Xilinx Inc. XCF04SVOG20C
XCF04SVOG20C
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Xilinx Inc. XCF04SVOG20C information
Type
Parameter
Factory Lead Time
13 Weeks
Mount
Surface Mount
Mounting Type
Surface Mount
Package / Case
20-TSSOP (0.173, 4.40mm Width)
Number of Pins
20
Operating Temperature
-40°C~85°C
Packaging
Tube
Published
1999
JESD-609 Code
e3
Pbfree Code
yes
Part Status
Active
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Number of Terminations
20
ECCN Code
EAR99
Terminal Finish
Matte Tin (Sn)
HTS Code
8542.32.00.51
Technology
CMOS
Voltage - Supply
3V~3.6V
Terminal Position
DUAL
Terminal Form
GULL WING
Peak Reflow Temperature (Cel)
260
Number of Functions
1
Supply Voltage
3.3V
Terminal Pitch
0.65mm
Reflow Temperature-Max (s)
30
Base Part Number
XCF*S
Pin Count
20
Operating Supply Voltage
3.3V
Supply Voltage-Max (Vsup)
3.6V
Supply Voltage-Min (Vsup)
3V
Programmable Type
In System Programmable
Interface
Parallel, Serial
Memory Size
4Mb
Memory Type
FLASH
Clock Frequency
33MHz
Supply Current-Max
0.01mA
Organization
4MX1
Standby Current-Max
0.001A
Memory Density
4194304 bit
Data Retention Time-Min
20
Height
1.04mm
Length
6.5mm
Width
4.39mm
Radiation Hardening
No
REACH SVHC
Unknown
RoHS Status
ROHS3 Compliant
Lead Free
Lead Free
- Datasheets :
- Environmental Information :
- PCN Assembly/Origin :
XCF04SVOG20C Overview
The package uses a neat 20-TSSOP (0.173, 4.40mm Width) interface.Packaging for external use.As a qualified employee, I can operate within -40°C~85°C.Using In System Programmable, you can program it.The voltage fed to it is 3V~3.6V.Surface Mount is the mounting position of this memory device.4Mb is the maximum storage size.For other related parts, search "XCF*S".The supply voltage is 3.3V.20 terminations with different functions.This memory device can be used with a maximum voltage of 3.6V.If the device needs to be supplied with power, then a minimum voltage of 3V is required.When soldering in reflow mode, the temperature should be kept below 260 at all times during the soldering process.A 20 pin is included in it.The memory chip operates at a voltage of no more than 0.01mA.In the package, you will find a set of 20 pins.I would like to mention that this is a memory IC that will be able to work at a 33MHz frequency, so I will mention that.The 3.3V company recommends that users apply 3.3V to the part before using it in a circuit so that it can run safely and reliably in the circuit.An example of a FLASH memory.A Surface Mount application can be made with it.
XCF04SVOG20C Features
Operating temperature: -40°C~85°C.
In System Programmable program capability.
FLASH memory
XCF04SVOG20C Applications
There are a lot of Xilinx Inc. XCF04SVOG20C applications of configuration proms for FPGAs.
personal computers
networking
eDRAM
nonvolatile BIOS memory
embedded logic
workstations,
Cache memory
supercomputers
servers
telecommunications
- ImagePart NumberManufacturerPackage / CaseNumber of PinsInterfaceMemory TypeMemory SizeSupply VoltageTechnologyTerminal PositionView Compare
XCF04SVOG20C
Xilinx Inc.20-TSSOP (0.173, 4.40mm Width)
20
Parallel, Serial
FLASH
4Mb
3.3 V
CMOS
DUAL
STM32F030F4P6STMicroelectronics20-TSSOP (0.173, 4.40mm Width)
20
I2C, SPI, UART, USART
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3.3 V
CMOS
DUAL
XCF04SVOG20C
VS
STM32F030F4P6
- STM32F030F4P6TRSTMicroelectronics
20-TSSOP (0.173, 4.40mm Width)
20
I2C, SPI, UART, USART
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3.3 V
CMOS
DUAL
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VS
STM32F030F4P6TR
- XCF02SVOG20CXilinx Inc.
20-TSSOP (0.173, 4.40mm Width)
20
Parallel
FLASH
2Mb
3.3 V
CMOS
DUAL
XCF04SVOG20C
VS
XCF02SVOG20C
- XCF01SVOG20CXilinx Inc.
20-TSSOP (0.173, 4.40mm Width)
20
Parallel, Serial
FLASH
1Mb
3.3 V
CMOS
DUAL
XCF04SVOG20C
VS
XCF01SVOG20C
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Tape/Reel | Tube | Tray | Bulk | Ammo |
Weave bulk chips into tapes and pack them into reels through SMD components packaging Tape Machine. Reel is the most commonly used. | When packaging, arrange the components in the same direction and put them into plastic tubes one at a time. | Choose tray package with the same specifications as the original manufacturer, put the components into the tray and use the strapping machine. | Bulk packaging means that the SMD components are freely packaged in a formed plastic box or bag. | Adhesive tape cut continuously in predetermined quantities. The cut strips are placed in boxes for safekeeping. |
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