Lattice Semiconductor Corporation LCMXO2-1200HC-4MG132I
LCMXO2-1200HC-4MG132I
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Lattice Semiconductor Corporation LCMXO2-1200HC-4MG132I information
Type
Parameter
Factory Lead Time
8 Weeks
Mount
Surface Mount
Mounting Type
Surface Mount
Package / Case
132-LFBGA, CSPBGA
Number of Pins
132
Operating Temperature
-40°C~100°C TJ
Packaging
Tray
Published
2000
Series
MachXO2
JESD-609 Code
e1
Pbfree Code
yes
Part Status
Active
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Number of Terminations
132
ECCN Code
EAR99
Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)
HTS Code
8542.39.00.01
Subcategory
Field Programmable Gate Arrays
Technology
CMOS
Voltage - Supply
2.375V~3.465V
Terminal Position
BOTTOM
Terminal Form
BALL
Peak Reflow Temperature (Cel)
250
Supply Voltage
2.5V
Terminal Pitch
0.5mm
Frequency
269MHz
Reflow Temperature-Max (s)
30
Base Part Number
LCMXO2-1200
Pin Count
132
Number of Outputs
105
Operating Supply Voltage
2.5V
Power Supplies
2.5/3.3V
Memory Size
17.3kB
Operating Supply Current
3.49mA
Number of I/O
104
RAM Size
8kB
Memory Type
FLASH
Propagation Delay
7.24 ns
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells
1280
Total RAM Bits
65536
Number of LABs/CLBs
160
Number of Macro Cells
640
Radiation Hardening
No
REACH SVHC
No SVHC
RoHS Status
ROHS3 Compliant
Lead Free
Lead Free
- Datasheets :
- PCN Design/Specification :
- PCN Assembly/Origin :
- PCN Packaging :
- PCN Other :
- ConflictMineralStatement :
LCMXO2-1200HC-4MG132I Overview
Fpga chips is supplied in the 132-LFBGA, CSPBGA package. FIELD PROGRAMMABLE GATE ARRAY is the component of this type of FPGA. 104 I/Os are available for transferring data more efficiently. In order to construct a fundamental building block, 1280 logic elements/cells are required. 2.5V volts power it. An FPGA part from the Field Programmable Gate Arrays family. An attachment Surface Mount allows the FPGA module to be attached to the development board. There is a 2.375V~3.465V-volt supply voltage required for the device to operate. The FPGA belongs to the MachXO2 series of FPGAs, and it is one type of FPGA. The operating temperature should be kept at -40°C~100°C TJ when operating. A device such as this one has 105 outputs built into it. A model of this FPGA is contained in Tray for the purpose of saving space. 132 terminations are present in total. There are 65536 RAM bits that are available with this device. You can find related parts by using the part number LCMXO2-1200, which is its base part number. The RAM si8kBe of this FPGA module reaches 8kB so as to guarantee the normal operation of the program during operation. In this case, there are 132 pins on the board. A total of 160 LABs/CLBs are included in this FPGA. I think, as long as this FPGA is mounted in Surface Mount, it could perform excellently according to its specifications as long as you mount it in Surface Mount. In the case of 2.5V supply voltage, designers can take full advantage of its flexibility. Power is supplied to the device by a 2.5/3.3V battery. In addition to this, it has 132 pins. Data and programs can be stored in this FPGA module's 17.3kB memory. High efficiency is achieved by operating at a frequency of 269MHz. A 3.49mA supply current is used for its operation. There are 640 macro cells which make up this CPLD and they serve as the main components of the device. This memory is designed to store data efficiently and prevent resource conflicts.
LCMXO2-1200HC-4MG132I Features
104 I/Os
Up to 65536 RAM bits
132 LABs/CLBs
Operating from a frequency of 269MHz
LCMXO2-1200HC-4MG132I Applications
There are a lot of Lattice Semiconductor Corporation LCMXO2-1200HC-4MG132I FPGAs applications.
- Automotive Applications
- Military DSP
- Medical Applications
- Filtering and communication encoding
- Aircraft navigation
- Military Temperature
- Camera time adjustments
- Random logic
- DO-254
- Broadcast
- ImagePart NumberManufacturerPackage / CaseNumber of PinsNumber of Logic Elements/CellsNumber of I/ORAM SizeSupply VoltageTerminal PitchFactory Lead TimeView Compare
LCMXO2-1200HC-4MG132I
Lattice Semiconductor Corporation132-LFBGA, CSPBGA
132
1280
104
8 kB
2.5 V
0.5 mm
8 Weeks
LCMXO1200C-3MN132ILattice Semiconductor Corporation132-LFBGA, CSPBGA
132
1200
101
-
1.8 V
0.5 mm
8 Weeks
LCMXO2-1200HC-4MG132I
VS
LCMXO1200C-3MN132I
ICE40HX1K-CB132Lattice Semiconductor Corporation132-LFBGA, CSPBGA
132
-
95
8 kB
1.2 V
0.5 mm
8 Weeks
LCMXO2-1200HC-4MG132I
VS
ICE40HX1K-CB132
- LCMXO1200C-3MN132CLattice Semiconductor Corporation
132-LFBGA, CSPBGA
132
1200
101
-
1.8 V
0.5 mm
8 Weeks
LCMXO2-1200HC-4MG132I
VS
LCMXO1200C-3MN132C
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Tape/Reel | Tube | Tray | Bulk | Ammo |
Weave bulk chips into tapes and pack them into reels through SMD components packaging Tape Machine. Reel is the most commonly used. | When packaging, arrange the components in the same direction and put them into plastic tubes one at a time. | Choose tray package with the same specifications as the original manufacturer, put the components into the tray and use the strapping machine. | Bulk packaging means that the SMD components are freely packaged in a formed plastic box or bag. | Adhesive tape cut continuously in predetermined quantities. The cut strips are placed in boxes for safekeeping. |
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