Xilinx Inc. XC7A200T-2FBG676C
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Xilinx Inc. XC7A200T-2FBG676C information
Type
Parameter
Factory Lead Time
10 Weeks
Contact Plating
Copper, Silver, Tin
Mounting Type
Surface Mount
Package / Case
676-BBGA, FCBGA
Surface Mount
YES
Number of Pins
676
Operating Temperature
0°C~85°C TJ
Packaging
Tray
Published
2009
Series
Artix-7
JESD-609 Code
e1
Pbfree Code
yes
Part Status
Active
Moisture Sensitivity Level (MSL)
4 (72 Hours)
Number of Terminations
676
ECCN Code
3A991.D
Terminal Finish
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
HTS Code
8542.39.00.01
Subcategory
Field Programmable Gate Arrays
Technology
CMOS
Voltage - Supply
0.95V~1.05V
Terminal Position
BOTTOM
Terminal Form
BALL
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Supply Voltage
1V
Terminal Pitch
1mm
Reflow Temperature-Max (s)
NOT SPECIFIED
Base Part Number
XC7A200T
Pin Count
676
Number of Outputs
400
Qualification Status
Not Qualified
Power Supplies
1V
Memory Size
1GB
Number of I/O
400
RAM Size
1.6MB
Memory Type
DDR3
Clock Frequency
1286MHz
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells
215360
Total RAM Bits
13455360
Number of LABs/CLBs
16825
Speed Grade
-2
Number of Registers
269200
Combinatorial Delay of a CLB-Max
1.05 ns
Height Seated (Max)
2.54mm
Length
27mm
Width
27mm
RoHS Status
ROHS3 Compliant
- Datasheets :
- Environmental Information :
- PCN Design/Specification :
- PCN Assembly/Origin :
XC7A200T-2FBG676C Overview
There is a 676-BBGA, FCBGA package that includes this component. There are FIELD PROGRAMMABLE GATE ARRAY transistors in this type of FPGA. Its 400 I/Os help it transfer data more efficiently. Logic elements/cells form the fundamental building block of a computer. It is powered from a supply voltage of 1V. Field Programmable Gate Arrays family FPGA part. By attaching the Surface Mount connector, you can use this FPGA module with your development board. Fpga chips operates at a voltage of 0.95V~1.05V and uses a battery to supply power. The FPGA belongs to the Artix-7 series of FPGAs, and it is one type of FPGA. While operating, the operating temperature should be kept within a range of 0°C~85°C TJ. This device is equipped with 400 separate outputs, which makes it a very versatile device. There is an FPGA model contained in Tray in order to conserve space. In total, it has a total of 676 terminations. Having a RAM bit size of 13455360 means that this device will offer you a lot of memory. You can find related parts by using the part number XC7A200T, which is its base part number. The FPGA module's RAM si1.6MBe reaches 1.6MB in order to ensure that the program operates in a normal manner. In order to make it work, 676 pins have been designed. The FPGA is built as an array of 16825 latches or CLBs. There is a 1V power supply that is required to operate it. I am going to present you with a device that is equipped with 676 pins. Most commonly, this device makes use of an oscillating crystal frequency of 1286MHz to operate. For storing programs and data, this FPGA module embeds memory 1GB. A total of 269200 registers are used for storing and transferring data between them. A DDR3 memory provides data storage and avoids resource conflicts.
XC7A200T-2FBG676C Features
400 I/Os
Up to 13455360 RAM bits
676 LABs/CLBs
269200 registers
XC7A200T-2FBG676C Applications
There are a lot of Xilinx Inc. XC7A200T-2FBG676C FPGAs applications.
- Military DSP
- Embedded Vision
- Aerospace and Defense
- Radar and Sensors
- Data Mining
- Filtering and communication encoding
- Industrial Ethernet
- High Performance Computing
- Scientific Instruments
- Voice recognition
- ImagePart NumberManufacturerPackage / CaseNumber of PinsNumber of Logic Elements/CellsNumber of I/ORAM SizeSupply VoltageLengthTerminal PitchView Compare
XC7A200T-2FBG676C
Xilinx Inc.676-BBGA, FCBGA
676
215360
400
1.6 MB
1 V
27 mm
1 mm
- XC7K160T-1FBG676CXilinx Inc.
676-BBGA, FCBGA
676
162240
400
1.4 MB
1 V
27 mm
1 mm
XC7A200T-2FBG676C
VS
XC7K160T-1FBG676C
- XC7K160T-2FFG676CXilinx Inc.
676-BBGA, FCBGA
676
162240
400
1.4 MB
1 V
27 mm
1 mm
XC7A200T-2FBG676C
VS
XC7K160T-2FFG676C
- XC7K160T-1FFG676CXilinx Inc.
676-BBGA, FCBGA
676
162240
400
1.4 MB
1 V
27 mm
1 mm
XC7A200T-2FBG676C
VS
XC7K160T-1FFG676C
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Tape/Reel | Tube | Tray | Bulk | Ammo |
Weave bulk chips into tapes and pack them into reels through SMD components packaging Tape Machine. Reel is the most commonly used. | When packaging, arrange the components in the same direction and put them into plastic tubes one at a time. | Choose tray package with the same specifications as the original manufacturer, put the components into the tray and use the strapping machine. | Bulk packaging means that the SMD components are freely packaged in a formed plastic box or bag. | Adhesive tape cut continuously in predetermined quantities. The cut strips are placed in boxes for safekeeping. |
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