Lattice Semiconductor Corporation LCMXO2-2000HC-4TG100I
LCMXO2-2000HC-4TG100I
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Lattice Semiconductor Corporation LCMXO2-2000HC-4TG100I information
Type
Parameter
Factory Lead Time
8 Weeks
Mount
Surface Mount
Mounting Type
Surface Mount
Package / Case
100-LQFP
Number of Pins
100
Operating Temperature
-40°C~100°C TJ
Packaging
Tray
Published
2000
Series
MachXO2
JESD-609 Code
e3
Pbfree Code
yes
Part Status
Active
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Number of Terminations
100
ECCN Code
EAR99
Terminal Finish
Matte Tin (Sn)
HTS Code
8542.39.00.01
Subcategory
Field Programmable Gate Arrays
Technology
CMOS
Voltage - Supply
2.375V~3.465V
Terminal Position
QUAD
Terminal Form
GULL WING
Peak Reflow Temperature (Cel)
260
Supply Voltage
2.5V
Terminal Pitch
0.5mm
Frequency
269MHz
Reflow Temperature-Max (s)
30
Base Part Number
LCMXO2-2000
Pin Count
100
Number of Outputs
80
Operating Supply Voltage
2.5V
Power Supplies
2.5/3.3V
Memory Size
21.3kB
Operating Supply Current
80μA
Number of I/O
79
RAM Size
9.3kB
Memory Type
FLASH
Propagation Delay
7.24 ns
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells
2112
Total RAM Bits
75776
Number of LABs/CLBs
264
Number of Macro Cells
1056
Height
1.4mm
Length
14mm
Width
14mm
Radiation Hardening
No
REACH SVHC
No SVHC
RoHS Status
ROHS3 Compliant
Lead Free
Lead Free
- Datasheets :
- PCN Design/Specification :
- PCN Assembly/Origin :
- PCN Packaging :
- PCN Other :
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LCMXO2-2000HC-4TG100I Overview
Fpga chips is supplied in the 100-LQFP package. An FPGA of this type is made up of FIELD PROGRAMMABLE GATE ARRAY gates. 79 I/Os are available for transferring data more efficiently. A fundamental building block contains 2112 logic elements or cells. Supply voltage is 2.5V volts. A Field Programmable Gate Arrays-series FPGA part. Surface Mount-connectors can be used to attach this FPGA module to the development board. In order to operate it, it requires a voltage supply of 2.375V~3.465V . As part of the MachXO2 series of FPGAs, it is a type of FPGA. Fpga chips is important to maintain the operating temperature wFpga chipshin the range of -40°C~100°C TJ when operating the machine. There are 80 outputs incorporated in this device. As a space-saving measure, this FPGA model is contained within Tray. In total, it has a total of 100 terminations. A device like this one offers 75776 RAM bits, which is a considerable amount of memory. If you are looking for related parts, you can use the base part number LCMXO2-2000 as a starting point. The RAM si9.3kBe of this FPGA module reaches 9.3kB so as to guarantee the normal operation of the program during operation. In this case, there are 100 pins on the board. 264 LABs/CLBs are configured on this FPGA. Fpga electronics is possible for this FPGA to perform as per fpga electronics s specifications as long as fpga electronics is mounted in Surface Mount direction. With a 2.5V supply voltage, designers can fully utilize the flexibility of the device. Powered by a 2.5/3.3V power supply, it can be operated by almost anyone. In addition to this, it has 100 pins. In this FPGA module, there is a memory of 21.3kB that can be used to store programs and data. To achieve high efficiency, it runs at a frequency of 269MHz. A 80μA supply current is used for its operation. A CPLD consists of 1056 macro cells which are the building blocks that make up an electronic device. A FLASH memory provides data storage and avoids resource conflicts.
LCMXO2-2000HC-4TG100I Features
79 I/Os
Up to 75776 RAM bits
100 LABs/CLBs
Operating from a frequency of 269MHz
LCMXO2-2000HC-4TG100I Applications
There are a lot of Lattice Semiconductor Corporation LCMXO2-2000HC-4TG100I FPGAs applications.
- Integrating multiple SPLDs
- Automotive Applications
- Camera time adjustments
- Data Mining
- Space Applications
- Telecommunication
- Scientific Instruments
- Filtering and communication encoding
- OpenCL
- Medical Applications
- ImagePart NumberManufacturerPackage / CaseNumber of PinsNumber of Logic Elements/CellsNumber of I/ORAM SizeSupply VoltageTechnologyLengthView Compare
LCMXO2-2000HC-4TG100I
Lattice Semiconductor Corporation100-LQFP
100
2112
79
9.3 kB
2.5 V
CMOS
14 mm
- XC3S100E-4VQG100CXilinx Inc.
100-TQFP
100
2160
66
9 kB
1.2 V
CMOS
14 mm
LCMXO2-2000HC-4TG100I
VS
XC3S100E-4VQG100C
- XC3S100E-4VQG100IXilinx Inc.
100-TQFP
100
2160
66
9 kB
1.2 V
CMOS
14 mm
LCMXO2-2000HC-4TG100I
VS
XC3S100E-4VQG100I
- XC3S100E-5VQG100CXilinx Inc.
100-TQFP
100
2160
66
9 kB
1.2 V
CMOS
14 mm
LCMXO2-2000HC-4TG100I
VS
XC3S100E-5VQG100C
- LCMXO2280E-3TN100CLattice Semiconductor Corporation
100-LQFP
100
2280
73
-
1.2 V
CMOS
14 mm
LCMXO2-2000HC-4TG100I
VS
LCMXO2280E-3TN100C
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After the electronic components have passed the quality inspection of Aztec Electronics, there are generally the following five packaging forms for electronic components: Tape, Tube, Tray, Bulk and Ammo.
Tape/Reel | Tube | Tray | Bulk | Ammo |
Weave bulk chips into tapes and pack them into reels through SMD components packaging Tape Machine. Reel is the most commonly used. | When packaging, arrange the components in the same direction and put them into plastic tubes one at a time. | Choose tray package with the same specifications as the original manufacturer, put the components into the tray and use the strapping machine. | Bulk packaging means that the SMD components are freely packaged in a formed plastic box or bag. | Adhesive tape cut continuously in predetermined quantities. The cut strips are placed in boxes for safekeeping. |
Choose electronic components that are vacuum-sealed against water, dust, moisture, oxidation, corrosion, and even UV or RF pollution.
How to pack electronic components in cartons?
1. Choose the right box for your electronic components2. Use anti-static bubble film protect electronic component
3. Put it into the box, no buffer dead corner, 360-degree package.
4. Labeled as fragile to ensure that the courier knows what needs to be done with the package.