Xilinx Inc. XC7K70T-1FBG484I
XC7K70T-1FBG484I
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Xilinx Inc. XC7K70T-1FBG484I information
Type
Parameter
Factory Lead Time
10 Weeks
Contact Plating
Copper, Silver, Tin
Mounting Type
Surface Mount
Package / Case
484-BBGA, FCBGA
Surface Mount
YES
Number of Pins
484
Operating Temperature
-40°C~100°C TJ
Packaging
Tray
Published
2010
Series
Kintex®-7
JESD-609 Code
e1
Pbfree Code
yes
Part Status
Active
Moisture Sensitivity Level (MSL)
4 (72 Hours)
Number of Terminations
484
ECCN Code
3A991.D
Terminal Finish
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
HTS Code
8542.39.00.01
Subcategory
Field Programmable Gate Arrays
Technology
CMOS
Voltage - Supply
0.97V~1.03V
Terminal Position
BOTTOM
Terminal Form
BALL
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Supply Voltage
1V
Terminal Pitch
1mm
Reach Compliance Code
not_compliant
Reflow Temperature-Max (s)
NOT SPECIFIED
Base Part Number
XC7K70T
Pin Count
484
Number of Outputs
285
Qualification Status
Not Qualified
Power Supplies
11.83.3V
Number of I/O
285
RAM Size
607.5kB
Clock Frequency
1098MHz
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells
65600
Total RAM Bits
4976640
Number of LABs/CLBs
5125
Speed Grade
-1
Number of Registers
82000
Combinatorial Delay of a CLB-Max
0.74 ns
Height Seated (Max)
2.54mm
Length
23mm
Width
23mm
RoHS Status
ROHS3 Compliant
- Datasheets :
- Environmental Information :
- PCN Design/Specification :
- PCN Assembly/Origin :
XC7K70T-1FBG484I Overview
There is a 484-BBGA, FCBGA package that includes this component. Fpga chips consists of FIELD PROGRAMMABLE GATE ARRAY elements. Having 285 I/Os makes data transfers more coherent. There are 65600 logic elements/cells to form a fundamental building block. Supply voltage is 1V volts. This FPGA part belongs to the family of Field Programmable Gate Arrays. Surface Mount-connectors can be used to attach this FPGA module to the development board. Fpga chips operates at a voltage of 0.97V~1.03V and uses a battery to supply power. The FPGA belongs to the Kintex?-7 series of FPGAs, and it is one type of FPGA. While operating, the operating temperature should be kept within a range of -40°C~100°C TJ. The device has 285 outputs that are integrated into it. As a space-saving measure, this FPGA model is contained within Tray. Total terminations are 484. Fpga chips is important to note that this device has a RAM capacFpga chipsy of 4976640 bFpga chipss. Parts related to this part can be found using its base part number XC7K70T. A significant amount of RAM is allocated to this FPGA module to ensure that the program can operate normally. The device has 484 pins which are included in the design. A total of 5125 LABs/CLBs make up this FPGA array. This is a battery operated device that operates on 11.83.3V. A total of 484 pins are included in this device. It usually uses a crystal oscillating at a frequency of 1098MHz in order to do its work. There are 82000 registers used to store and transfer data.
XC7K70T-1FBG484I Features
285 I/Os
Up to 4976640 RAM bits
484 LABs/CLBs
82000 registers
XC7K70T-1FBG484I Applications
There are a lot of Xilinx Inc. XC7K70T-1FBG484I FPGAs applications.
- Software-defined radios
- Defense Applications
- Image processing
- Ecosystem
- Space Applications
- Military DSP
- Filtering and communication encoding
- Audio
- Medical Electronics
- DO-254
- ImagePart NumberManufacturerPackage / CaseNumber of PinsNumber of Logic Elements/CellsNumber of I/ORAM SizeSupply VoltageTerminal PitchHeight Seated (Max)View Compare
XC7K70T-1FBG484I
Xilinx Inc.484-BBGA, FCBGA
484
65600
285
607.5 kB
1 V
1 mm
2.54 mm
- XC7K70T-2FBG484IXilinx Inc.
484-BBGA, FCBGA
484
65600
285
607.5 kB
1 V
1 mm
2.54 mm
XC7K70T-1FBG484I
VS
XC7K70T-2FBG484I
- XC7K70T-2FBG484CXilinx Inc.
484-BBGA, FCBGA
484
65600
285
607.5 kB
1 V
1 mm
2.54 mm
XC7K70T-1FBG484I
VS
XC7K70T-2FBG484C
- XC7K70T-3FBG484EXilinx Inc.
484-BBGA, FCBGA
484
65600
285
607.5 kB
1 V
1 mm
2.54 mm
XC7K70T-1FBG484I
VS
XC7K70T-3FBG484E
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Weave bulk chips into tapes and pack them into reels through SMD components packaging Tape Machine. Reel is the most commonly used. | When packaging, arrange the components in the same direction and put them into plastic tubes one at a time. | Choose tray package with the same specifications as the original manufacturer, put the components into the tray and use the strapping machine. | Bulk packaging means that the SMD components are freely packaged in a formed plastic box or bag. | Adhesive tape cut continuously in predetermined quantities. The cut strips are placed in boxes for safekeeping. |
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