Texas Instruments TXS0108EPWR
TXS0108EPWR
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Texas Instruments TXS0108EPWR information
Type
Parameter
Factory Lead Time
8 Weeks
Lifecycle Status
ACTIVE (Last Updated: 3 days ago)
Contact Plating
Gold
Mount
Surface Mount
Mounting Type
Surface Mount
Package / Case
20-TSSOP (0.173, 4.40mm Width)
Number of Pins
20
Weight
76.997305mg
Operating Temperature
-40°C~85°C TA
Packaging
Tape & Reel (TR)
JESD-609 Code
e4
Feature
Auto-Direction Sensing
Pbfree Code
yes
Part Status
Active
Moisture Sensitivity Level (MSL)
1 (Unlimited)
Number of Terminations
20
Termination
SMD/SMT
ECCN Code
EAR99
Subcategory
Other Interface ICs
Terminal Position
DUAL
Terminal Form
GULL WING
Peak Reflow Temperature (Cel)
260
Number of Functions
1
Supply Voltage
2.5V
Terminal Pitch
0.65mm
Base Part Number
TXS0108
Pin Count
20
Output Type
Open Drain, Push-Pull
Number of Channels
8
Number of Circuits
1
Max Supply Voltage
5.5V
Min Supply Voltage
1.2V
Nominal Supply Current
8μA
Output Current
620μA
Number of Bits
8
Propagation Delay
4.8 ns
Quiescent Current
3μA
Turn On Delay Time
312 ns
Logic Function
Translator
Data Rate
60Mbps
Output Characteristics
3-STATE
Rise Time
6.3ns
Interface IC Type
INTERFACE CIRCUIT
High Level Output Current
-50mA
Channel Type
Bidirectional
Low Level Output Current
50mA
Translator Type
Voltage Level
Voltage - VCCA
1.2V~3.6V
Voltage - VCCB
1.65V~5.5V
Height
1.2mm
Length
6.5mm
Width
4.4mm
Thickness
1mm
Radiation Hardening
No
REACH SVHC
No SVHC
RoHS Status
ROHS3 Compliant
Lead Free
Lead Free
- PCN Design/Specification :
TXS0108EPWR Overview
20-TSSOP (0.173, 4.40mm Width) contains it.A Tape & Reel (TR) package is used to package it.In this configuration, the output is set to Open Drain, Push-Pull.The translator type of this electrical device is Voltage Level.Surface Mount is used to mount this electronic part.There is Bidirectional channel type for this electrical device.-40°C~85°C TA is the operating temperature.The superior flexibility of the system is achieved through its use of 1 circuits.As part of the transmission line termination process, there are a total of 20 terminations.Parts related to a base part number TXS0108 are designated by the same number.A supply voltage of 2.5V is used to power the device.20 pins are present on this board.20 pins are used in its design.There are 8 bits in this electronic part.Voltages up to 5.5V can be supplied.This device requires a minimum voltage of 1.2V.The VCCA supply rail is configured from 1.2V~3.6V.VCCB is configured with a supply rail that starts at 1.65V~5.5V.Level translators has been mounted wLevel translatorsh the method of Surface Mount.Level translators is 8 channels.As part of Other Interface ICs, this part is included.In the absence of external influences, it consumes 3μA of quiescent current.During operation, Auto-Direction Sensing can be ensured.Featuring a 620μA output current, its design flexibility is maximized.
TXS0108EPWR Features
20-TSSOP (0.173, 4.40mm Width) package
1 circuits
20 pin count
20 pins
TXS0108EPWR Applications
There are a lot of Texas Instruments TXS0108EPWR voltage translators & level shifters applications.
