Texas Instruments TXS0102DCUT
TXS0102DCUT
In Stock:94131
Qty
Unit Price
Ext Price
1
$0.570000
$0.570000
10
$0.536000
$5.360000
100
$0.505700
$50.570000
500
$0.477040
$238.520000
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Texas Instruments TXS0102DCUT information
Type
Parameter
Factory Lead Time
6 Weeks
Lifecycle Status
ACTIVE (Last Updated: 2 days ago)
Mount
Surface Mount
Mounting Type
Surface Mount
Package / Case
8-VFSOP (0.091, 2.30mm Width)
Number of Pins
8
Weight
9.610488mg
Operating Temperature
-40°C~85°C TA
Packaging
Tape & Reel (TR)
JESD-609 Code
e4
Feature
Auto-Direction Sensing
Pbfree Code
yes
Part Status
Active
Moisture Sensitivity Level (MSL)
1 (Unlimited)
Number of Terminations
8
ECCN Code
EAR99
Terminal Finish
Nickel/Palladium/Gold (Ni/Pd/Au)
Subcategory
Other Interface ICs
Terminal Position
DUAL
Terminal Form
GULL WING
Peak Reflow Temperature (Cel)
260
Number of Functions
1
Supply Voltage
1.8V
Terminal Pitch
0.5mm
Base Part Number
TXS0102
Pin Count
8
Output Type
Open Drain, Push-Pull
Number of Channels
2
Number of Circuits
1
Max Supply Voltage
5.5V
Min Supply Voltage
1.65V
Output Current
1mA
Number of Bits
2
Propagation Delay
260 ns
Quiescent Current
14.4μA
Turn On Delay Time
260 ns
Logic Function
Translator
Data Rate
24Mbps
Output Characteristics
3-STATE
Interface IC Type
INTERFACE CIRCUIT
High Level Output Current
-20μA
Channel Type
Bidirectional
Low Level Output Current
1mA
Supply Voltage1-Nom
2.5V
Translator Type
Voltage Level
Voltage - VCCA
1.65V~3.6V
Voltage - VCCB
2.3V~5.5V
Height
900μm
Length
2.3mm
Width
2mm
Thickness
850μm
Radiation Hardening
No
REACH SVHC
No SVHC
RoHS Status
ROHS3 Compliant
Lead Free
Lead Free
- Datasheets :
TXS0102DCUT Overview
Embedded in the 8-VFSOP (0.091, 2.30mm Width) package, it is available for you to use.This package has the format of Tape & Reel (TR).Open Drain, Push-Pull is used for the output it is configured with.There is Voltage Level translator type for this electrical device.Level translators is mounted according to the Surface Mount method.There is Bidirectional channel type for this electrical device.Operation is performed at -40°C~85°C TA.The superior flexibility of the system is achieved through its use of 1 circuits.As part of the transmission line termination process, there are a total of 8 terminations.The base part number TXS0102 can be used to find its related parts.A supply voltage of 1.8V powers it.With 8 pins, it is equipped with a minimal number of connections.In addition, it is designed with a pin number of 8.An electronic part with 2 bits is designed.5.5V is the maximum voltage it supports.A minimal voltage of 1.65V is needed to operate it.There is a configuration of 1.65V~3.6V for the VCCA supply rail.Level translators is configured from 2.3V~5.5V for the VCCB supply rail.With the Surface Mount method, it is mounted.There are a total of 2 channels.I would classify it as part of the group of Other Interface ICs.There are no external factors that affect it, so it consumes 14.4μA quiescent current.Operating can ensure that Auto-Direction Sensing is achieved.As a result of its 1mA output current, it allows for maximum design flexibility.
TXS0102DCUT Features
8-VFSOP (0.091, 2.30mm Width) package
1 circuits
8 pin count
8 pins
TXS0102DCUT Applications
There are a lot of Texas Instruments TXS0102DCUT voltage translators & level shifters applications.
