Lattice Semiconductor Corporation LCMXO1200C-3FTN256C
LCMXO1200C-3FTN256C
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Lattice Semiconductor Corporation LCMXO1200C-3FTN256C information
Type
Parameter
Factory Lead Time
8 Weeks
Mount
Surface Mount
Mounting Type
Surface Mount
Package / Case
256-LBGA
Number of Pins
256
Operating Temperature
0°C~85°C TJ
Packaging
Tray
Published
2007
Series
MachXO
JESD-609 Code
e1
Pbfree Code
yes
Part Status
Active
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Number of Terminations
256
Termination
SMD/SMT
ECCN Code
EAR99
Terminal Finish
Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Additional Feature
IT CAN ALSO OPERATE AT 2.5V AND 3.3V
HTS Code
8542.39.00.01
Subcategory
Field Programmable Gate Arrays
Technology
CMOS
Voltage - Supply
1.71V~3.465V
Terminal Position
BOTTOM
Terminal Form
BALL
Peak Reflow Temperature (Cel)
260
Supply Voltage
1.8V
Terminal Pitch
1mm
Frequency
420MHz
Reflow Temperature-Max (s)
40
Base Part Number
LCMXO1200
Pin Count
256
Number of Outputs
211
Operating Supply Voltage
3.3V
Operating Supply Current
21mA
Number of I/O
211
Memory Type
SRAM
Propagation Delay
5.1 ns
Turn On Delay Time
5.1 ns
Programmable Logic Type
FLASH PLD
Number of Logic Elements/Cells
1200
Total RAM Bits
9421
Number of LABs/CLBs
150
Output Function
MACROCELL
Number of Macro Cells
600
Number of Dedicated Inputs
7
Height Seated (Max)
1.55mm
Length
17mm
Width
17mm
Radiation Hardening
No
REACH SVHC
No SVHC
RoHS Status
ROHS3 Compliant
Lead Free
Lead Free
- Datasheets :
- PCN Design/Specification :
- PCN Assembly/Origin :
- PCN Packaging :
- ConflictMineralStatement :
LCMXO1200C-3FTN256C Overview
A 256-LBGA package is provided with this component. The FLASH PLD-series of FPGAs are composed of this type. Its 211 I/Os help it transfer data more efficiently. In order to construct a fundamental building block, 1200 logic elements/cells are required. In order for the device to operate, a supply voltage of 1.8V volts needs to be provided. FPGA parts like this belong to the Field Programmable Gate Arrays family. The Surface Mount-slot on the development board allows you to attach the FPGA module. A supply voltage of 1.71V~3.465V is needed in order for fpga chips to operate. The FPGA belongs to the MachXO series of FPGAs, and it is one type of FPGA. Fpga chips is necessary to keep the operating temperature wFpga chipshin 0°C~85°C TJ when the device is operating. With this device, you will be able to make use of 211 outputs. Unlike other FPGA models, this one is contained in Tray for the sake of space saving. In total, it has 256 terminations on each end. Fpga electronics is worth mentioning that this device provides 9421 bfpga electronics s of RAM. In order to find related parts, you can use its base part number LCMXO1200. There are 256 pins on this device. This FPGA is built as an array of 150 LABs/CLBs. In my opinion, this FPGA could produce fantastic results if mounted in Surface Mount, provided that its specifications are followed. Its flexibility can be fully utilized when operating with a 3.3V supply voltage. Featuring 256 pins in total, it is a versatile device. The system operates at a frequency of 420MHz in order to achieve maximum efficiency. There is a 21mA supply current used in its operation. Fpga semiconductor is also characteriIT CAN ALSO OPERATE AT 2.5V AND 3.3Ved by a feature called IT CAN ALSO OPERATE AT 2.5V AND 3.3V. There are 7 dedicated inputs which are used to detect the status of input signals on the platform. CPLDs are built and controlled by a number of macrocells, which is the main part of the device. In the SRAM memory, data is stored safely and resource conflicts are avoided.
LCMXO1200C-3FTN256C Features
211 I/Os
Up to 9421 RAM bits
256 LABs/CLBs
Operating from a frequency of 420MHz
LCMXO1200C-3FTN256C Applications
There are a lot of Lattice Semiconductor Corporation LCMXO1200C-3FTN256C FPGAs applications.
- Security systems
- Software-defined radio
- Enterprise networking
- Broadcast
- Aircraft navigation
- Telecommunication
- Automotive driver's assistance
- Wireless Communications
- Server Applications
- Image processing
- ImagePart NumberManufacturerPackage / CaseNumber of PinsNumber of Logic Elements/CellsNumber of I/OSupply VoltageNumber of TerminationsTerminal PitchPin CountView Compare
LCMXO1200C-3FTN256C
Lattice Semiconductor Corporation256-LBGA
256
1200
211
1.8 V
256
1 mm
256
- LCMXO2-1200UHC-4FTG256ILattice Semiconductor Corporation
256-LBGA
256
1280
206
2.5 V
256
1 mm
256
LCMXO1200C-3FTN256C
VS
LCMXO2-1200UHC-4FTG256I
- XC3S50A-4FTG256IXilinx Inc.
256-LBGA
256
1584
144
1.2 V
256
1 mm
256
LCMXO1200C-3FTN256C
VS
XC3S50A-4FTG256I
- LCMXO2-1200UHC-5FTG256CLattice Semiconductor Corporation
256-LBGA
256
1280
206
2.5 V
256
1 mm
256
LCMXO1200C-3FTN256C
VS
LCMXO2-1200UHC-5FTG256C
- LCMXO2-1200UHC-4FTG256CLattice Semiconductor Corporation
256-LBGA
256
1280
206
2.5 V
256
1 mm
256
LCMXO1200C-3FTN256C
VS
LCMXO2-1200UHC-4FTG256C
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Tape/Reel | Tube | Tray | Bulk | Ammo |
Weave bulk chips into tapes and pack them into reels through SMD components packaging Tape Machine. Reel is the most commonly used. | When packaging, arrange the components in the same direction and put them into plastic tubes one at a time. | Choose tray package with the same specifications as the original manufacturer, put the components into the tray and use the strapping machine. | Bulk packaging means that the SMD components are freely packaged in a formed plastic box or bag. | Adhesive tape cut continuously in predetermined quantities. The cut strips are placed in boxes for safekeeping. |
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