Microsemi Corporation M2GL010-1VF400
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Microsemi Corporation M2GL010-1VF400 information
Type
Parameter
Factory Lead Time
12 Weeks
Lifecycle Status
IN PRODUCTION (Last Updated: 3 weeks ago)
Mounting Type
Surface Mount
Package / Case
400-LFBGA
Surface Mount
YES
Number of Pins
400
Operating Temperature
0°C~85°C TJ
Packaging
Tray
Published
2013
Series
IGLOO2
Part Status
Active
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Number of Terminations
400
HTS Code
8542.39.00.01
Subcategory
Field Programmable Gate Arrays
Voltage - Supply
1.14V~2.625V
Terminal Position
BOTTOM
Terminal Form
BALL
Peak Reflow Temperature (Cel)
240
Supply Voltage
1.2V
Terminal Pitch
0.8mm
Reflow Temperature-Max (s)
20
Base Part Number
M2GL010
Number of Outputs
195
Qualification Status
Not Qualified
Power Supplies
1.2V
Number of I/O
195
RAM Size
114kB
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells
12084
Total RAM Bits
933888
Height Seated (Max)
1.51mm
Length
17mm
Width
17mm
RoHS Status
Non-RoHS Compliant
- Datasheets :
- PCN Design/Specification :
M2GL010-1VF400 Overview
There are two packages that contain fpga chips: 400-LFBGA package and X package. The FIELD PROGRAMMABLE GATE ARRAY-series of FPGAs are composed of this type. A total of 195 I/Os are programmed to ensure a more coherent data transfer. A fundamental building block is made up of 12084 logic elements/cells. 1.2V volts power it. The Field Programmable Gate Arrays family of FPGAs includes this part. The Surface Mount-slot connector on the FPGA module can be connected to the development board. This device is powered by a 1.14V~2.625V battery. This is a type of FPGA that is part of the IGLOO2 series of FPGAs. Fpga chips is recommended that the operating temperature be kept wFpga chipshin the range 0°C~85°C TJ while the machine is operating. In order to make this device as versatile as possible, there are 195 different outputs included. In order to save space, this FPGA model has been contained in Tray. 400 terminations are present in total. A device like this one offers 933888 RAM bits, which is a considerable amount of memory. M2GL010 is the base part number that can be used to identify related parts. This FPGA module has a RAM si114kBe of 114kB that is sufficient to make sure that the program is able to run normally. 400 pins are designed into the device. The device runs on a 1.2V battery and requires no additional power supply to operate.
M2GL010-1VF400 Features
195 I/Os
Up to 933888 RAM bits
400 LABs/CLBs
M2GL010-1VF400 Applications
There are a lot of Microsemi Corporation M2GL010-1VF400 FPGAs applications.
- Industrial,Medical and Scientific Instruments
- Filtering and communication encoding
- High Performance Computing
- Voice recognition
- Data center hardware accelerators
- Computer hardware emulation
- Artificial intelligence (AI)
- Random logic
- Camera time adjustments
- Embedded Vision
- ImagePart NumberManufacturerPackage / CaseNumber of PinsNumber of Logic Elements/CellsNumber of I/ORAM SizeSupply VoltageTerminal PositionSubcategoryView Compare
M2GL010-1VF400
Microsemi Corporation400-LFBGA
400
12084
195
114 kB
1.2 V
BOTTOM
Field Programmable Gate Arrays
XC6SLX16-2CSG324CXilinx Inc.324-LFBGA, CSPBGA
324
14579
232
72 kB
1.2 V
BOTTOM
Field Programmable Gate Arrays
M2GL010-1VF400
VS
XC6SLX16-2CSG324C
- M2GL010T-VF400Microsemi Corporation
400-LFBGA
400
12084
195
114 kB
1.2 V
BOTTOM
Field Programmable Gate Arrays
M2GL010-1VF400
VS
M2GL010T-VF400
- M2GL010-VFG400Microsemi Corporation
400-LFBGA
400
12084
195
114 kB
1.2 V
BOTTOM
Field Programmable Gate Arrays
M2GL010-1VF400
VS
M2GL010-VFG400
- M2GL010T-VFG400Microsemi Corporation
400-LFBGA
400
12084
195
114 kB
1.2 V
BOTTOM
Field Programmable Gate Arrays
M2GL010-1VF400
VS
M2GL010T-VFG400
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2.Are the Microsemi's M2GL010-1VF400 price and stock displayed on the website accurate?
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After the electronic components have passed the quality inspection of Aztec Electronics, there are generally the following five packaging forms for electronic components: Tape, Tube, Tray, Bulk and Ammo.
Tape/Reel | Tube | Tray | Bulk | Ammo |
Weave bulk chips into tapes and pack them into reels through SMD components packaging Tape Machine. Reel is the most commonly used. | When packaging, arrange the components in the same direction and put them into plastic tubes one at a time. | Choose tray package with the same specifications as the original manufacturer, put the components into the tray and use the strapping machine. | Bulk packaging means that the SMD components are freely packaged in a formed plastic box or bag. | Adhesive tape cut continuously in predetermined quantities. The cut strips are placed in boxes for safekeeping. |
Choose electronic components that are vacuum-sealed against water, dust, moisture, oxidation, corrosion, and even UV or RF pollution.
How to pack electronic components in cartons?
1. Choose the right box for your electronic components2. Use anti-static bubble film protect electronic component
3. Put it into the box, no buffer dead corner, 360-degree package.
4. Labeled as fragile to ensure that the courier knows what needs to be done with the package.
