Xilinx Inc. XCF32PVOG48C
XCF32PVOG48C
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Xilinx Inc. XCF32PVOG48C information
Type
Parameter
Factory Lead Time
10 Weeks
Mount
Surface Mount
Mounting Type
Surface Mount
Package / Case
48-TFSOP (0.724, 18.40mm Width)
Number of Pins
48
Operating Temperature
-40°C~85°C
Packaging
Tray
Published
1999
JESD-609 Code
e3
Pbfree Code
yes
Part Status
Active
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Number of Terminations
48
ECCN Code
3A991.B.1
Terminal Finish
Matte Tin (Sn)
HTS Code
8542.32.00.61
Subcategory
Flash Memories
Technology
CMOS
Voltage - Supply
1.65V~2V
Terminal Position
DUAL
Terminal Form
GULL WING
Peak Reflow Temperature (Cel)
260
Number of Functions
1
Supply Voltage
1.8V
Terminal Pitch
0.5mm
Reflow Temperature-Max (s)
30
Base Part Number
XCF*P
Pin Count
48
Operating Supply Voltage
1.8V
Supply Voltage-Max (Vsup)
2V
Supply Voltage-Min (Vsup)
1.65V
Programmable Type
In System Programmable
Memory Size
32Mb
Supply Current-Max
0.04mA
Organization
32MX1
Standby Current-Max
0.001A
Memory Density
33554432 bit
Parallel/Serial
SERIAL
Memory IC Type
CONFIGURATION MEMORY
Endurance
20000 Write/Erase Cycles
Data Retention Time-Min
20
Height
1mm
Length
12.1mm
Width
18.5mm
Radiation Hardening
No
RoHS Status
ROHS3 Compliant
Lead Free
Lead Free
- Datasheets :
- Environmental Information :
- PCN Packaging :
XCF32PVOG48C Overview
There is a neat 48-TFSOP (0.724, 18.40mm Width) package that is used in this program.Packaging for Tray.-40°C~85°C license holder.In System Programmable is the program that allows it to be programmed.An electric current of 1.65V~2V is applied to it.This memory device is mounted in Surface Mount.A data storage size of 32Mb is allowed.To find other similar parts, search for "XCF*P".1.8V is the voltage it requires as a supply.With different functions, 48 terminations can be used.As long as the maximum voltage of the memory device is 2V, then the memory device can be used.1.65V must be the minimum voltage supplied to the device.Using CONFIGURATION MEMORY memory chips, this is what you get.If you're reflow soldering, you shouldn't go above 260.There are 48 pins on it.By using SERIAL-processing, data can be transmitted through this memory in a secure manner.A memory chip can operate at a voltage no greater than 0.04mA.Parts come with 48 pins set.To run the part safely and stably in a circuit, 1.8V recommends users apply 1.8V on the part.For applications involving Surface Mount, it is suitable.In specific, it can be described as a form of Flash Memories.
XCF32PVOG48C Features
Operating temperature: -40°C~85°C.
In System Programmable program capability.
CONFIGURATION MEMORY memory IC.
SERIAL processing.
XCF32PVOG48C Applications
There are a lot of Xilinx Inc. XCF32PVOG48C applications of configuration proms for FPGAs.
- graphics card
- Camcorders
- servers
- networks
- mainframes
- hard disk drive (HDD)
- multimedia computers
- eDRAM
- printers
- main computer memory
- ImagePart NumberManufacturerPackage / CaseNumber of PinsMemory IC TypeMemory SizeSupply VoltageTerminal PitchSupply Voltage-Min (Vsup)PublishedView Compare
XCF32PVOG48C
Xilinx Inc.48-TFSOP (0.724, 18.40mm Width)
48
CONFIGURATION MEMORY
32Mb
1.8 V
0.5 mm
1.65 V
1999
- XCF16PVOG48CXilinx Inc.
48-TFSOP (0.724, 18.40mm Width)
48
-
16Mb
1.8 V
0.5 mm
1.65 V
1999
XCF32PVOG48C
VS
XCF16PVOG48C
- XCF08PVOG48CXilinx Inc.
48-TFSOP (0.724, 18.40mm Width)
48
-
8Mb
1.8 V
0.5 mm
1.65 V
1999
XCF32PVOG48C
VS
XCF08PVOG48C
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After the electronic components have passed the quality inspection of Aztec Electronics, there are generally the following five packaging forms for electronic components: Tape, Tube, Tray, Bulk and Ammo.
Tape/Reel | Tube | Tray | Bulk | Ammo |
Weave bulk chips into tapes and pack them into reels through SMD components packaging Tape Machine. Reel is the most commonly used. | When packaging, arrange the components in the same direction and put them into plastic tubes one at a time. | Choose tray package with the same specifications as the original manufacturer, put the components into the tray and use the strapping machine. | Bulk packaging means that the SMD components are freely packaged in a formed plastic box or bag. | Adhesive tape cut continuously in predetermined quantities. The cut strips are placed in boxes for safekeeping. |
Choose electronic components that are vacuum-sealed against water, dust, moisture, oxidation, corrosion, and even UV or RF pollution.
How to pack electronic components in cartons?
1. Choose the right box for your electronic components2. Use anti-static bubble film protect electronic component
3. Put it into the box, no buffer dead corner, 360-degree package.
4. Labeled as fragile to ensure that the courier knows what needs to be done with the package.
