Texas Instruments TXB0108RGYR
TXB0108RGYR
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Texas Instruments TXB0108RGYR information
Type
Parameter
Factory Lead Time
6 Weeks
Lifecycle Status
ACTIVE (Last Updated: 4 days ago)
Contact Plating
Gold
Mount
Surface Mount
Mounting Type
Surface Mount
Package / Case
20-VFQFN Exposed Pad
Number of Pins
20
Weight
43.006227mg
Operating Temperature
-40°C~85°C TA
Packaging
Tape & Reel (TR)
JESD-609 Code
e4
Feature
Auto-Direction Sensing
Pbfree Code
yes
Part Status
Active
Moisture Sensitivity Level (MSL)
2 (1 Year)
Number of Terminations
20
Termination
SMD/SMT
ECCN Code
EAR99
Subcategory
Other Interface ICs
Terminal Position
QUAD
Peak Reflow Temperature (Cel)
260
Number of Functions
1
Supply Voltage
1.5V
Terminal Pitch
0.5mm
Base Part Number
TXB0108
Pin Count
20
Number of Outputs
1
Output Type
Tri-State, Non-Inverted
Number of Channels
8
Number of Circuits
1
Max Supply Voltage
5.5V
Min Supply Voltage
1.2V
Nominal Supply Current
10μA
Output Current
20μA
Number of Bits
8
Propagation Delay
4 ns
Quiescent Current
3.5μA
Turn On Delay Time
9.5 ns
Logic Function
Translator
Data Rate
100Mbps
Output Characteristics
3-STATE
Rise Time
800ps
Interface IC Type
INTERFACE CIRCUIT
High Level Output Current
-20μA
Channel Type
Bidirectional
Low Level Output Current
20μA
Supply Voltage1-Nom
1.8V
Max Junction Temperature (Tj)
150°C
Ambient Temperature Range High
85°C
Translator Type
Voltage Level
Voltage - VCCA
1.2V~3.6V
Voltage - VCCB
1.65V~5.5V
Height
1mm
Length
4.5mm
Width
3.5mm
Thickness
900μm
Radiation Hardening
No
REACH SVHC
No SVHC
RoHS Status
ROHS3 Compliant
Lead Free
Lead Free
- Datasheets :
TXB0108RGYR Overview
Level translators is embedded in the 20-VFQFN Exposed Pad package.Packaged in the way of Tape & Reel (TR).Tri-State, Non-Inverted is the output configured for it.The translator type of this electrical device is Voltage Level.Surface Mount is used to mount this electronic part.Electrical device with type Bidirectional channel.The operating temperature is -40°C~85°C TA.Flexible 1 circuits enable it to achieve high performance.0 terminations are used to end transmission lines.There is a base part number TXB0108 that refers to the related parts.A supply voltage of 1.5V powers it.A total of 20 pins are included.In addition, it is designed with a pin number of 20.8 Bits are used in the design of this electronic part.Level translators supports a maximum supply voltage of 5.5V.This device requires a minimum voltage of 1.2V.From 1.2V~3.6V, the supply rail of the VCCA is configured.1.65V~5.5V is the configuration of the VCCB supply rail.Surface Mount is used for mounting.Channels are set to 8.This part is included in Other Interface ICs.Aquiescent current is consumed by 3.5μA without being affected by external forces.In order to ensure Auto-Direction Sensing during operation, there are several things to consider.The output current of 20μA makes it feature maximum design flexibility.A total of 1 outputs are configured.
TXB0108RGYR Features
20-VFQFN Exposed Pad package
1 circuits
20 pin count
20 pins
1 outputs
TXB0108RGYR Applications
There are a lot of Texas Instruments TXB0108RGYR voltage translators & level shifters applications.
