Xilinx Inc. XCF08PFSG48C
XCF08PFSG48C
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Xilinx Inc. XCF08PFSG48C information
Type
Parameter
Factory Lead Time
10 Weeks
Mount
Surface Mount
Mounting Type
Surface Mount
Package / Case
48-TFBGA, CSPBGA
Number of Pins
48
Operating Temperature
-40°C~85°C
Packaging
Tray
Published
1999
JESD-609 Code
e2
Pbfree Code
yes
Part Status
Active
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Number of Terminations
48
ECCN Code
EAR99
Terminal Finish
Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni)
HTS Code
8542.32.00.51
Technology
CMOS
Voltage - Supply
1.65V~2V
Terminal Position
BOTTOM
Terminal Form
BALL
Peak Reflow Temperature (Cel)
260
Number of Functions
1
Supply Voltage
1.8V
Frequency
50MHz
Reflow Temperature-Max (s)
30
Base Part Number
XCF*P
Pin Count
48
Operating Supply Voltage
1.8V
Supply Voltage-Max (Vsup)
2V
Supply Voltage-Min (Vsup)
1.65V
Programmable Type
In System Programmable
Interface
Parallel, Serial
Memory Size
8Mb
Memory Type
FLASH
Supply Current-Max
0.04mA
Organization
8MX1
Standby Current-Max
0.001A
Memory Density
8388608 bit
Endurance
20000 Write/Erase Cycles
Height
860μm
Length
9mm
Width
8mm
Radiation Hardening
No
REACH SVHC
Unknown
RoHS Status
ROHS3 Compliant
Lead Free
Lead Free
- Datasheets :
- Environmental Information :
- PCN Packaging :
XCF08PFSG48C Overview
FPGA uses a nice 48-TFBGA, CSPBGA package that makes FPGA easy to use.Packaging outside of Tray.In the state of -40°C~85°C, licensed to work.Using the In System Programmable axis, it can be programmed to do whatever you want.The voltage is 1.65V~2V.Mounted in Surface Mount is this memory device.Data storage is limited to 8Mb bytes.Other related parts can be found by searching "XCF*P".In order for it to function, it requires a voltage supply of 1.8V.A termination with different functions in the 48 axis.This memory device can be used with a maximum voltage of 2V.Minimum voltage 1.65V is required for the device to work.If you're reflow soldering, you shouldn't go above 260.In this case, it has 48 pins.The memory chip is allowed to operate at a voltage that is no greater than 0.04mA.Parts come with 48 pins.A 1.8V application is recommended before using the part in a circuit to ensure the part runs safely and reliably.This type of memory is called a FLASH memory.In addition, it is suitable for use in Surface Mount-based applications.Swicthing controllers work at 50MHz frequencies.
XCF08PFSG48C Features
Operating temperature: -40°C~85°C.
In System Programmable program capability.
FLASH memory
Frequency: 50MHz.
XCF08PFSG48C Applications
There are a lot of Xilinx Inc. XCF08PFSG48C applications of configuration proms for FPGAs.
- eSRAM
- DVD disk buffer
- embedded logic
- personal digital assistants
- data buffer
- hard disk drive (HDD)
- personal computers
- supercomputers
- workstations,
- Camcorders
- ImagePart NumberManufacturerPackage / CaseNumber of PinsInterfaceMemory TypeMemory SizeSupply VoltageTechnologyPackagingView Compare
XCF08PFSG48C
Xilinx Inc.48-TFBGA, CSPBGA
48
Parallel, Serial
FLASH
8Mb
1.8 V
CMOS
Tray
- XCF16PFSG48CXilinx Inc.
48-TFBGA, CSPBGA
48
Parallel, Serial
FLASH
16Mb
1.8 V
CMOS
Tray
XCF08PFSG48C
VS
XCF16PFSG48C
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XCF08PFS48CXilinx Inc.48-TFBGA, CSPBGA
48
-
-
8Mb
1.8 V
CMOS
Tray
XCF08PFSG48C
VS
XCF08PFS48C
LPC1115FET48/303QLNXP USA Inc.48-TFBGA
-
-
-
-
3.3 V
CMOS
Tray
XCF08PFSG48C
VS
LPC1115FET48/303QL
- LPC11U35FET48/501,NXP USA Inc.
48-TFBGA
-
-
-
-
3.3 V
CMOS
Tray
XCF08PFSG48C
VS
LPC11U35FET48/501,
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Tape/Reel | Tube | Tray | Bulk | Ammo |
Weave bulk chips into tapes and pack them into reels through SMD components packaging Tape Machine. Reel is the most commonly used. | When packaging, arrange the components in the same direction and put them into plastic tubes one at a time. | Choose tray package with the same specifications as the original manufacturer, put the components into the tray and use the strapping machine. | Bulk packaging means that the SMD components are freely packaged in a formed plastic box or bag. | Adhesive tape cut continuously in predetermined quantities. The cut strips are placed in boxes for safekeeping. |
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