Lattice Semiconductor Corporation LCMXO256C-3TN100C
LCMXO256C-3TN100C
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Lattice Semiconductor Corporation LCMXO256C-3TN100C information
Type
Parameter
Factory Lead Time
8 Weeks
Mount
Surface Mount
Mounting Type
Surface Mount
Package / Case
100-LQFP
Number of Pins
100
Weight
657.000198mg
Operating Temperature
0°C~85°C TJ
Packaging
Tray
Published
2000
Series
MachXO
JESD-609 Code
e3
Pbfree Code
yes
Part Status
Active
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Number of Terminations
100
Termination
SMD/SMT
ECCN Code
EAR99
Terminal Finish
Matte Tin (Sn)
Additional Feature
IT CAN ALSO OPERATE AT 2.5V AND 3.3V
HTS Code
8542.39.00.01
Subcategory
Field Programmable Gate Arrays
Technology
CMOS
Voltage - Supply
1.71V~3.465V
Terminal Position
QUAD
Terminal Form
GULL WING
Peak Reflow Temperature (Cel)
260
Supply Voltage
1.8V
Terminal Pitch
0.5mm
Frequency
500MHz
Reflow Temperature-Max (s)
30
Base Part Number
LCMXO256
Pin Count
100
Number of Outputs
78
Operating Supply Voltage
3.3V
Memory Size
256B
Operating Supply Current
13mA
Number of I/O
78
RAM Size
0B
Memory Type
SRAM
Propagation Delay
4.9 ns
Turn On Delay Time
4.9 ns
Programmable Logic Type
FLASH PLD
Number of Logic Elements/Cells
256
Density
2 kb
Number of LABs/CLBs
32
Output Function
MACROCELL
Number of Macro Cells
128
Number of Logic Cells
256
Number of Dedicated Inputs
7
Height Seated (Max)
1.6mm
Length
14mm
Width
14mm
Radiation Hardening
No
REACH SVHC
No SVHC
RoHS Status
ROHS3 Compliant
Lead Free
Lead Free
- Datasheets :
- PCN Design/Specification :
- PCN Assembly/Origin :
- PCN Packaging :
- ConflictMineralStatement :
LCMXO256C-3TN100C Overview
There are two packages that contain fpga chips: 100-LQFP package and X package. FLASH PLD is the component of this type of FPGA. The device has 78 I/O ports for more coherent data transfer. Logic blocks consist of 256 logic elements/cells. It is powered from a supply voltage of 1.8V. In this case, the FPGA part belongs to the Field Programmable Gate Arrays family. An FPGA module can be attached to a development board with a Surface Mount-pin. Fpga chips operates wFpga chipsh a supply voltage of 1.71V~3.465V. An FPGA belonging to the MachXO series is referred to as an FPGA. While operating, the operating temperature should be kept within a range of 0°C~85°C TJ. There are 78 outputs incorporated in this device. Using the Tray layout, this FPGA model can be contained in a very small amount of space. In total, it has 100 terminations on each end. Related parts can be found by using its base part number LCMXO256. The FPGA module's RAM si0Be reaches 0B in order to ensure that the program operates in a normal manner. In order to make it work, 100 pins have been designed. The FPGA consists of 32 LABs/CLBs. In my opinion, this FPGA could produce fantastic results if mounted in Surface Mount, provided that its specifications are followed. With a 3.3V supply voltage, designers can fully utilize the flexibility of the device. The device has a total of 100 pins on fpga semiconductor. In this FPGA module, there is a memory of 256B that can be used to store programs and data. Fpga semiconductor operates at a frequency of 500MHz to deliver high efficiency. As part of the building blocks, it consists of 256 logic cells. This device uses a 13mA supply current to operate. Furthermore, it can be distinguished by the presence of a feature called IT CAN ALSO OPERATE AT 2.5V AND 3.3V. There are 7 dedicated inputs used to detect the status of input signals. The main component of a CPLD is a set of 128 macrocells that form the foundation for the device. Adapted for storing data, the SRAM memory avoids resource conflicts.
LCMXO256C-3TN100C Features
78 I/Os
100 LABs/CLBs
Operating from a frequency of 500MHz
LCMXO256C-3TN100C Applications
There are a lot of Lattice Semiconductor Corporation LCMXO256C-3TN100C FPGAs applications.
- Embedded Vision
- Voice recognition
- Camera time adjustments
- Aircraft navigation
- Industrial Ethernet
- Image processing
- DO-254
- Server Applications
- Space Applications
- Automotive Applications
- ImagePart NumberManufacturerPackage / CaseNumber of PinsPropagation DelayNumber of Macro CellsNumber of I/OMemory TypeSupply VoltageMounting TypeView Compare
LCMXO256C-3TN100C
Lattice Semiconductor Corporation100-LQFP
100
4.9 ns
128
78
SRAM
1.8 V
Surface Mount
- ATF1504ASV-15AU100Microchip Technology
100-TQFP
100
15 ns
64
64
EEPROM
3.3 V
Surface Mount
LCMXO256C-3TN100C
VS
ATF1504ASV-15AU100
- LAMXO256C-3TN100ELattice Semiconductor Corporation
100-LQFP
100
4.9 ns
128
78
SRAM
-
Surface Mount
LCMXO256C-3TN100C
VS
LAMXO256C-3TN100E
- LCMXO256E-3T100CLattice Semiconductor Corporation
100-LQFP
100
4.9 ns
128
78
SRAM
1.2 V
Surface Mount
LCMXO256C-3TN100C
VS
LCMXO256E-3T100C
- LCMXO256E-4T100CLattice Semiconductor Corporation
100-LQFP
100
4.2 ns
128
78
SRAM
1.2 V
Surface Mount
LCMXO256C-3TN100C
VS
LCMXO256E-4T100C
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After the electronic components have passed the quality inspection of Aztec Electronics, there are generally the following five packaging forms for electronic components: Tape, Tube, Tray, Bulk and Ammo.
Tape/Reel | Tube | Tray | Bulk | Ammo |
Weave bulk chips into tapes and pack them into reels through SMD components packaging Tape Machine. Reel is the most commonly used. | When packaging, arrange the components in the same direction and put them into plastic tubes one at a time. | Choose tray package with the same specifications as the original manufacturer, put the components into the tray and use the strapping machine. | Bulk packaging means that the SMD components are freely packaged in a formed plastic box or bag. | Adhesive tape cut continuously in predetermined quantities. The cut strips are placed in boxes for safekeeping. |
Choose electronic components that are vacuum-sealed against water, dust, moisture, oxidation, corrosion, and even UV or RF pollution.
How to pack electronic components in cartons?
1. Choose the right box for your electronic components2. Use anti-static bubble film protect electronic component
3. Put it into the box, no buffer dead corner, 360-degree package.
4. Labeled as fragile to ensure that the courier knows what needs to be done with the package.