Texas Instruments SN74AVC1T45DBVR
SN74AVC1T45DBVR
In Stock:94131
Qty
Unit Price
Ext Price
1
$0.610000
$0.610000
10
$0.578000
$5.780000
100
$0.545400
$54.540000
500
$0.514560
$257.280000
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Texas Instruments SN74AVC1T45DBVR information
Type
Parameter
Factory Lead Time
6 Weeks
Lifecycle Status
ACTIVE (Last Updated: 3 days ago)
Contact Plating
Gold
Mount
Surface Mount
Mounting Type
Surface Mount
Package / Case
SOT-23-6
Number of Pins
6
Weight
6.492041mg
Operating Temperature
-40°C~85°C TA
Packaging
Tape & Reel (TR)
Series
74AVC
JESD-609 Code
e4
Pbfree Code
yes
Part Status
Active
Moisture Sensitivity Level (MSL)
1 (Unlimited)
Number of Terminations
6
ECCN Code
EAR99
Additional Feature
TWO SEPARATE CONFIGURABLE POWER SUPPLY RAILS FOR PORT A AND PORT B
Subcategory
Bus Driver/Transceivers
Packing Method
TR
Technology
CMOS
Terminal Position
DUAL
Terminal Form
GULL WING
Peak Reflow Temperature (Cel)
260
Number of Functions
1
Supply Voltage
1.5V
Terminal Pitch
0.95mm
Base Part Number
74AVC1T45
Pin Count
6
Output Type
Tri-State, Non-Inverted
Polarity
Non-Inverting
Number of Channels
1
Max Supply Voltage
3.6V
Min Supply Voltage
1.2V
Number of Ports
2
Output Current
12mA
Number of Bits
1
Propagation Delay
2.8 ns
Quiescent Current
20μA
Turn On Delay Time
5.6 ns
Family
AVC
Logic Function
Inverting, Transceiver, Translator
Data Rate
500Mbps
Output Characteristics
3-STATE
Logic IC Type
BUS TRANSCEIVER
High Level Output Current
-12mA
Channel Type
Bidirectional
Low Level Output Current
12mA
Control Type
COMMON CONTROL
Number of Receivers
2
Translator Type
Voltage Level
Voltage - VCCA
1.2V~3.6V
Voltage - VCCB
1.2V~3.6V
Height
1.45mm
Length
2.9mm
Width
1.6mm
Thickness
1.2mm
Radiation Hardening
No
REACH SVHC
No SVHC
RoHS Status
ROHS3 Compliant
Lead Free
Lead Free
- PCN Design/Specification :
- Datasheets :
SN74AVC1T45DBVR Overview
A package called SOT-23-6 contains it.A Tape & Reel (TR) package is used to package it.In this configuration, the output is set to Tri-State, Non-Inverted.The translator type of this electrical device is Voltage Level.Surface Mount is the way in which this electronic part is mounted.This electrical device has channel type Bidirectional.-40°C~85°C TA is the operating temperature.When it comes to terminating a transmission line, there are 6 terminations.Parts related to a base part number 74AVC1T45 are designated by the same number.There is a voltage supply of 1.5V which powers the device.There are 6 pins on this device.This is a device from the 74AVC series.The pin configuration of the device is 6.Electronic parts are designed with a number of bits of 1.Level translators supports a maximum supply voltage of 3.6V.1.2V is its minimum supply voltage.In the VCCA, the supply rail is set to 1.2V~3.6V.Level translators is configured from 1.2V~3.6V for the VCCB supply rail.The mount method is Surface Mount.There are 1 channels.Level translators is part of Bus Driver/Transceivers.As for the logic IC it uses, it is a BUS TRANSCEIVER.The 2 terminations involve matching the characteristic impedance of a transmission line to the device that ends the line.Electronic devices like this belong to the family AVC.Level translators consumes 20μA of quiescent current wLevel translatorshout being affected by external factors. Considering its reliability, this device is appropriate for TR.The output current of 12mA gives it maximum flexibility in design.In addition, it is characterized by TWO SEPARATE CONFIGURABLE POWER SUPPLY RAILS FOR PORT A AND PORT B.
SN74AVC1T45DBVR Features
SOT-23-6 package
6 pin count
74AVC series
6 pins
SN74AVC1T45DBVR Applications
There are a lot of Texas Instruments SN74AVC1T45DBVR voltage translators & level shifters applications.
