Xilinx Inc. XC18V04VQG44C
XC18V04VQG44C
In Stock:94131
Qty
Unit Price
Ext Price
1
$46.860000
$46.860000
10
$44.205000
$442.050000
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Xilinx Inc. XC18V04VQG44C information
Type
Parameter
Factory Lead Time
10 Weeks
Mount
Surface Mount
Mounting Type
Surface Mount
Package / Case
44-TQFP
Number of Pins
44
Operating Temperature
0°C~70°C
Packaging
Tray
Published
1999
JESD-609 Code
e3
Pbfree Code
yes
Part Status
Active
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Number of Terminations
44
ECCN Code
EAR99
Terminal Finish
Matte Tin (Sn)
HTS Code
8542.32.00.51
Subcategory
Flash Memories
Technology
CMOS
Voltage - Supply
3V~3.6V
Terminal Position
QUAD
Terminal Form
GULL WING
Peak Reflow Temperature (Cel)
260
Number of Functions
1
Supply Voltage
3.3V
Terminal Pitch
0.8mm
Reflow Temperature-Max (s)
30
Base Part Number
XC18V04
Pin Count
44
Qualification Status
Not Qualified
Operating Supply Voltage
3.3V
Supply Voltage-Max (Vsup)
3.6V
Supply Voltage-Min (Vsup)
3V
Programmable Type
In System Programmable
Interface
Parallel, Serial
Operating Mode
SYNCHRONOUS
Clock Frequency
20MHz
Supply Current-Max
0.025mA
Access Time
10 ns
Organization
512KX8
Density
4 Mb
Standby Current-Max
0.01A
Parallel/Serial
PARALLEL/SERIAL
Memory IC Type
CONFIGURATION MEMORY
Endurance
20000 Write/Erase Cycles
Data Retention Time-Min
20
Height
1mm
Length
10mm
Width
10mm
RoHS Status
ROHS3 Compliant
- Datasheets :
- Environmental Information :
- PCN Obsolescence/ EOL :
- PCN Part Status Change :
XC18V04VQG44C Overview
An interesting 44-TQFP package is used for this.The external packaging of Tray is made of Tray plastic.As a qualified employee, I can operate within 0°C~70°C.Using In System Programmable, you can program it.An electric current of 3V~3.6V is applied to it.The memory device is mounted in Surface Mount.In addition to this part, you can search "XC18V04" for other similar parts.Supply voltage 3.3V is required.Different types of 44 terminations are available with different functions.There is a maximum voltage of 3.6V that can be applied to this memory device.There must be a minimum voltage of 3V to supply the device with the power it needs.A CONFIGURATION MEMORY memory chip is shown here.If reflow soldering is being performed, the temperature should not be higher than 260 when soldering should be reflowed.A 44 pin is included in it.In this memory, data is transmitted using the PARALLEL/SERIAL process.The memory chip operates at a voltage of no more than 0.025mA.There is a set of 44 pins that are included with the part.There is a memory IC in this package that works at 20MHz frequencies.Before using the part in a circuit, it is recommended that the user apply 3.3V before the part is used in order to ensure that it runs safely and reliably in the circuit.Memory is suMemoryable for Surface Mount applications.The type of Flash Memories it is is specific.
XC18V04VQG44C Features
Operating temperature: 0°C~70°C.
In System Programmable program capability.
CONFIGURATION MEMORY memory IC.
PARALLEL/SERIAL processing.
XC18V04VQG44C Applications
There are a lot of Xilinx Inc. XC18V04VQG44C applications of configuration proms for FPGAs.
- mainframes
- nonvolatile BIOS memory
- supercomputers
- Camcorders
- personal computers
- embedded logic
- cell phones
- graphics card
- networks
- workstations,
- ImagePart NumberManufacturerPackage / CaseNumber of PinsMemory IC TypeDensityAccess TimeInterfaceSupply VoltageTerminal PitchView Compare
XC18V04VQG44C
Xilinx Inc.44-TQFP
44
CONFIGURATION MEMORY
4 Mb
10 ns
Parallel, Serial
3.3 V
0.8 mm
AT17LV040-10TQUMicrochip Technology44-TQFP
44
-
4 Mb
-
2-Wire, Serial
3.3 V
0.8 mm
XC18V04VQG44C
VS
AT17LV040-10TQU
CY7C1011CV33-12AXICypress Semiconductor Corp44-LQFP
44
-
2 Mb
-
-
3.3 V
0.8 mm
XC18V04VQG44C
VS
CY7C1011CV33-12AXI
- CY7C1011CV33-12AXITCypress Semiconductor Corp
44-LQFP
44
-
2 Mb
-
-
3.3 V
0.8 mm
XC18V04VQG44C
VS
CY7C1011CV33-12AXIT
72V251L15PFGIIntegrated Device Technology (IDT)TQFP
32
OTHER FIFO
72 kb
10 ns
-
3.3 V
0.8 mm
XC18V04VQG44C
VS
72V251L15PFGI
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After the electronic components have passed the quality inspection of Aztec Electronics, there are generally the following five packaging forms for electronic components: Tape, Tube, Tray, Bulk and Ammo.
Tape/Reel | Tube | Tray | Bulk | Ammo |
Weave bulk chips into tapes and pack them into reels through SMD components packaging Tape Machine. Reel is the most commonly used. | When packaging, arrange the components in the same direction and put them into plastic tubes one at a time. | Choose tray package with the same specifications as the original manufacturer, put the components into the tray and use the strapping machine. | Bulk packaging means that the SMD components are freely packaged in a formed plastic box or bag. | Adhesive tape cut continuously in predetermined quantities. The cut strips are placed in boxes for safekeeping. |
Choose electronic components that are vacuum-sealed against water, dust, moisture, oxidation, corrosion, and even UV or RF pollution.
How to pack electronic components in cartons?
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