- Personal Electronics
- LCD Panels Using GIP / GOA / ASG Technology
- Automotive
- One Assembly and Test Site
- Telecommunications
- Signaling Level Conversion for Clock or Data
- Industrial
- Telecom
- Available in Military (-55°C to 125°C)
- Routers (Telecom Switching Equipment)
- ImagePart NumberManufacturerPackage / CaseNumber of PinsLogic FunctionNumber of CircuitsPropagation DelayLow Level Output CurrentHigh Level Output CurrentMin Supply VoltageSupply VoltageView Compare
TXS0108EPWR
NA20-TSSOP (0.173, 4.40mm Width)
20
Translator
1
4.8 ns
50 mA
-50 mA
1.2 V
2.5 V
- TXB0108PWRNA
20-TSSOP (0.173, 4.40mm Width)
20
Translator
1
4 ns
20 μA
-20 μA
1.65 V
1.5 V
TXS0108EPWR
VS
TXB0108PWR
74LVC8T245PW,118Nexperia USA Inc.24-TSSOP (0.173, 4.40mm Width)
24
Transceiver, Translator
1
43 ns
32 mA
-32 mA
1.2 V
1.5 V
TXS0108EPWR
VS
74LVC8T245PW,118
TXB0106PWRNA16-TSSOP (0.173, 4.40mm Width)
16
Translator
1
4 ns
20 μA
-20 μA
1.2 V
1.5 V
TXS0108EPWR
VS
TXB0106PWR
- TXB0108PWRG4NA
20-TSSOP (0.173, 4.40mm Width)
20
Translator
1
9.5 ns
20 μA
-20 μA
1.65 V
1.5 V
TXS0108EPWR
VS
TXB0108PWRG4
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If it is a scheduled component, it needs to wait for the arrival of the parts, and then it will be inspected before delivery. If there are special circumstances, the sales staff will confirm with you. Weekends and holidays will also affect the delivery time of electronic products.
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2.Are the Texas Instruments Incorporated (TI)'s TXS0108EPWR price and stock displayed on the website accurate?
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After the electronic components have passed the quality inspection of Aztec Electronics, there are generally the following five packaging forms for electronic components: Tape, Tube, Tray, Bulk and Ammo.
Tape/Reel | Tube | Tray | Bulk | Ammo |
Weave bulk chips into tapes and pack them into reels through SMD components packaging Tape Machine. Reel is the most commonly used. | When packaging, arrange the components in the same direction and put them into plastic tubes one at a time. | Choose tray package with the same specifications as the original manufacturer, put the components into the tray and use the strapping machine. | Bulk packaging means that the SMD components are freely packaged in a formed plastic box or bag. | Adhesive tape cut continuously in predetermined quantities. The cut strips are placed in boxes for safekeeping. |
Choose electronic components that are vacuum-sealed against water, dust, moisture, oxidation, corrosion, and even UV or RF pollution.
How to pack electronic components in cartons?
1. Choose the right box for your electronic components2. Use anti-static bubble film protect electronic component
3. Put it into the box, no buffer dead corner, 360-degree package.
4. Labeled as fragile to ensure that the courier knows what needs to be done with the package.
Texas Instruments Incorporated (TI) was founded in 1930 and is headquartered in Dallas, Texas, USA. Haviv Ilan is the President and CEO. They design, manufacture, test and sell analog and embedded semiconductors. Industrial and automotive markets are the best markets for their products .
The company focuses on amplifiers, audio, clock and timing, data converters, die and wafer services, DLP® products, interfaces, isolation devices, logic, microcontrollers (MCUs) and processors, motor drivers, power management, radio frequency & Microwaves, Sensors, Switches & Multiplexers, Wireless Connectivity.
Their values: Trustworthy, Inclusive, Innovative, Competitive, Results-oriented
Acquisition history：
In October 1999, TI acquired power Trends
In 2000, TI acquired Burr Brown (BB) at approximately $7.6 billion.
In September 2011, TI acquired National semiconductor(NS.NSC) for US$6.5 billion.
In 2021, TI acquired an operational 300mm fabrication plant located in Lehi, Utah from Micron for $900 million.
Main application fields:
Automotive, Communications Equipment, Enterprise Systems, Industrial Applications, Aerospace and Defense, Appliances, Building Automation, Factory Automation and Control, Grid Infrastructure, Industrial Transportation (non-automotive and non-light truck), Lighting, Medical, Motor Drives, Power Delivery, Pro Audio, Video & Signage, Retail Automation & Payments, Test & Measurement, Personal Electronics.
