA
1136
-
110592
640
666 kB
-
-
XC4VFX100-10FF1152I
VS
XC5VLX110T-3FF1136C
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Tape/Reel | Tube | Tray | Bulk | Ammo |
Weave bulk chips into tapes and pack them into reels through SMD components packaging Tape Machine. Reel is the most commonly used. | When packaging, arrange the components in the same direction and put them into plastic tubes one at a time. | Choose tray package with the same specifications as the original manufacturer, put the components into the tray and use the strapping machine. | Bulk packaging means that the SMD components are freely packaged in a formed plastic box or bag. | Adhesive tape cut continuously in predetermined quantities. The cut strips are placed in boxes for safekeeping. |
Choose electronic components that are vacuum-sealed against water, dust, moisture, oxidation, corrosion, and even UV or RF pollution.
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