Lattice Semiconductor Corporation LCMXO1200C-3TN100C
LCMXO1200C-3TN100C
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Lattice Semiconductor Corporation LCMXO1200C-3TN100C information
Type
Parameter
Factory Lead Time
8 Weeks
Mount
Surface Mount
Mounting Type
Surface Mount
Package / Case
100-LQFP
Number of Pins
100
Weight
657.000198mg
Operating Temperature
0°C~85°C TJ
Packaging
Tray
Published
2000
Series
MachXO
JESD-609 Code
e3
Pbfree Code
yes
Part Status
Active
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Number of Terminations
100
ECCN Code
EAR99
Terminal Finish
Matte Tin (Sn)
Additional Feature
IT CAN ALSO OPERATE AT 2.5V AND 3.3V
HTS Code
8542.39.00.01
Subcategory
Field Programmable Gate Arrays
Technology
CMOS
Voltage - Supply
1.71V~3.465V
Terminal Position
QUAD
Terminal Form
GULL WING
Peak Reflow Temperature (Cel)
260
Supply Voltage
1.8V
Terminal Pitch
0.5mm
Frequency
420MHz
Reflow Temperature-Max (s)
30
Base Part Number
LCMXO1200
Pin Count
100
Number of Outputs
73
Operating Supply Voltage
3.3V
Operating Supply Current
21mA
Number of I/O
73
Memory Type
SRAM
Propagation Delay
5.1 ns
Turn On Delay Time
5.1 ns
Programmable Logic Type
FLASH PLD
Number of Logic Elements/Cells
1200
Total RAM Bits
9421
Number of LABs/CLBs
150
Output Function
MACROCELL
Number of Macro Cells
600
Number of Dedicated Inputs
7
Height Seated (Max)
1.6mm
Length
14mm
Width
14mm
Radiation Hardening
No
REACH SVHC
No SVHC
RoHS Status
ROHS3 Compliant
Lead Free
Lead Free
- Datasheets :
- PCN Design/Specification :
- PCN Assembly/Origin :
- PCN Packaging :
- ConflictMineralStatement :
LCMXO1200C-3TN100C Overview
A 100-LQFP package is provided with this component. Fpga chips consists of FLASH PLD elements. 73 I/Os are available for transferring data more efficiently. There are 1200 logic elements/cells to form a fundamental building block. 1.8V volts power it. An FPGA part from the Field Programmable Gate Arrays family. The Surface Mount-slot on the development board allows you to attach the FPGA module. Fpga chips operates wFpga chipsh a supply voltage of 1.71V~3.465V. This is a type of FPGA that is part of the MachXO series of FPGAs. While operating, the operating temperature should be kept within a range of 0°C~85°C TJ. The device has 73 outputs that are integrated into it. A model of this FPGA is contained in Tray for the purpose of saving space. In total, it has a total of 100 terminations. Fpga chips is important to note that this device has a RAM capacFpga chipsy of 9421 bFpga chipss. In order to find related parts, use the part number LCMXO1200 as a base. The device has 100 pins which are included in the design. This FPGA is built as an array of 150 LABs/CLBs. Providing that this FPGA is mounted in Surface Mount, it will be able to perform according to its specifications in a flawless manner. Its flexibility can be fully utilized when operating with a 3.3V supply voltage. I am going to present you with a device that is equipped with 100 pins. A frequency of 420MHz provides high efficiency. In order to operate this device, a supply current of 21mA is used. The IT CAN ALSO OPERATE AT 2.5V AND 3.3V feature is also characteristic of fpga circuit. There are 7 dedicated inputs which are used to detect the status of input signals on the platform. The main building blocks of a CPLD can be found in this device, namely 600 macro cells. Using SRAM memory, resources can be avoided conflicts and data can be stored efficiently.
LCMXO1200C-3TN100C Features
73 I/Os
Up to 9421 RAM bits
100 LABs/CLBs
Operating from a frequency of 420MHz
LCMXO1200C-3TN100C Applications
There are a lot of Lattice Semiconductor Corporation LCMXO1200C-3TN100C FPGAs applications.
- Camera time adjustments
- Video & Image Processing
- Electronic Warfare
- High Performance Computing
- Aerospace and Defense
- ASIC prototyping
- Broadcast
- Scientific Instruments
- Random logic
- Data Mining
- ImagePart NumberManufacturerPackage / CaseNumber of PinsPropagation DelayNumber of Macro CellsNumber of I/OMemory TypeSupply VoltageMounting TypeView Compare
LCMXO1200C-3TN100C
Lattice Semiconductor Corporation100-LQFP
100
5.1 ns
600
73
SRAM
1.8 V
Surface Mount
- XC2C128-7VQG100CXilinx Inc.
100-TQFP
100
5.7 ns
128
80
ROMless
1.8 V
Surface Mount
LCMXO1200C-3TN100C
VS
XC2C128-7VQG100C
- LCMXO256C-3TN100CLattice Semiconductor Corporation
100-LQFP
100
4.9 ns
128
78
SRAM
1.8 V
Surface Mount
LCMXO1200C-3TN100C
VS
LCMXO256C-3TN100C
- LAMXO256C-3TN100ELattice Semiconductor Corporation
100-LQFP
100
4.9 ns
128
78
SRAM
-
Surface Mount
LCMXO1200C-3TN100C
VS
LAMXO256C-3TN100E
- LCMXO2280C-3T100CLattice Semiconductor Corporation
100-LQFP
100
5.1 ns
1140
73
SRAM
1.8 V
Surface Mount
LCMXO1200C-3TN100C
VS
LCMXO2280C-3T100C
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After the electronic components have passed the quality inspection of Aztec Electronics, there are generally the following five packaging forms for electronic components: Tape, Tube, Tray, Bulk and Ammo.
Tape/Reel | Tube | Tray | Bulk | Ammo |
Weave bulk chips into tapes and pack them into reels through SMD components packaging Tape Machine. Reel is the most commonly used. | When packaging, arrange the components in the same direction and put them into plastic tubes one at a time. | Choose tray package with the same specifications as the original manufacturer, put the components into the tray and use the strapping machine. | Bulk packaging means that the SMD components are freely packaged in a formed plastic box or bag. | Adhesive tape cut continuously in predetermined quantities. The cut strips are placed in boxes for safekeeping. |
Choose electronic components that are vacuum-sealed against water, dust, moisture, oxidation, corrosion, and even UV or RF pollution.
How to pack electronic components in cartons?
1. Choose the right box for your electronic components2. Use anti-static bubble film protect electronic component
3. Put it into the box, no buffer dead corner, 360-degree package.
4. Labeled as fragile to ensure that the courier knows what needs to be done with the package.