- Power-sensitive applications
- Eliminate slow or noisy input signals
- Driving indicator LEDs or buzzers
- Personal Electronics
- Public Signage
- Automotive
- Tablet
- Telematics
- SMBus
- One Assembly and Test Site
- ImagePart NumberManufacturerPackage / CaseNumber of PinsLogic FunctionNumber of CircuitsPropagation DelayLow Level Output CurrentHigh Level Output CurrentMin Supply VoltageSupply VoltageSupply Voltage1-NomMax Supply VoltageView Compare
TXS0102DCUT
NA8-VFSOP (0.091, 2.30mm Width)
8
Translator
1
260 ns
1 mA
-20 μA
1.65 V
1.8 V
2.5 V
5.5 V
- SN74LVC2T45DCURNA
8-VFSOP (0.091, 2.30mm Width)
8
Transceiver, Translator
1
45.2 ns
32 mA
-32 mA
1.65 V
1.8 V
-
5.5 V
TXS0102DCUT
VS
SN74LVC2T45DCUR
74LVC2T45DC-Q100HNexperia USA Inc.8-VFSOP (0.091, 2.30mm Width)
8
Transceiver, Translator
1
5.1 ns
32 mA
-32 mA
1.2 V
1.5 V
-
5.5 V
TXS0102DCUT
VS
74LVC2T45DC-Q100H
- TXB0102DCUTNA
8-VFSOP (0.091, 2.30mm Width)
8
Translator
1
31 ns
20 μA
-20 μA
1.65 V
1.5 V
1.8 V
5.5 V
TXS0102DCUT
VS
TXB0102DCUT
- TXS0102QDCURQ1NA
8-VFSOP (0.091, 2.30mm Width)
8
Translator
1
10 ns
1 mA
-20 μA
1.65 V
1.8 V
-
5.5 V
TXS0102DCUT
VS
TXS0102QDCURQ1
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If it is a scheduled component, it needs to wait for the arrival of the parts, and then it will be inspected before delivery. If there are special circumstances, the sales staff will confirm with you. Weekends and holidays will also affect the delivery time of electronic products.
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After the electronic components have passed the quality inspection of Aztec Electronics, there are generally the following five packaging forms for electronic components: Tape, Tube, Tray, Bulk and Ammo.
Tape/Reel | Tube | Tray | Bulk | Ammo |
Weave bulk chips into tapes and pack them into reels through SMD components packaging Tape Machine. Reel is the most commonly used. | When packaging, arrange the components in the same direction and put them into plastic tubes one at a time. | Choose tray package with the same specifications as the original manufacturer, put the components into the tray and use the strapping machine. | Bulk packaging means that the SMD components are freely packaged in a formed plastic box or bag. | Adhesive tape cut continuously in predetermined quantities. The cut strips are placed in boxes for safekeeping. |
Choose electronic components that are vacuum-sealed against water, dust, moisture, oxidation, corrosion, and even UV or RF pollution.
How to pack electronic components in cartons?
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Texas Instruments Incorporated (TI) was founded in 1930 and is headquartered in Dallas, Texas, USA. Haviv Ilan is the President and CEO. They design, manufacture, test and sell analog and embedded semiconductors. Industrial and automotive markets are the best markets for their products .
The company focuses on amplifiers, audio, clock and timing, data converters, die and wafer services, DLP® products, interfaces, isolation devices, logic, microcontrollers (MCUs) and processors, motor drivers, power management, radio frequency & Microwaves, Sensors, Switches & Multiplexers, Wireless Connectivity.
Their values: Trustworthy, Inclusive, Innovative, Competitive, Results-oriented
Acquisition history：
In October 1999, TI acquired power Trends
In 2000, TI acquired Burr Brown (BB) at approximately $7.6 billion.
In September 2011, TI acquired National semiconductor(NS.NSC) for US$6.5 billion.
In 2021, TI acquired an operational 300mm fabrication plant located in Lehi, Utah from Micron for $900 million.
Main application fields:
Automotive, Communications Equipment, Enterprise Systems, Industrial Applications, Aerospace and Defense, Appliances, Building Automation, Factory Automation and Control, Grid Infrastructure, Industrial Transportation (non-automotive and non-light truck), Lighting, Medical, Motor Drives, Power Delivery, Pro Audio, Video & Signage, Retail Automation & Payments, Test & Measurement, Personal Electronics.