- PMBus
- Debouncing a Mechanical Switch
- Industrial Equipment
- Advanced Driver Assistance System (ADAS)
- Available in Military (-55°C to 125°C)
- Industrial
- Routers (Telecom Switching Equipment)
- Product Traceability
- Telecommunications
- Industrial equipment
- ImagePart NumberManufacturerPackage / CaseNumber of PinsLogic FunctionNumber of ChannelsPropagation DelayData RateLow Level Output CurrentHigh Level Output CurrentMin Supply VoltageSupply VoltageSupply Voltage1-NomMax Supply VoltageView Compare
TXB0108RGYR
NA20-VFQFN Exposed Pad
20
Translator
8
4 ns
100Mbps
20 μA
-20 μA
1.2 V
1.5 V
1.8 V
5.5 V
SN74AVC4T774RSVRNA16-UFQFN
16
Transceiver, Translator
4
2.4 ns
380Mbps
12 mA
-12 mA
1.2 V
1.5 V
-
3.6 V
TXB0108RGYR
VS
SN74AVC4T774RSVR
FXMA108BQXON Semiconductor20-WFQFN Exposed Pad
20
Translator
8
5.5 ns
100Mbps
20 μA
-20 μA
1.65 V
1.8 V
-
5.5 V
TXB0108RGYR
VS
FXMA108BQX
- SN74AVCH4T245RSVRNA
16-UFQFN
16
Transceiver, Translator
-
10.3 ns
380Mbps
12 mA
-12 mA
1.2 V
1.5 V
-
3.6 V
TXB0108RGYR
VS
SN74AVCH4T245RSVR
- CAVCH4T245MRSVREPNA
16-UFQFN
16
Transceiver, Translator
-
6.9 ns
380Mbps
12 mA
-12 mA
1.2 V
1.5 V
-
3.6 V
TXB0108RGYR
VS
CAVCH4T245MRSVREP
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1. Understand the shipping rules of the destination country
Different countries have different regulations for shipping electronic equipment, check for certain certifications, and read the destination country's guidelines before shipping to prevent delays or confiscation of goods by customs.
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The shipping cost of electronic products depends on the size and weight of the package and the shipping distance. You can first ask us about the size/weight of the products we sell to estimate the shipping cost.
4. How long does it take to ship the electronic components?
If electronic component in stock, it is usually shipped before 5 o'clock on the same day, and it usually takes 5-10 working days to complete it by international express.
If it is a scheduled component, it needs to wait for the arrival of the parts, and then it will be inspected before delivery. If there are special circumstances, the sales staff will confirm with you. Weekends and holidays will also affect the delivery time of electronic products.
1. We provide 365 days warranty for all electronic components.
2. If you need a test report, please let us know. We have a long-term cooperative testing laboratory. If you have familiar testing laboratory, we can also ship to your designated laboratory for testing.
3. Where does Aztec Electronics mainly purchase electronic components from?
Distributors, free market, 48 global large-scale OEM factories in close contact with us (Great Price advantage, 100% original)
2.Are the Texas Instruments Incorporated (TI)'s TXB0108RGYR price and stock displayed on the website accurate?
Aztec Electronics inventory fluctuates greatly and cannot be updated in time, it is recommended to confirm the order with Aztec Electronics salesperson or online customer service before payment.
You Also Ask
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After the electronic components have passed the quality inspection of Aztec Electronics, there are generally the following five packaging forms for electronic components: Tape, Tube, Tray, Bulk and Ammo.
Tape/Reel | Tube | Tray | Bulk | Ammo |
Weave bulk chips into tapes and pack them into reels through SMD components packaging Tape Machine. Reel is the most commonly used. | When packaging, arrange the components in the same direction and put them into plastic tubes one at a time. | Choose tray package with the same specifications as the original manufacturer, put the components into the tray and use the strapping machine. | Bulk packaging means that the SMD components are freely packaged in a formed plastic box or bag. | Adhesive tape cut continuously in predetermined quantities. The cut strips are placed in boxes for safekeeping. |
Choose electronic components that are vacuum-sealed against water, dust, moisture, oxidation, corrosion, and even UV or RF pollution.
How to pack electronic components in cartons?
1. Choose the right box for your electronic components2. Use anti-static bubble film protect electronic component
3. Put it into the box, no buffer dead corner, 360-degree package.
4. Labeled as fragile to ensure that the courier knows what needs to be done with the package.
Texas Instruments Incorporated (TI) was founded in 1930 and is headquartered in Dallas, Texas, USA. Haviv Ilan is the President and CEO. They design, manufacture, test and sell analog and embedded semiconductors. Industrial and automotive markets are the best markets for their products .
The company focuses on amplifiers, audio, clock and timing, data converters, die and wafer services, DLP® products, interfaces, isolation devices, logic, microcontrollers (MCUs) and processors, motor drivers, power management, radio frequency & Microwaves, Sensors, Switches & Multiplexers, Wireless Connectivity.
Their values: Trustworthy, Inclusive, Innovative, Competitive, Results-oriented
Acquisition history：
In October 1999, TI acquired power Trends
In 2000, TI acquired Burr Brown (BB) at approximately $7.6 billion.
In September 2011, TI acquired National semiconductor(NS.NSC) for US$6.5 billion.
In 2021, TI acquired an operational 300mm fabrication plant located in Lehi, Utah from Micron for $900 million.
Main application fields:
Automotive, Communications Equipment, Enterprise Systems, Industrial Applications, Aerospace and Defense, Appliances, Building Automation, Factory Automation and Control, Grid Infrastructure, Industrial Transportation (non-automotive and non-light truck), Lighting, Medical, Motor Drives, Power Delivery, Pro Audio, Video & Signage, Retail Automation & Payments, Test & Measurement, Personal Electronics.
