Xilinx Inc. XC18V01VQG44C
XC18V01VQG44C
In Stock:94131
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Unit Price
Ext Price
1
$11.430000
$11.430000
10
$10.782000
$107.820000
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Xilinx Inc. XC18V01VQG44C information
Type
Parameter
Factory Lead Time
10 Weeks
Mounting Type
Surface Mount
Package / Case
44-TQFP
Surface Mount
YES
Number of Pins
44
Operating Temperature
0°C~70°C
Packaging
Tray
Published
1999
JESD-609 Code
e3
Pbfree Code
yes
Part Status
Active
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Number of Terminations
44
ECCN Code
EAR99
Terminal Finish
Matte Tin (Sn)
HTS Code
8542.32.00.51
Subcategory
Flash Memories
Technology
CMOS
Voltage - Supply
3V~3.6V
Terminal Position
QUAD
Terminal Form
GULL WING
Peak Reflow Temperature (Cel)
260
Number of Functions
1
Supply Voltage
3.3V
Terminal Pitch
0.8mm
Reflow Temperature-Max (s)
30
Base Part Number
XC18V01
Pin Count
44
Operating Supply Voltage
3.3V
Supply Voltage-Max (Vsup)
3.6V
Supply Voltage-Min (Vsup)
3V
Programmable Type
In System Programmable
Clock Frequency
33MHz
Supply Current-Max
0.025mA
Organization
128KX8
Memory Width
8
Density
1 Mb
Standby Current-Max
0.01A
Access Time (Max)
15 ns
Parallel/Serial
PARALLEL/SERIAL
Memory IC Type
CONFIGURATION MEMORY
Endurance
20000 Write/Erase Cycles
Data Retention Time-Min
20
Height Seated (Max)
1.2mm
Length
10mm
Width
10mm
Radiation Hardening
No
RoHS Status
ROHS3 Compliant
- Datasheets :
- Environmental Information :
- PCN Obsolescence/ EOL :
- PCN Part Status Change :
XC18V01VQG44C Overview
An interesting 44-TQFP package is used for this.Packaging for the external environment.A qualified individual who has the ability to operate within 0°C~70°C.Through In System Programmable, it is programmable.FPGA is powered by a voltage which is 3V~3.6V volts, and this voltage is the voltage from which the generator is powered.The memory device is mounted in the Surface Mount position.In addition to this part, you can search "XC18V01" for other similar parts.3.3V is the voltage it requires as a supply.There are different functions associated with 44 terminations.FPGA is possible to use this memory device at a maximum voltage of 3.6V.FPGA is imperative that the voltage of the device supply is at least 3V if the device is to work properly.Using the CONFIGURATION MEMORY memory chip, we can store data.Reflow soldering should be done at no higher than 260 degrees.44 pins are present.A PARALLEL/SERIAL-processing method is used to transfer data through this memory.The memory chip operates at a voltage of no more than 0.025mA.Parts come with 44 pins.I would like to mention that this is a memory IC that will be able to work at a 33MHz frequency, so I will mention that.Before using the part in a circuit, it is recommended that the user apply 3.3V before the part is used in order to ensure that it runs safely and reliably in the circuit.More specifically, it's a kind of Flash Memories.
XC18V01VQG44C Features
Operating temperature: 0°C~70°C.
In System Programmable program capability.
CONFIGURATION MEMORY memory IC.
PARALLEL/SERIAL processing.
XC18V01VQG44C Applications
There are a lot of Xilinx Inc. XC18V01VQG44C applications of configuration proms for FPGAs.
- cell phones
- main computer memory
- printers
- eDRAM
- hard disk drive (HDD)
- data buffer
- nonvolatile BIOS memory
- eSRAM
- supercomputers
- servers
- ImagePart NumberManufacturerPackage / CaseNumber of PinsMemory IC TypeDensitySupply VoltageRoHS StatusPbfree CodeTerminal PitchView Compare
XC18V01VQG44C
Xilinx Inc.44-TQFP
44
CONFIGURATION MEMORY
1 Mb
3.3 V
ROHS3 Compliant
yes
0.8 mm
CY7C1011CV33-12AXICypress Semiconductor Corp44-LQFP
44
-
2 Mb
3.3 V
ROHS3 Compliant
yes
0.8 mm
XC18V01VQG44C
VS
CY7C1011CV33-12AXI
- CY7C1011CV33-12AXITCypress Semiconductor Corp
44-LQFP
44
-
2 Mb
3.3 V
ROHS3 Compliant
yes
0.8 mm
XC18V01VQG44C
VS
CY7C1011CV33-12AXIT
AT17LV002-10TQUMicrochip Technology44-TQFP
44
-
2 Mb
3.3 V
ROHS3 Compliant
yes
0.8 mm
XC18V01VQG44C
VS
AT17LV002-10TQU
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Tape/Reel | Tube | Tray | Bulk | Ammo |
Weave bulk chips into tapes and pack them into reels through SMD components packaging Tape Machine. Reel is the most commonly used. | When packaging, arrange the components in the same direction and put them into plastic tubes one at a time. | Choose tray package with the same specifications as the original manufacturer, put the components into the tray and use the strapping machine. | Bulk packaging means that the SMD components are freely packaged in a formed plastic box or bag. | Adhesive tape cut continuously in predetermined quantities. The cut strips are placed in boxes for safekeeping. |
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