Lattice Semiconductor Corporation LCMXO2-1200UHC-4FTG256I
LCMXO2-1200UHC-4FTG256I
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Lattice Semiconductor Corporation LCMXO2-1200UHC-4FTG256I information
Type
Parameter
Factory Lead Time
8 Weeks
Mount
Surface Mount
Mounting Type
Surface Mount
Package / Case
256-LBGA
Number of Pins
256
Operating Temperature
-40°C~100°C TJ
Packaging
Tray
Published
2012
Series
MachXO2
JESD-609 Code
e1
Pbfree Code
yes
Part Status
Active
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Number of Terminations
256
ECCN Code
EAR99
Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)
HTS Code
8542.39.00.01
Subcategory
Field Programmable Gate Arrays
Technology
CMOS
Voltage - Supply
2.375V~3.465V
Terminal Position
BOTTOM
Terminal Form
BALL
Peak Reflow Temperature (Cel)
260
Supply Voltage
2.5V
Terminal Pitch
1mm
Frequency
269MHz
Reflow Temperature-Max (s)
30
Base Part Number
LCMXO2-1200
Pin Count
256
Number of Outputs
207
Operating Supply Voltage
2.5V
Power Supplies
2.5/3.3V
Memory Size
20.5kB
Operating Supply Current
56μA
Number of I/O
206
RAM Size
9.3kB
Memory Type
FLASH
Propagation Delay
7.24 ns
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells
1280
Total RAM Bits
75776
Number of LABs/CLBs
160
Number of Macro Cells
640
Radiation Hardening
No
REACH SVHC
No SVHC
RoHS Status
ROHS3 Compliant
Lead Free
Lead Free
- Datasheets :
- PCN Design/Specification :
- PCN Assembly/Origin :
- PCN Packaging :
- PCN Other :
- ConflictMineralStatement :
LCMXO2-1200UHC-4FTG256I Overview
In the package 256-LBGA, this product is provided. FIELD PROGRAMMABLE GATE ARRAY is the component of this type of FPGA. Fpga chips is programmed wFpga chipsh 206 I/Os for transferring data in a more coherent manner. To form a fundamental building block, there are 1280 logic elements/cells. 2.5V volts power it. A Field Programmable Gate Arrays-series FPGA part. The Surface Mount-slot on the development board allows you to attach the FPGA module. In order for it to operate, the supply voltage must be 2.375V~3.465V . As part of the MachXO2 series of FPGAs, it is a type of FPGA. In order to ensure a safe and efficient operation, it is important to maintain a temperature within -40°C~100°C TJ at all times. In this device, there are 207 outputs that can be used. Unlike other FPGA models, this one is contained in Tray for the sake of space saving. 256 terminations are present in total. There are 75776 RAM bits that are available with this device. Related parts can be found by using its base part number LCMXO2-1200. The RAM si9.3kBe of this FPGA module reaches 9.3kB so as to guarantee the normal operation of the program during operation. The device has 256 pins which are included in the design. A total of 160 LABs/CLBs make up this FPGA array. Having stated that, if this FPGA is mounted in Surface Mount, then it may be able to perform fantastically according to its specifications. Its flexibility is fully utilized when operated with a supply voltage of 2.5V. An external power supply of 2.5/3.3V is required to power the device. Fpga semiconductor is equipped wfpga semiconductorh 256 pin count. A memory of 20.5kB is embedded in this FPGA module for storing data and programs. The high efficiency of this device is provided by its 269MHz-frequency operation. A 56μA supply current is used for its operation. A CPLD is essentially composed of 640 macrocells, which are the main building blocks of a CPLD. This memory is designed for storing data and avoiding resource conflicts.
LCMXO2-1200UHC-4FTG256I Features
206 I/Os
Up to 75776 RAM bits
256 LABs/CLBs
Operating from a frequency of 269MHz
LCMXO2-1200UHC-4FTG256I Applications
There are a lot of Lattice Semiconductor Corporation LCMXO2-1200UHC-4FTG256I FPGAs applications.
- Digital signal processing
- Video & Image Processing
- Software-defined radio
- Enterprise networking
- Audio
- Embedded Vision
- ADAS
- Defense Applications
- Automation
- Automotive driver's assistance
- ImagePart NumberManufacturerPackage / CaseNumber of PinsNumber of Logic Elements/CellsNumber of I/OSupply VoltageNumber of TerminationsFactory Lead TimeHTS CodeView Compare
LCMXO2-1200UHC-4FTG256I
Lattice Semiconductor Corporation256-LBGA
256
1280
206
2.5 V
256
8 Weeks
8542.39.00.01
LCMXO1200C-3FTN256CLattice Semiconductor Corporation256-LBGA
256
1200
211
1.8 V
256
8 Weeks
8542.39.00.01
LCMXO2-1200UHC-4FTG256I
VS
LCMXO1200C-3FTN256C
LCMXO1200C-3BN256ILattice Semiconductor Corporation256-LFBGA, CSPBGA
256
1200
211
1.8 V
256
8 Weeks
8542.39.00.01
LCMXO2-1200UHC-4FTG256I
VS
LCMXO1200C-3BN256I
- LCMXO1200C-3BN256CLattice Semiconductor Corporation
256-LFBGA, CSPBGA
256
1200
211
1.8 V
256
8 Weeks
8542.39.00.01
LCMXO2-1200UHC-4FTG256I
VS
LCMXO1200C-3BN256C
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Tape/Reel | Tube | Tray | Bulk | Ammo |
Weave bulk chips into tapes and pack them into reels through SMD components packaging Tape Machine. Reel is the most commonly used. | When packaging, arrange the components in the same direction and put them into plastic tubes one at a time. | Choose tray package with the same specifications as the original manufacturer, put the components into the tray and use the strapping machine. | Bulk packaging means that the SMD components are freely packaged in a formed plastic box or bag. | Adhesive tape cut continuously in predetermined quantities. The cut strips are placed in boxes for safekeeping. |
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