- Enterprise and communications
- Debouncing a Mechanical Switch
- MDIO
- Controlled Baseline
- Temperature Ranges (1)
- Notebook
- One Fabrication Site
- Automotive infotainment
- Signaling Level Conversion for Clock or Data
- Tablet
- ImagePart NumberManufacturerPackage / CaseNumber of PinsLogic FunctionMin Supply VoltageSupply VoltageMax Supply VoltageFactory Lead TimeMoisture Sensitivity Level (MSL)View Compare
SN74AVC1T45DBVR
NASOT-23-6
6
Inverting, Transceiver, Translator
1.2 V
1.5 V
3.6 V
6 Weeks
1 (Unlimited)
- TXB0101DBVRNA
SOT-23-6
6
Translator
1.2 V
1.5 V
5.5 V
6 Weeks
1 (Unlimited)
SN74AVC1T45DBVR
VS
TXB0101DBVR
- TXS0101DBVRNA
SOT-23-6
6
Translator
1.65 V
1.8 V
5.5 V
6 Weeks
1 (Unlimited)
SN74AVC1T45DBVR
VS
TXS0101DBVR
- SN74AUP1G125DBVRNA
SC-74A, SOT-753
5
Buffer, Inverting
-
1.2 V
-
6 Weeks
1 (Unlimited)
SN74AVC1T45DBVR
VS
SN74AUP1G125DBVR
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1. Understand the shipping rules of the destination country
Different countries have different regulations for shipping electronic equipment, check for certain certifications, and read the destination country's guidelines before shipping to prevent delays or confiscation of goods by customs.
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4. How long does it take to ship the electronic components?
If electronic component in stock, it is usually shipped before 5 o'clock on the same day, and it usually takes 5-10 working days to complete it by international express.
If it is a scheduled component, it needs to wait for the arrival of the parts, and then it will be inspected before delivery. If there are special circumstances, the sales staff will confirm with you. Weekends and holidays will also affect the delivery time of electronic products.
1. We provide 365 days warranty for all electronic components.
2. If you need a test report, please let us know. We have a long-term cooperative testing laboratory. If you have familiar testing laboratory, we can also ship to your designated laboratory for testing.
3. Where does Aztec Electronics mainly purchase electronic components from?
Distributors, free market, 48 global large-scale OEM factories in close contact with us (Great Price advantage, 100% original)
2.Are the Texas Instruments Incorporated (TI)'s SN74AVC1T45DBVR price and stock displayed on the website accurate?
Aztec Electronics inventory fluctuates greatly and cannot be updated in time, it is recommended to confirm the order with Aztec Electronics salesperson or online customer service before payment.
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After the electronic components have passed the quality inspection of Aztec Electronics, there are generally the following five packaging forms for electronic components: Tape, Tube, Tray, Bulk and Ammo.
Tape/Reel | Tube | Tray | Bulk | Ammo |
Weave bulk chips into tapes and pack them into reels through SMD components packaging Tape Machine. Reel is the most commonly used. | When packaging, arrange the components in the same direction and put them into plastic tubes one at a time. | Choose tray package with the same specifications as the original manufacturer, put the components into the tray and use the strapping machine. | Bulk packaging means that the SMD components are freely packaged in a formed plastic box or bag. | Adhesive tape cut continuously in predetermined quantities. The cut strips are placed in boxes for safekeeping. |
Choose electronic components that are vacuum-sealed against water, dust, moisture, oxidation, corrosion, and even UV or RF pollution.
How to pack electronic components in cartons?
1. Choose the right box for your electronic components2. Use anti-static bubble film protect electronic component
3. Put it into the box, no buffer dead corner, 360-degree package.
4. Labeled as fragile to ensure that the courier knows what needs to be done with the package.
Texas Instruments Incorporated (TI) was founded in 1930 and is headquartered in Dallas, Texas, USA. Haviv Ilan is the President and CEO. They design, manufacture, test and sell analog and embedded semiconductors. Industrial and automotive markets are the best markets for their products .
The company focuses on amplifiers, audio, clock and timing, data converters, die and wafer services, DLP® products, interfaces, isolation devices, logic, microcontrollers (MCUs) and processors, motor drivers, power management, radio frequency & Microwaves, Sensors, Switches & Multiplexers, Wireless Connectivity.
Their values: Trustworthy, Inclusive, Innovative, Competitive, Results-oriented
Acquisition history:
In October 1999, TI acquired power Trends
In 2000, TI acquired Burr Brown (BB) at approximately $7.6 billion.
In September 2011, TI acquired National semiconductor(NS.NSC) for US$6.5 billion.
In 2021, TI acquired an operational 300mm fabrication plant located in Lehi, Utah from Micron for $900 million.
Main application fields:
Automotive, Communications Equipment, Enterprise Systems, Industrial Applications, Aerospace and Defense, Appliances, Building Automation, Factory Automation and Control, Grid Infrastructure, Industrial Transportation (non-automotive and non-light truck), Lighting, Medical, Motor Drives, Power Delivery, Pro Audio, Video & Signage, Retail Automation & Payments, Test & Measurement, Personal Electronics.