Texas Instruments TXB0108PWR
TXB0108PWR
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Texas Instruments TXB0108PWR information
Type
Parameter
Factory Lead Time
6 Weeks
Lifecycle Status
ACTIVE (Last Updated: 4 days ago)
Contact Plating
Gold
Mount
Surface Mount
Mounting Type
Surface Mount
Package / Case
20-TSSOP (0.173, 4.40mm Width)
Number of Pins
20
Weight
76.997305mg
Manufacturer Package Identifier
PW (R-PDSO-G**)
Operating Temperature
-40°C~85°C TA
Packaging
Tape & Reel (TR)
JESD-609 Code
e4
Feature
Auto-Direction Sensing
Pbfree Code
yes
Part Status
Active
Moisture Sensitivity Level (MSL)
1 (Unlimited)
Number of Terminations
20
Termination
SMD/SMT
ECCN Code
EAR99
Subcategory
Other Interface ICs
Terminal Position
DUAL
Terminal Form
GULL WING
Peak Reflow Temperature (Cel)
260
Number of Functions
1
Supply Voltage
1.5V
Terminal Pitch
0.65mm
Base Part Number
TXB0108
Pin Count
20
Output Type
Tri-State, Non-Inverted
Number of Channels
8
Number of Circuits
1
Max Supply Voltage
5.5V
Min Supply Voltage
1.65V
Output Current
20μA
Number of Bits
8
Propagation Delay
4 ns
Quiescent Current
3.5μA
Turn On Delay Time
9.5 ns
Logic Function
Translator
Data Rate
100Mbps
Output Characteristics
3-STATE
Rise Time
7.3ns
Interface IC Type
INTERFACE CIRCUIT
High Level Output Current
-20μA
Channel Type
Bidirectional
Low Level Output Current
20μA
Supply Voltage1-Nom
1.8V
Translator Type
Voltage Level
Voltage - VCCA
1.2V~3.6V
Voltage - VCCB
1.65V~5.5V
Height
1.2mm
Length
6.5mm
Width
4.4mm
Thickness
1mm
Radiation Hardening
No
REACH SVHC
No SVHC
RoHS Status
ROHS3 Compliant
Lead Free
Lead Free
- Datasheets :
TXB0108PWR Overview
Level translators is embedded in the 20-TSSOP (0.173, 4.40mm Width) package.Tape & Reel (TR) is the packaging method.This output is configured with Tri-State, Non-Inverted.Its translator type is Voltage Level.A Surface Mount mounting method has been used for this electronic part.This electrical device has channel type Bidirectional.Level translators operates at -40°C~85°C TA.Its superior flexibility is achieved by using 1 circuits.When it comes to terminating a transmission line, there are 20 terminations.Based on this base part number TXB0108, its related parts can be identified.Level translators is powered by a 1.5V supply.20 pins are present on this board.20 pins are used in its design.This electronic part is designed with 8 Bits.Level translators supports the maximal supply voltage of 5.5V.1.65V is its minimum supply voltage.The VCCA supply rail is configured from 1.2V~3.6V.There is a configuration of 1.65V~5.5V for the VCCB supply rail.This mount is done using the method of Surface Mount.8 is the number of channels.Other Interface ICs contains this part.Level translators consumes 3.5μA of quiescent current wLevel translatorshout being affected by outside factors.Operating can ensure that Auto-Direction Sensing is achieved.Because it features a 20μA output current, maximum design flexibility can be achieved.
TXB0108PWR Features
20-TSSOP (0.173, 4.40mm Width) package
1 circuits
20 pin count
20 pins
TXB0108PWR Applications
There are a lot of Texas Instruments TXB0108PWR voltage translators & level shifters applications.
