Xilinx Inc. XC3S200AN-4FTG256I
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Xilinx Inc. XC3S200AN-4FTG256I information
Type
Parameter
Factory Lead Time
10 Weeks
Mount
Surface Mount
Mounting Type
Surface Mount
Package / Case
256-LBGA
Number of Pins
256
Operating Temperature
-40°C~100°C TJ
Packaging
Tray
Published
2007
Series
Spartan®-3AN
JESD-609 Code
e1
Pbfree Code
yes
Part Status
Active
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Number of Terminations
256
Termination
SMD/SMT
ECCN Code
EAR99
Subcategory
Field Programmable Gate Arrays
Technology
CMOS
Voltage - Supply
1.14V~1.26V
Terminal Position
BOTTOM
Terminal Form
BALL
Peak Reflow Temperature (Cel)
260
Supply Voltage
1.2V
Terminal Pitch
1mm
Frequency
667MHz
Reflow Temperature-Max (s)
30
Base Part Number
XC3S200AN
Pin Count
256
Number of Outputs
160
Qualification Status
Not Qualified
Operating Supply Voltage
1.2V
Power Supplies
1.21.2/3.33.3V
Number of I/O
195
RAM Size
36kB
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells
4032
Total RAM Bits
294912
Number of Gates
200000
Number of LABs/CLBs
448
Speed Grade
4
Combinatorial Delay of a CLB-Max
0.71 ns
Number of CLBs
448
Height Seated (Max)
1.55mm
Length
17mm
Width
17mm
REACH SVHC
No SVHC
RoHS Status
ROHS3 Compliant
- Datasheets :
- Environmental Information :
- PCN Packaging :
- PCN Other :
XC3S200AN-4FTG256I Overview
The package that contains this software is called 256-LBGA. The FIELD PROGRAMMABLE GATE ARRAY-series of FPGAs are composed of this type. The device has 195 I/O ports for more coherent data transfer. Logic elements/cells form the fundamental building block of a computer. It is powered from a supply voltage of 1.2V. Part of the Field Programmable Gate Arrays family, this FPGA part is a programmable gate array. An attachment Surface Mount allows the FPGA module to be attached to the development board. This device is powered by a 1.14V~1.26V battery. FPGAs belonging to the Spartan?-3AN series are a type of FPGA that belong to the Spartan?-3AN series of FPGAs. Operating temperatures should be maintained within the -40°C~100°C TJ range at all times when the unit is in use. There are 160 outputs incorporated in this device. This FPGA model is contained in Tray for space saving. Fpga chips is designed wFpga chipsh 256 terminations. The RAM bits that this device offer is 294912. You can find related parts by using the part number XC3S200AN, which is its base part number. For the program to work properly, the RAM si36kBe of this FPGA module must reach 36kB GB in order to ensure normal operation. Fpga electronics is designed wfpga electronics h 256 pins. Fpga electronics contains 448 LABs/CLBs in an array. Having stated that, if this FPGA is mounted in Surface Mount, then it may be able to perform fantastically according to its specifications. Design engineers can fully take advantage of its flexibility when operating at 1.2V supply voltage. Power is supplied to the device by a 1.21.2/3.33.3V battery. There are 200000 gates that make up its basic building block. Fpga semiconductor is equipped wfpga semiconductorh 256 pin count. There are 448 CLBs that make up the architecture of the system. To achieve high efficiency, it runs at a frequency of 667MHz.
XC3S200AN-4FTG256I Features
195 I/Os
Up to 294912 RAM bits
256 LABs/CLBs
Operating from a frequency of 667MHz
XC3S200AN-4FTG256I Applications
There are a lot of Xilinx Inc. XC3S200AN-4FTG256I FPGAs applications.
- Space Applications
- ADAS
- Automotive advanced driver assistance systems (ADAS)
- Aerospace and Defense
- Video & Image Processing
- Server Applications
- Industrial Ethernet
- Cryptography
- Image processing
- ASIC prototyping
- ImagePart NumberManufacturerPackage / CaseNumber of PinsNumber of Logic Elements/CellsNumber of I/ONumber of GatesRAM SizeSupply VoltageRoHS StatusView Compare
XC3S200AN-4FTG256I
Xilinx Inc.256-LBGA
256
4032
195
200000
36 kB
1.2 V
ROHS3 Compliant
- XC3S200A-4FGG320IXilinx Inc.
320-BGA
320
4032
248
200000
36 kB
1.2 V
ROHS3 Compliant
XC3S200AN-4FTG256I
VS
XC3S200A-4FGG320I
- XC3S200A-4FTG256CXilinx Inc.
256-LBGA
256
4032
195
200000
288 kB
1.2 V
ROHS3 Compliant
XC3S200AN-4FTG256I
VS
XC3S200A-4FTG256C
- XC3S200A-4FTG256IXilinx Inc.
256-LBGA
256
4032
195
200000
36 kB
-
ROHS3 Compliant
XC3S200AN-4FTG256I
VS
XC3S200A-4FTG256I
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Tape/Reel | Tube | Tray | Bulk | Ammo |
Weave bulk chips into tapes and pack them into reels through SMD components packaging Tape Machine. Reel is the most commonly used. | When packaging, arrange the components in the same direction and put them into plastic tubes one at a time. | Choose tray package with the same specifications as the original manufacturer, put the components into the tray and use the strapping machine. | Bulk packaging means that the SMD components are freely packaged in a formed plastic box or bag. | Adhesive tape cut continuously in predetermined quantities. The cut strips are placed in boxes for safekeeping. |
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