Lattice Semiconductor Corporation LCMXO1200C-3TN144I
LCMXO1200C-3TN144I
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Lattice Semiconductor Corporation LCMXO1200C-3TN144I information
Type
Parameter
Factory Lead Time
8 Weeks
Mount
Surface Mount
Mounting Type
Surface Mount
Package / Case
144-LQFP
Number of Pins
144
Operating Temperature
-40°C~100°C TJ
Packaging
Tray
Published
2000
Series
MachXO
JESD-609 Code
e3
Pbfree Code
yes
Part Status
Active
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Number of Terminations
144
ECCN Code
EAR99
Terminal Finish
Matte Tin (Sn)
Additional Feature
IT CAN ALSO OPERATE AT 2.5V AND 3.3V
HTS Code
8542.39.00.01
Subcategory
Field Programmable Gate Arrays
Technology
CMOS
Voltage - Supply
1.71V~3.465V
Terminal Position
QUAD
Terminal Form
GULL WING
Peak Reflow Temperature (Cel)
260
Supply Voltage
1.8V
Terminal Pitch
0.5mm
Frequency
420MHz
Reflow Temperature-Max (s)
40
Base Part Number
LCMXO1200
Pin Count
144
Number of Outputs
113
Operating Supply Voltage
3.3V
Operating Supply Current
21mA
Number of I/O
113
Nominal Supply Current
21mA
Memory Type
SRAM
Propagation Delay
5.1 ns
Turn On Delay Time
5.1 ns
Programmable Logic Type
FLASH PLD
Number of Logic Elements/Cells
1200
Total RAM Bits
9421
Number of LABs/CLBs
150
Output Function
MACROCELL
Number of Macro Cells
600
Number of Dedicated Inputs
7
Height Seated (Max)
1.6mm
Length
20mm
Width
20mm
Radiation Hardening
No
REACH SVHC
No SVHC
RoHS Status
ROHS3 Compliant
Lead Free
Lead Free
- Datasheets :
- PCN Design/Specification :
- PCN Assembly/Origin :
- PCN Packaging :
- ConflictMineralStatement :
LCMXO1200C-3TN144I Overview
This package is included in the 144-LQFP package and is available for purchase. The FLASH PLD-series of FPGAs are composed of this type. There are 113 I/Os for better data transfer. Logic elements/cells form the fundamental building block of a computer. In order to operate fpga chips, a voltage supply of 1.8V volts is required. In this case, the FPGA part belongs to the Field Programmable Gate Arrays family. By attaching the Surface Mount connector, you can use this FPGA module with your development board. A supply voltage of 1.71V~3.465V is needed in order for fpga chips to operate. The MachXO series FPGA is a type of FPGA that belongs to the MachXO family of FPGAs. In order to ensure a safe and efficient operation, it is important to maintain a temperature within -40°C~100°C TJ at all times. In this device, there are 113 outputs that can be used. A model of this FPGA is contained in Tray for the purpose of saving space. The total number of terminations is 144. A device like this one offers 9421 RAM bits, which is a considerable amount of memory. Its base part number LCMXO1200 can be used to find parts that are related to it. This cable has 144 pins and is designed to connect to a computer. An array of 150 LABs/CLBs is built into the FPGA. I think, as long as this FPGA is mounted in Surface Mount, it could perform excellently according to its specifications as long as you mount it in Surface Mount. When operating with the supply voltage of 3.3V, designers can fully make use of its flexibility. There are a total of 144 pins on this device. Powered by a 420MHz-frequency motor, it delivers high efficiency. The supply current used for its operation is 21mA. Additionally, this feature is also known as IT CAN ALSO OPERATE AT 2.5V AND 3.3V, which is one of its main characteristics. It is possible to detect the status of an input signal by using 7 dedicated inputs provided on the output board. The main component of a CPLD is a set of 600 macrocells that form the foundation for the device. The SRAM memory is optimiSRAMed for data storage and resource management.
LCMXO1200C-3TN144I Features
113 I/Os
Up to 9421 RAM bits
144 LABs/CLBs
Operating from a frequency of 420MHz
LCMXO1200C-3TN144I Applications
There are a lot of Lattice Semiconductor Corporation LCMXO1200C-3TN144I FPGAs applications.
- Radar and Sensors
- Bioinformatics
- Random logic
- Integrating multiple SPLDs
- Software-defined radio
- Solar Energy
- Data center search engines
- Data Center
- High Performance Computing
- Video & Image Processing
- ImagePart NumberManufacturerPackage / CaseNumber of PinsNumber of Logic Elements/CellsNumber of I/OSupply VoltageTerminal PitchFactory Lead TimeHTS CodeView Compare
LCMXO1200C-3TN144I
Lattice Semiconductor Corporation144-LQFP
144
1200
113
1.8 V
0.5 mm
8 Weeks
8542.39.00.01
- LCMXO2-1200HC-5TG144CLattice Semiconductor Corporation
144-LQFP
144
1280
107
2.5 V
0.5 mm
8 Weeks
8542.39.00.01
LCMXO1200C-3TN144I
VS
LCMXO2-1200HC-5TG144C
- LCMXO2-1200HC-4TG144ILattice Semiconductor Corporation
144-LQFP
144
1280
107
2.5 V
0.5 mm
8 Weeks
8542.39.00.01
LCMXO1200C-3TN144I
VS
LCMXO2-1200HC-4TG144I
- LCMXO2-1200HC-4TG144CLattice Semiconductor Corporation
144-LQFP
144
1280
107
2.5 V
0.5 mm
8 Weeks
8542.39.00.01
LCMXO1200C-3TN144I
VS
LCMXO2-1200HC-4TG144C
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After the electronic components have passed the quality inspection of Aztec Electronics, there are generally the following five packaging forms for electronic components: Tape, Tube, Tray, Bulk and Ammo.
Tape/Reel | Tube | Tray | Bulk | Ammo |
Weave bulk chips into tapes and pack them into reels through SMD components packaging Tape Machine. Reel is the most commonly used. | When packaging, arrange the components in the same direction and put them into plastic tubes one at a time. | Choose tray package with the same specifications as the original manufacturer, put the components into the tray and use the strapping machine. | Bulk packaging means that the SMD components are freely packaged in a formed plastic box or bag. | Adhesive tape cut continuously in predetermined quantities. The cut strips are placed in boxes for safekeeping. |
Choose electronic components that are vacuum-sealed against water, dust, moisture, oxidation, corrosion, and even UV or RF pollution.
How to pack electronic components in cartons?
1. Choose the right box for your electronic components2. Use anti-static bubble film protect electronic component
3. Put it into the box, no buffer dead corner, 360-degree package.
4. Labeled as fragile to ensure that the courier knows what needs to be done with the package.
