Lattice Semiconductor Corporation LCMXO2-1200HC-4TG100I
LCMXO2-1200HC-4TG100I
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Lattice Semiconductor Corporation LCMXO2-1200HC-4TG100I information
Type
Parameter
Factory Lead Time
8 Weeks
Mount
Surface Mount
Mounting Type
Surface Mount
Package / Case
100-LQFP
Number of Pins
100
Weight
657.000198mg
Operating Temperature
-40°C~100°C TJ
Packaging
Tray
Published
2000
Series
MachXO2
JESD-609 Code
e3
Pbfree Code
yes
Part Status
Active
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Number of Terminations
100
ECCN Code
EAR99
Terminal Finish
Matte Tin (Sn)
HTS Code
8542.39.00.01
Subcategory
Field Programmable Gate Arrays
Technology
CMOS
Voltage - Supply
2.375V~3.465V
Terminal Position
QUAD
Terminal Form
GULL WING
Peak Reflow Temperature (Cel)
260
Supply Voltage
2.5V
Terminal Pitch
0.5mm
Frequency
269MHz
Reflow Temperature-Max (s)
30
Base Part Number
LCMXO2-1200
Pin Count
100
Number of Outputs
80
Operating Supply Voltage
2.5V
Power Supplies
2.5/3.3V
Memory Size
17.3kB
Operating Supply Current
3.49mA
Number of I/O
79
RAM Size
8kB
Memory Type
FLASH
Propagation Delay
7.24 ns
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells
1280
Total RAM Bits
65536
Number of LABs/CLBs
160
Number of Macro Cells
640
Height
1.4mm
Length
14mm
Width
14mm
Radiation Hardening
No
REACH SVHC
No SVHC
RoHS Status
ROHS3 Compliant
Lead Free
Lead Free
- Datasheets :
- PCN Design/Specification :
- PCN Assembly/Origin :
- PCN Packaging :
- PCN Other :
- ConflictMineralStatement :
LCMXO2-1200HC-4TG100I Overview
There are two packages that contain fpga chips: 100-LQFP package and X package. Fpga chips consists of FIELD PROGRAMMABLE GATE ARRAY elements. Its 79 I/Os help it transfer data more efficiently. A fundamental building block consists of 1280 logic elements/cells. Fpga chips is powered from a supply voltage of 2.5V. Part of the Field Programmable Gate Arrays family, this FPGA part is a programmable gate array. The Surface Mount-slot connector on the FPGA module can be connected to the development board. Fpga chips operates at a voltage of 2.375V~3.465V and uses a battery to supply power. It is a type of FPGA that belongs to the MachXO2 series of FPGAs. During the operation of the system, the operating temperature should remain within the range of -40°C~100°C TJ. A device such as this one has 80 outputs built into it. As a space-saving measure, this FPGA model is contained within Tray. The total number of terminations is 100. Fpga chips is important to note that this device has a RAM capacFpga chipsy of 65536 bFpga chipss. In order to find related parts, you can use its base part number LCMXO2-1200. Fpga electronics is important that this FPGA module has a RAM si8kBe of 8kB in order to ensure that the program will run normally. It has a total of 100 pins that are designed for it. An array of 160 LABs/CLBs is built into the FPGA. I think, as long as this FPGA is mounted in Surface Mount, it could perform excellently according to its specifications as long as you mount it in Surface Mount. In operation with 2.5V, designers can take advantage of its flexibility to the fullest extent. In order for fpga electronics to work, fpga electronics requires a 2.5/3.3V power supply. A total of 100 pins are included in this device. Data and programs can be stored in this FPGA module's 17.3kB memory. The system operates at a frequency of 269MHz in order to achieve maximum efficiency. The supply current used for its operation is 3.49mA. A CPLD consists of 640 macro cells which are the building blocks that make up an electronic device. In the FLASH memory, data is stored safely and resource conflicts are avoided.
LCMXO2-1200HC-4TG100I Features
79 I/Os
Up to 65536 RAM bits
100 LABs/CLBs
Operating from a frequency of 269MHz
LCMXO2-1200HC-4TG100I Applications
There are a lot of Lattice Semiconductor Corporation LCMXO2-1200HC-4TG100I FPGAs applications.
- Telecommunication
- Artificial intelligence (AI)
- Medical imaging
- Camera time adjustments
- Security systems
- Enterprise networking
- High Performance Computing
- Medical Electronics
- Bioinformatics
- Industrial IoT
- ImagePart NumberManufacturerPackage / CaseNumber of PinsNumber of Logic Elements/CellsNumber of I/ORAM SizeSupply VoltageTerminal PitchSubcategoryView Compare
LCMXO2-1200HC-4TG100I
Lattice Semiconductor Corporation100-LQFP
100
1280
79
8 kB
2.5 V
0.5 mm
Field Programmable Gate Arrays
- LCMXO1200C-3TN100ILattice Semiconductor Corporation
100-LQFP
100
1200
73
-
1.8 V
0.5 mm
Field Programmable Gate Arrays
LCMXO2-1200HC-4TG100I
VS
LCMXO1200C-3TN100I
- XC3S50A-4VQG100IXilinx Inc.
100-TQFP
100
1584
68
6.8 kB
1.2 V
0.5 mm
Field Programmable Gate Arrays
LCMXO2-1200HC-4TG100I
VS
XC3S50A-4VQG100I
- ICE40HX1K-VQ100Lattice Semiconductor Corporation
100-LQFP
100
-
72
8 kB
1.2 V
0.5 mm
Field Programmable Gate Arrays
LCMXO2-1200HC-4TG100I
VS
ICE40HX1K-VQ100
- LCMXO1200C-4TN100CLattice Semiconductor Corporation
100-LQFP
100
1200
73
-
1.8 V
0.5 mm
Field Programmable Gate Arrays
LCMXO2-1200HC-4TG100I
VS
LCMXO1200C-4TN100C
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After the electronic components have passed the quality inspection of Aztec Electronics, there are generally the following five packaging forms for electronic components: Tape, Tube, Tray, Bulk and Ammo.
Tape/Reel | Tube | Tray | Bulk | Ammo |
Weave bulk chips into tapes and pack them into reels through SMD components packaging Tape Machine. Reel is the most commonly used. | When packaging, arrange the components in the same direction and put them into plastic tubes one at a time. | Choose tray package with the same specifications as the original manufacturer, put the components into the tray and use the strapping machine. | Bulk packaging means that the SMD components are freely packaged in a formed plastic box or bag. | Adhesive tape cut continuously in predetermined quantities. The cut strips are placed in boxes for safekeeping. |
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