Lattice Semiconductor Corporation LCMXO2280C-3FT324C
LCMXO2280C-3FT324C
Lattice Semiconductor Corporation LCMXO2280C-3FT324C information
Type
Parameter
Mount
Surface Mount
Mounting Type
Surface Mount
Package / Case
324-LBGA
Number of Pins
324
Operating Temperature
0°C~85°C TJ
Packaging
Tray
Published
2009
Series
MachXO
JESD-609 Code
e0
Pbfree Code
no
Part Status
Obsolete
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Number of Terminations
324
ECCN Code
EAR99
Terminal Finish
Tin/Lead (Sn63Pb37)
Additional Feature
IT CAN ALSO OPERATE AT 2.5V AND 3.3V
HTS Code
8542.39.00.01
Subcategory
Field Programmable Gate Arrays
Technology
CMOS
Voltage - Supply
1.71V~3.465V
Terminal Position
BOTTOM
Terminal Form
BALL
Peak Reflow Temperature (Cel)
225
Supply Voltage
1.8V
Terminal Pitch
1mm
Reach Compliance Code
not_compliant
Reflow Temperature-Max (s)
30
Base Part Number
LCMXO2280
Pin Count
324
Number of Outputs
271
Qualification Status
Not Qualified
Operating Supply Voltage
3.3V
Operating Supply Current
23mA
Number of I/O
271
Nominal Supply Current
23mA
Memory Type
SRAM
Propagation Delay
5.1 ns
Turn On Delay Time
5.1 ns
Programmable Logic Type
FLASH PLD
Number of Logic Elements/Cells
2280
Total RAM Bits
28262
Max Frequency
500MHz
Number of LABs/CLBs
285
Output Function
MACROCELL
Number of Macro Cells
1140
Number of Dedicated Inputs
7
Height Seated (Max)
1.7mm
Length
19mm
Width
19mm
RoHS Status
Non-RoHS Compliant
Lead Free
Lead Free
- Datasheets :
- PCN Obsolescence/ EOL :
- PCN Assembly/Origin :
- PCN Packaging :
- ConflictMineralStatement :
LCMXO2280C-3FT324C Overview
The package that contains this software is called 324-LBGA. There are FLASH PLD transistors in this type of FPGA. The I/Os are designed to facilitate a more coherent transfer of data. The basic building blocks of logic contain 2280 logic elements/cells. Fpga chips is powered from a supply voltage of 1.8V. FPGA parts like this belong to the Field Programmable Gate Arrays family. The Surface Mount-slot connector on the FPGA module can be connected to the development board. There is a 1.71V~3.465V-volt supply voltage required for the device to operate. The MachXO Series is one of the types of FPGAs that belong to this type. The operating temperature should be kept at 0°C~85°C TJ when operating. The device has 271 outputs that are integrated into it. As a result of space limitations, this FPGA model has been included in Tray. 324 terminations are present in total. There are 28262 RAM bits that are available with this device. In order to find related parts, use the part number LCMXO2280 as a base. Fpga electronics is designed wfpga electronics h 324 pins. This FPGA is built as an array of 285 LABs/CLBs. According to its specifications, this FPGA will be able to work fantastically as long as it is mounted in Surface Mount. Design engineers can fully take advantage of its flexibility when operating at 3.3V supply voltage. This device has a pin count of 324 in fpga semiconductor. Fpga semiconductor is possible for this FPGA to reach speeds of up to 500MHz. A 23mA supply current is used for its operation. The IT CAN ALSO OPERATE AT 2.5V AND 3.3V feature is also characteristic of fpga circuit. To determine the status of the input signals, 7 dedicated inputs are available in the system. As the main building blocks of a CPLD, 1140 macro cells make up the majority of the circuit in this device. In the SRAM memory, data is stored safely and resource conflicts are avoided.
LCMXO2280C-3FT324C Features
271 I/Os
Up to 28262 RAM bits
324 LABs/CLBs
LCMXO2280C-3FT324C Applications
There are a lot of Lattice Semiconductor Corporation LCMXO2280C-3FT324C FPGAs applications.
- Software-defined radios
- Space Applications
- Medical imaging
- DO-254
- Embedded Vision
- Audio
- Electronic Warfare
- Aerospace and Defense
- Data Mining
- Automotive advanced driver assistance systems (ADAS)
- ImagePart NumberManufacturerNumber of PinsPropagation DelayNumber of Macro CellsNumber of I/OMemory TypeMax FrequencySupply VoltageTechnologyView Compare
LCMXO2280C-3FT324C
Lattice Semiconductor Corporation324
5.1 ns
1140
271
SRAM
500 MHz
1.8 V
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LCMXO640C-3FT256CLattice Semiconductor Corporation256
4.9 ns
320
159
SRAM
500 MHz
1.8 V
CMOS
LCMXO2280C-3FT324C
VS
LCMXO640C-3FT256C
- LCMXO1200C-3FT256ILattice Semiconductor Corporation
256
5.1 ns
600
211
SRAM
500 MHz
1.8 V
CMOS
LCMXO2280C-3FT324C
VS
LCMXO1200C-3FT256I
- LCMXO640C-3FT256ILattice Semiconductor Corporation
256
4.9 ns
320
159
SRAM
500 MHz
1.8 V
CMOS
LCMXO2280C-3FT324C
VS
LCMXO640C-3FT256I
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1. Understand the shipping rules of the destination country
Different countries have different regulations for shipping electronic equipment, check for certain certifications, and read the destination country's guidelines before shipping to prevent delays or confiscation of goods by customs.
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If electronic component in stock, it is usually shipped before 5 o'clock on the same day, and it usually takes 5-10 working days to complete it by international express.
If it is a scheduled component, it needs to wait for the arrival of the parts, and then it will be inspected before delivery. If there are special circumstances, the sales staff will confirm with you. Weekends and holidays will also affect the delivery time of electronic products.
1. We provide 365 days warranty for all electronic components.
2. If you need a test report, please let us know. We have a long-term cooperative testing laboratory. If you have familiar testing laboratory, we can also ship to your designated laboratory for testing.
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Distributors, free market, 48 global large-scale OEM factories in close contact with us (Great Price advantage, 100% original)
2.Are the Lattice Semiconductor's LCMXO2280C-3FT324C price and stock displayed on the website accurate?
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You Also Ask
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Need Any Service, please feel free contact us.
After the electronic components have passed the quality inspection of Aztec Electronics, there are generally the following five packaging forms for electronic components: Tape, Tube, Tray, Bulk and Ammo.
Tape/Reel | Tube | Tray | Bulk | Ammo |
Weave bulk chips into tapes and pack them into reels through SMD components packaging Tape Machine. Reel is the most commonly used. | When packaging, arrange the components in the same direction and put them into plastic tubes one at a time. | Choose tray package with the same specifications as the original manufacturer, put the components into the tray and use the strapping machine. | Bulk packaging means that the SMD components are freely packaged in a formed plastic box or bag. | Adhesive tape cut continuously in predetermined quantities. The cut strips are placed in boxes for safekeeping. |
Choose electronic components that are vacuum-sealed against water, dust, moisture, oxidation, corrosion, and even UV or RF pollution.
How to pack electronic components in cartons?
1. Choose the right box for your electronic components2. Use anti-static bubble film protect electronic component
3. Put it into the box, no buffer dead corner, 360-degree package.
4. Labeled as fragile to ensure that the courier knows what needs to be done with the package.
