Xilinx Inc. XC18V02VQG44C
XC18V02VQG44C
In Stock:94131
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Unit Price
Ext Price
1
$24.600000
$24.600000
10
$23.208000
$232.080000
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Xilinx Inc. XC18V02VQG44C information
Type
Parameter
Factory Lead Time
10 Weeks
Mounting Type
Surface Mount
Package / Case
44-TQFP
Surface Mount
YES
Number of Pins
44
Operating Temperature
0°C~70°C
Packaging
Tray
Published
1999
JESD-609 Code
e3
Pbfree Code
yes
Part Status
Active
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Number of Terminations
44
ECCN Code
EAR99
Terminal Finish
Matte Tin (Sn)
HTS Code
8542.32.00.51
Subcategory
Flash Memories
Technology
CMOS
Voltage - Supply
3V~3.6V
Terminal Position
QUAD
Terminal Form
GULL WING
Peak Reflow Temperature (Cel)
260
Number of Functions
1
Supply Voltage
3.3V
Terminal Pitch
0.8mm
Reflow Temperature-Max (s)
30
Base Part Number
XC18V02
Pin Count
44
Operating Supply Voltage
3.3V
Supply Voltage-Max (Vsup)
3.6V
Supply Voltage-Min (Vsup)
3V
Programmable Type
In System Programmable
Clock Frequency
20MHz
Supply Current-Max
0.025mA
Organization
256KX8
Memory Width
8
Density
2 Mb
Standby Current-Max
0.01A
Access Time (Max)
20 ns
Parallel/Serial
PARALLEL/SERIAL
Memory IC Type
CONFIGURATION MEMORY
Endurance
20000 Write/Erase Cycles
Data Retention Time-Min
20
Height Seated (Max)
1.2mm
Length
10mm
Width
10mm
Radiation Hardening
No
RoHS Status
ROHS3 Compliant
- Datasheets :
- Environmental Information :
- PCN Obsolescence/ EOL :
- PCN Part Status Change :
XC18V02VQG44C Overview
44-TQFP is used in this package.Packing on the outside is Tray.0°C~70°C-qualified.FPGA is programmable through In System Programmable.With a voltage of 3V~3.6V, it is powered.This memory device is mounted in Surface Mount.For other related parts, search "XC18V02".Supply voltage 3.3V is required.Different types of 44 terminations are available with different functions.This memory device can be used with a maximum voltage of 3.6V.To supply the device, a minimum voltage of 3V is a must.This is a CONFIGURATION MEMORY memory chip.In reflow soldering procedure, the temperature should be controlled to no higher than 260.FPGA has 44 pins.Through PARALLEL/SERIAL-processing, data is transmitted from this memory to the CPU.An operating voltage of 0.025mA is allowed for the memory chip.The part comes with a set of 44 pins.I think it's important to point out that this is a memory IC that has a 20MHz frequency that can be operated at.In order for the part to function safely and reliably as part of a circuit, 3.3V recommends that users apply 3.3V to the part prior to use in order to ensure that it will work properly.In more specific terms, it is a type of Flash Memories.
XC18V02VQG44C Features
Operating temperature: 0°C~70°C.
In System Programmable program capability.
CONFIGURATION MEMORY memory IC.
PARALLEL/SERIAL processing.
XC18V02VQG44C Applications
There are a lot of Xilinx Inc. XC18V02VQG44C applications of configuration proms for FPGAs.
- main computer memory
- hard disk drive (HDD)
- telecommunications
- embedded logic
- mainframes
- printers
- servers
- eSRAM
- networking
- workstations,
- ImagePart NumberManufacturerPackage / CaseNumber of PinsMemory IC TypeDensitySupply VoltageRoHS StatusTerminal PitchView Compare
XC18V02VQG44C
Xilinx Inc.44-TQFP
44
CONFIGURATION MEMORY
2 Mb
3.3 V
ROHS3 Compliant
0.8 mm
CY7C1011CV33-12AXICypress Semiconductor Corp44-LQFP
44
-
2 Mb
3.3 V
ROHS3 Compliant
0.8 mm
XC18V02VQG44C
VS
CY7C1011CV33-12AXI
- CY7C1011CV33-12AXITCypress Semiconductor Corp
44-LQFP
44
-
2 Mb
3.3 V
ROHS3 Compliant
0.8 mm
XC18V02VQG44C
VS
CY7C1011CV33-12AXIT
AT17LV002-10TQUMicrochip Technology44-TQFP
44
-
2 Mb
3.3 V
ROHS3 Compliant
0.8 mm
XC18V02VQG44C
VS
AT17LV002-10TQU
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After the electronic components have passed the quality inspection of Aztec Electronics, there are generally the following five packaging forms for electronic components: Tape, Tube, Tray, Bulk and Ammo.
Tape/Reel | Tube | Tray | Bulk | Ammo |
Weave bulk chips into tapes and pack them into reels through SMD components packaging Tape Machine. Reel is the most commonly used. | When packaging, arrange the components in the same direction and put them into plastic tubes one at a time. | Choose tray package with the same specifications as the original manufacturer, put the components into the tray and use the strapping machine. | Bulk packaging means that the SMD components are freely packaged in a formed plastic box or bag. | Adhesive tape cut continuously in predetermined quantities. The cut strips are placed in boxes for safekeeping. |
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