Lattice Semiconductor Corporation LCMXO2-1200HC-4TG100C
LCMXO2-1200HC-4TG100C
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Lattice Semiconductor Corporation LCMXO2-1200HC-4TG100C information
Type
Parameter
Factory Lead Time
8 Weeks
Mount
Surface Mount
Mounting Type
Surface Mount
Package / Case
100-LQFP
Number of Pins
100
Operating Temperature
0°C~85°C TJ
Packaging
Tray
Published
2000
Series
MachXO2
JESD-609 Code
e3
Pbfree Code
yes
Part Status
Active
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Number of Terminations
100
ECCN Code
EAR99
Terminal Finish
Matte Tin (Sn)
HTS Code
8542.39.00.01
Subcategory
Field Programmable Gate Arrays
Technology
CMOS
Voltage - Supply
2.375V~3.465V
Terminal Position
QUAD
Terminal Form
GULL WING
Peak Reflow Temperature (Cel)
260
Supply Voltage
2.5V
Terminal Pitch
0.5mm
Frequency
269MHz
Reflow Temperature-Max (s)
30
Base Part Number
LCMXO2-1200
Pin Count
100
Number of Outputs
80
Operating Supply Voltage
2.5V
Power Supplies
2.5/3.3V
Memory Size
17.3kB
Operating Supply Current
3.49mA
Number of I/O
79
RAM Size
8kB
Memory Type
FLASH
Propagation Delay
7.24 ns
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells
1280
Density
64 kb
Total RAM Bits
65536
Number of LABs/CLBs
160
Number of Macro Cells
640
Radiation Hardening
No
REACH SVHC
No SVHC
RoHS Status
ROHS3 Compliant
Lead Free
Lead Free
- Datasheets :
- PCN Design/Specification :
- PCN Assembly/Origin :
- PCN Packaging :
- PCN Other :
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LCMXO2-1200HC-4TG100C Overview
In the 100-LQFP package, you will find fpga chips. The FIELD PROGRAMMABLE GATE ARRAY-series of FPGAs are composed of this type. The I/Os are designed to facilitate a more coherent transfer of data. In order to construct a fundamental building block, 1280 logic elements/cells are required. It is powered from a supply voltage of 2.5V. A Field Programmable Gate Arrays-series FPGA part. Using a Surface Mount connector, you can mount this FPGA module on the development board. Fpga chips operates at a voltage of 2.375V~3.465V and uses a battery to supply power. It is a type of FPGA that belongs to the MachXO2 series of FPGAs. During the operation of the system, the operating temperature should remain within the range of 0°C~85°C TJ. In order to make this device as versatile as possible, there are 80 different outputs included. As a result of space limitations, this FPGA model has been included in Tray. In total, the terminations of this piece are 100. The RAM bits that this device offer is 65536. If you are looking for related parts, you can use the base part number LCMXO2-1200 as a starting point. Fpga electronics is important that this FPGA module has a RAM si8kBe of 8kB in order to ensure that the program will run normally. In this case, 100 pins are used in the design. The FPGA consists of 160 LABs/CLBs. In order for this FPGA to work properly in accordance with its specifications, it is necessary that it is mounted in Surface Mount. Its flexibility can be fully utilized when operating with a 2.5V supply voltage. Powered by a 2.5/3.3V power supply, it can be operated by almost anyone. As far as the pin count is concerned, it has 100 pins. There is a memory of 17.3kB embedded in this FPGA module, which can be used for storing programs and data. This device operates at a frequency of 269MHz in order to provide high efficiency. Fpga semiconductor operates on a 3.49mA power supply. As the main building blocks of a CPLD, 640 macro cells make up the majority of the circuit in this device. FLASH memory is adapted for storing data and preventing resource conflicts.
LCMXO2-1200HC-4TG100C Features
79 I/Os
Up to 65536 RAM bits
100 LABs/CLBs
Operating from a frequency of 269MHz
LCMXO2-1200HC-4TG100C Applications
There are a lot of Lattice Semiconductor Corporation LCMXO2-1200HC-4TG100C FPGAs applications.
- Radar and Sensors
- Cryptography
- Consumer Electronics
- Automotive Applications
- Aircraft navigation
- Development Boards and Shields for Microcontrollers
- Software-defined radios
- Embedded Vision
- OpenCL
- Telecommunication
- ImagePart NumberManufacturerPackage / CaseNumber of PinsNumber of Logic Elements/CellsNumber of I/ORAM SizeSupply VoltageTerminal PitchSubcategoryView Compare
LCMXO2-1200HC-4TG100C
Lattice Semiconductor Corporation100-LQFP
100
1280
79
8 kB
2.5 V
0.5 mm
Field Programmable Gate Arrays
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- XC3S50A-4VQG100IXilinx Inc.
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- ICE40HX1K-VQ100Lattice Semiconductor Corporation
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-
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1.2 V
0.5 mm
Field Programmable Gate Arrays
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VS
ICE40HX1K-VQ100
- LCMXO1200C-4TN100CLattice Semiconductor Corporation
100-LQFP
100
1200
73
-
1.8 V
0.5 mm
Field Programmable Gate Arrays
LCMXO2-1200HC-4TG100C
VS
LCMXO1200C-4TN100C
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Tape/Reel | Tube | Tray | Bulk | Ammo |
Weave bulk chips into tapes and pack them into reels through SMD components packaging Tape Machine. Reel is the most commonly used. | When packaging, arrange the components in the same direction and put them into plastic tubes one at a time. | Choose tray package with the same specifications as the original manufacturer, put the components into the tray and use the strapping machine. | Bulk packaging means that the SMD components are freely packaged in a formed plastic box or bag. | Adhesive tape cut continuously in predetermined quantities. The cut strips are placed in boxes for safekeeping. |
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