Lattice Semiconductor Corporation LCMXO2-2000HC-4TG144I
LCMXO2-2000HC-4TG144I
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Lattice Semiconductor Corporation LCMXO2-2000HC-4TG144I information
Type
Parameter
Factory Lead Time
8 Weeks
Mount
Surface Mount
Mounting Type
Surface Mount
Package / Case
144-LQFP
Number of Pins
144
Operating Temperature
-40°C~100°C TJ
Packaging
Tray
Published
2000
Series
MachXO2
JESD-609 Code
e3
Pbfree Code
yes
Part Status
Active
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Number of Terminations
144
ECCN Code
EAR99
Terminal Finish
Matte Tin (Sn)
HTS Code
8542.39.00.01
Subcategory
Field Programmable Gate Arrays
Technology
CMOS
Voltage - Supply
2.375V~3.465V
Terminal Position
QUAD
Terminal Form
GULL WING
Peak Reflow Temperature (Cel)
260
Supply Voltage
2.5V
Terminal Pitch
0.5mm
Frequency
269MHz
Reflow Temperature-Max (s)
30
Base Part Number
LCMXO2-2000
Pin Count
144
Number of Outputs
112
Operating Supply Voltage
2.5V
Power Supplies
2.5/3.3V
Memory Size
21.3kB
Operating Supply Current
82μA
Number of I/O
111
RAM Size
9.3kB
Memory Type
FLASH
Propagation Delay
7.24 ns
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells
2112
Total RAM Bits
75776
Number of LABs/CLBs
264
Number of Macro Cells
1056
Height
1.4mm
Length
20mm
Width
20mm
Radiation Hardening
No
REACH SVHC
No SVHC
RoHS Status
ROHS3 Compliant
Lead Free
Lead Free
- Datasheets :
- PCN Design/Specification :
- PCN Assembly/Origin :
- PCN Packaging :
- PCN Other :
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LCMXO2-2000HC-4TG144I Overview
Fpga chips is supplied in the 144-LQFP package. A FIELD PROGRAMMABLE GATE ARRAY-based FPGA is one of these types. The device has 111 I/O ports for more coherent data transfer. Logic elements/cells form the fundamental building block of a computer. Power is provided by a 2.5V-volt supply. FPGA parts like this belong to the Field Programmable Gate Arrays family. The Surface Mount-slot on the development board allows you to attach the FPGA module. Fpga chips operates wFpga chipsh a supply voltage of 2.375V~3.465V. An FPGA belonging to the MachXO2 series is referred to as an FPGA. The operating temperature should be kept at -40°C~100°C TJ when operating. This device is equipped with 112 separate outputs, which makes it a very versatile device. As a result of space limitations, this FPGA model has been included in Tray. There are a total of 144 terminations. There are 75776 RAM bits that are available with this device. In order to find related parts, use the part number LCMXO2-2000 as a base. The RAM si9.3kBe of this FPGA module reaches 9.3kB to ensure normal operation of the program. There are 144 pins on this device. This FPGA is built as an array of 264 LABs/CLBs. Having stated that, if this FPGA is mounted in Surface Mount, then it may be able to perform fantastically according to its specifications. When operating with the supply voltage of 2.5V, designers can fully make use of its flexibility. It is powered by a 2.5/3.3V battery, which can be purchased separately. A total of 144 pins are included in this device. Data and programs can be stored in this FPGA module's 21.3kB memory. The high efficiency of this device is provided by its 269MHz-frequency operation. In order to operate this device, a supply current of 82μA is used. Fpga circuit is important to note that the main building blocks of a CPLD in this device are 1056 macrocells. Adapted for storing data, the FLASH memory avoids resource conflicts.
LCMXO2-2000HC-4TG144I Features
111 I/Os
Up to 75776 RAM bits
144 LABs/CLBs
Operating from a frequency of 269MHz
LCMXO2-2000HC-4TG144I Applications
There are a lot of Lattice Semiconductor Corporation LCMXO2-2000HC-4TG144I FPGAs applications.
- Bioinformatics
- Device controllers
- Medical ultrasounds
- Audio
- Automotive
- Automotive advanced driver assistance systems (ADAS)
- Software-defined radios
- Broadcast
- Video & Image Processing
- Industrial Ethernet
- ImagePart NumberManufacturerPackage / CaseNumber of PinsNumber of Logic Elements/CellsNumber of I/ORAM SizeSupply VoltageMounting Type[email protected] Reflow Temperature-Max (s)View Compare
LCMXO2-2000HC-4TG144I
Lattice Semiconductor Corporation144-LQFP
144
2112
111
9.3 kB
2.5 V
Surface Mount
30
XC3S100E-4TQG144CXilinx Inc.144-LQFP
144
2160
108
9 kB
1.2 V
Surface Mount
30
LCMXO2-2000HC-4TG144I
VS
XC3S100E-4TQG144C
- XC3S50-4TQG144CXilinx Inc.
144-LQFP
144
1728
97
9 kB
1.2 V
Surface Mount
30
LCMXO2-2000HC-4TG144I
VS
XC3S50-4TQG144C
- XC3S50-5TQG144CXilinx Inc.
144-LQFP
144
1728
97
9 kB
1.2 V
Surface Mount
30
LCMXO2-2000HC-4TG144I
VS
XC3S50-5TQG144C
- LFEC1E-3T144CLattice Semiconductor Corporation
144-LQFP
144
1500
97
2.3 kB
1.2 V
Surface Mount
30
LCMXO2-2000HC-4TG144I
VS
LFEC1E-3T144C
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After the electronic components have passed the quality inspection of Aztec Electronics, there are generally the following five packaging forms for electronic components: Tape, Tube, Tray, Bulk and Ammo.
Tape/Reel | Tube | Tray | Bulk | Ammo |
Weave bulk chips into tapes and pack them into reels through SMD components packaging Tape Machine. Reel is the most commonly used. | When packaging, arrange the components in the same direction and put them into plastic tubes one at a time. | Choose tray package with the same specifications as the original manufacturer, put the components into the tray and use the strapping machine. | Bulk packaging means that the SMD components are freely packaged in a formed plastic box or bag. | Adhesive tape cut continuously in predetermined quantities. The cut strips are placed in boxes for safekeeping. |
Choose electronic components that are vacuum-sealed against water, dust, moisture, oxidation, corrosion, and even UV or RF pollution.
How to pack electronic components in cartons?
1. Choose the right box for your electronic components2. Use anti-static bubble film protect electronic component
3. Put it into the box, no buffer dead corner, 360-degree package.
4. Labeled as fragile to ensure that the courier knows what needs to be done with the package.
