Xilinx Inc. XC7K160T-3FFG676E
XC7K160T-3FFG676E
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Xilinx Inc. XC7K160T-3FFG676E information
Type
Parameter
Factory Lead Time
10 Weeks
Mounting Type
Surface Mount
Package / Case
676-BBGA, FCBGA
Surface Mount
YES
Operating Temperature
0°C~100°C TJ
Packaging
Tray
Published
2010
Series
Kintex®-7
JESD-609 Code
e1
Pbfree Code
yes
Part Status
Active
Moisture Sensitivity Level (MSL)
4 (72 Hours)
Number of Terminations
676
ECCN Code
3A991.D
Terminal Finish
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
HTS Code
8542.39.00.01
Subcategory
Field Programmable Gate Arrays
Technology
CMOS
Voltage - Supply
0.97V~1.03V
Terminal Position
BOTTOM
Terminal Form
BALL
Supply Voltage
1V
Terminal Pitch
1mm
Base Part Number
XC7K160
Pin Count
676
JESD-30 Code
S-PBGA-B676
Number of Outputs
400
Power Supplies
11.83.3V
Number of I/O
400
RAM Size
1.4MB
Clock Frequency
1412MHz
Propagation Delay
90 ps
Number of Inputs
400
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells
162240
Total RAM Bits
11980800
Number of LABs/CLBs
12675
Speed Grade
-3
Number of Registers
202800
Combinatorial Delay of a CLB-Max
0.58 ns
Height Seated (Max)
3.37mm
Length
27mm
Width
27mm
Radiation Hardening
No
RoHS Status
ROHS3 Compliant
- Datasheets :
- Environmental Information :
- PCN Design/Specification :
- PCN Assembly/Origin :
XC7K160T-3FFG676E Overview
A 676-BBGA, FCBGA package contains it, and it is available for download. There are FIELD PROGRAMMABLE GATE ARRAY transistors in this type of FPGA. Fpga chips is programmed wFpga chipsh 400 I/Os for transferring data in a more coherent manner. There are 162240 logic elements/cells to form a fundamental building block. The supply voltage is 1V volts. An FPGA part from the Field Programmable Gate Arrays family. FPGA modules can be attached to development boards using a Surface Mount-connector. With a supply voltage of 0.97V~1.03V, this device operates with ease. There are many types of FPGAs in the Kintex?-7 series, this is one of them. Fpga chips is necessary to keep the operating temperature wFpga chipshin 0°C~100°C TJ when the device is operating. This device is equipped with 400 separate outputs, which makes it a very versatile device. A model of this FPGA is contained in Tray for the purpose of saving space. In total, the terminations of this piece are 676. Fpga chips is important to note that this device has a RAM capacFpga chipsy of 11980800 bFpga chipss. If you are looking for related parts, you can use the base part number XC7K160 as a starting point. There is a maximum RAM si1.4MBe of 1.4MB on this FPGA module, which is necessary to ensure the normal operation of the program. 12675 LABs/CLBs are configured on this FPGA. In order for fpga electronics to work, fpga electronics requires a 11.83.3V power supply. As far as the pin count is concerned, it has 676 pins. Most of the time, it uses a crystal oscillating at 1412MHz to generate the signal. The structure of the registers used to store and transfer data consists of 202800 registers.
XC7K160T-3FFG676E Features
400 I/Os
Up to 11980800 RAM bits
202800 registers
XC7K160T-3FFG676E Applications
There are a lot of Xilinx Inc. XC7K160T-3FFG676E FPGAs applications.
- Industrial Ethernet
- Scientific Instruments
- Automotive driver's assistance
- Automation
- Radar and Sensors
- Data Center
- Software-defined radio
- Enterprise networking
- Automotive Applications
- Digital signal processing
- ImagePart NumberManufacturerPackage / CaseNumber of InputsNumber of Logic Elements/CellsNumber of I/ORAM SizeSupply VoltagePbfree CodeTerminal FinishView Compare
XC7K160T-3FFG676E
Xilinx Inc.676-BBGA, FCBGA
400
162240
400
1.4 MB
1 V
yes
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
- XC6VLX130T-1FFG784CXilinx Inc.
784-BBGA, FCBGA
-
128000
400
1.2 MB
1 V
yes
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
XC7K160T-3FFG676E
VS
XC6VLX130T-1FFG784C
- XC6VCX130T-2FFG784CXilinx
FCBGA
-
128000
400
1.2 MB
1 V
yes
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
XC7K160T-3FFG676E
VS
XC6VCX130T-2FFG784C
- XC6VCX195T-1FFG784CXilinx
FCBGA
-
199680
400
1.5 MB
1 V
yes
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
XC7K160T-3FFG676E
VS
XC6VCX195T-1FFG784C
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After the electronic components have passed the quality inspection of Aztec Electronics, there are generally the following five packaging forms for electronic components: Tape, Tube, Tray, Bulk and Ammo.
Tape/Reel | Tube | Tray | Bulk | Ammo |
Weave bulk chips into tapes and pack them into reels through SMD components packaging Tape Machine. Reel is the most commonly used. | When packaging, arrange the components in the same direction and put them into plastic tubes one at a time. | Choose tray package with the same specifications as the original manufacturer, put the components into the tray and use the strapping machine. | Bulk packaging means that the SMD components are freely packaged in a formed plastic box or bag. | Adhesive tape cut continuously in predetermined quantities. The cut strips are placed in boxes for safekeeping. |
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