- Product Traceability
- Products With Many I
- Signaling Level Conversion for Clock or Data
- Routers (routing equipment)
- UART
- Push-pull level shifting (UART, SPI, JTAG, and so forth)
- I2C / SMBus
- One Assembly
- MDIO
- Automotive infotainment
- ImagePart NumberManufacturerPackage / CaseNumber of PinsLogic FunctionNumber of ChannelsPropagation DelayData RateLow Level Output CurrentHigh Level Output CurrentMin Supply VoltageSupply VoltageSupply Voltage1-NomMax Supply VoltageView Compare
TXB0108PWR
NA20-TSSOP (0.173, 4.40mm Width)
20
Translator
8
4 ns
100Mbps
20 μA
-20 μA
1.65 V
1.5 V
1.8 V
5.5 V
- NLSX3018DTR2GON Semiconductor
20-TSSOP (0.173, 4.40mm Width)
20
Translator
8
6.5 ns
110Mbps
20 μA
-20 μA
-500 mV
3.3 V
-
5.5 V
TXB0108PWR
VS
NLSX3018DTR2G
- TXS0108EPWRG4NA
20-TSSOP (0.173, 4.40mm Width)
20
Translator
8
312 ns
60Mbps
50 mA
-50 mA
1.65 V
2.5 V
-
5.5 V
TXB0108PWR
VS
TXS0108EPWRG4
- TXB0106PWRNA
16-TSSOP (0.173, 4.40mm Width)
16
Translator
6
4 ns
100Mbps
20 μA
-20 μA
1.2 V
1.5 V
-
5.5 V
TXB0108PWR
VS
TXB0106PWR
- TXS0108EPWRNA
20-TSSOP (0.173, 4.40mm Width)
20
Translator
8
4.8 ns
60Mbps
50 mA
-50 mA
1.2 V
2.5 V
-
5.5 V
TXB0108PWR
VS
TXS0108EPWR
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If it is a scheduled component, it needs to wait for the arrival of the parts, and then it will be inspected before delivery. If there are special circumstances, the sales staff will confirm with you. Weekends and holidays will also affect the delivery time of electronic products.
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2.Are the Texas Instruments Incorporated (TI)'s TXB0108PWR price and stock displayed on the website accurate?
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After the electronic components have passed the quality inspection of Aztec Electronics, there are generally the following five packaging forms for electronic components: Tape, Tube, Tray, Bulk and Ammo.
Tape/Reel | Tube | Tray | Bulk | Ammo |
Weave bulk chips into tapes and pack them into reels through SMD components packaging Tape Machine. Reel is the most commonly used. | When packaging, arrange the components in the same direction and put them into plastic tubes one at a time. | Choose tray package with the same specifications as the original manufacturer, put the components into the tray and use the strapping machine. | Bulk packaging means that the SMD components are freely packaged in a formed plastic box or bag. | Adhesive tape cut continuously in predetermined quantities. The cut strips are placed in boxes for safekeeping. |
Choose electronic components that are vacuum-sealed against water, dust, moisture, oxidation, corrosion, and even UV or RF pollution.
How to pack electronic components in cartons?
1. Choose the right box for your electronic components2. Use anti-static bubble film protect electronic component
3. Put it into the box, no buffer dead corner, 360-degree package.
4. Labeled as fragile to ensure that the courier knows what needs to be done with the package.
Texas Instruments Incorporated (TI) was founded in 1930 and is headquartered in Dallas, Texas, USA. Haviv Ilan is the President and CEO. They design, manufacture, test and sell analog and embedded semiconductors. Industrial and automotive markets are the best markets for their products .
The company focuses on amplifiers, audio, clock and timing, data converters, die and wafer services, DLP® products, interfaces, isolation devices, logic, microcontrollers (MCUs) and processors, motor drivers, power management, radio frequency & Microwaves, Sensors, Switches & Multiplexers, Wireless Connectivity.
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Acquisition history:
In October 1999, TI acquired power Trends
In 2000, TI acquired Burr Brown (BB) at approximately $7.6 billion.
In September 2011, TI acquired National semiconductor(NS.NSC) for US$6.5 billion.
In 2021, TI acquired an operational 300mm fabrication plant located in Lehi, Utah from Micron for $900 million.
Main application fields:
Automotive, Communications Equipment, Enterprise Systems, Industrial Applications, Aerospace and Defense, Appliances, Building Automation, Factory Automation and Control, Grid Infrastructure, Industrial Transportation (non-automotive and non-light truck), Lighting, Medical, Motor Drives, Power Delivery, Pro Audio, Video & Signage, Retail Automation & Payments, Test & Measurement, Personal Electronics.