Texas Instruments TXS0102DCTT
TXS0102DCTT
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Texas Instruments TXS0102DCTT information
Type
Parameter
Factory Lead Time
6 Weeks
Lifecycle Status
ACTIVE (Last Updated: 4 days ago)
Contact Plating
Gold
Mount
Surface Mount
Mounting Type
Surface Mount
Package / Case
8-LSSOP, 8-MSOP (0.110, 2.80mm Width)
Number of Pins
8
Weight
23.388357mg
Operating Temperature
-40°C~85°C TA
Packaging
Tape & Reel (TR)
JESD-609 Code
e4
Feature
Auto-Direction Sensing
Pbfree Code
yes
Part Status
Active
Moisture Sensitivity Level (MSL)
1 (Unlimited)
Number of Terminations
8
ECCN Code
EAR99
Subcategory
Other Interface ICs
Terminal Position
DUAL
Terminal Form
GULL WING
Peak Reflow Temperature (Cel)
260
Number of Functions
1
Supply Voltage
1.8V
Terminal Pitch
0.65mm
Base Part Number
TXS0102
Pin Count
8
Output Type
Open Drain, Push-Pull
Number of Channels
2
Number of Circuits
1
Max Supply Voltage
5.5V
Min Supply Voltage
1.65V
Output Current
1mA
Number of Bits
2
Propagation Delay
260 ns
Quiescent Current
14.4μA
Turn On Delay Time
260 ns
Logic Function
Translator
Data Rate
24Mbps
Output Characteristics
3-STATE
Interface IC Type
INTERFACE CIRCUIT
High Level Output Current
-20μA
Channel Type
Bidirectional
Low Level Output Current
1mA
Supply Voltage1-Nom
2.5V
Translator Type
Voltage Level
Voltage - VCCA
1.65V~3.6V
Voltage - VCCB
2.3V~5.5V
Height
1.3mm
Length
2.95mm
Width
2.8mm
Thickness
1.29mm
Radiation Hardening
No
REACH SVHC
No SVHC
RoHS Status
ROHS3 Compliant
Lead Free
Lead Free
- PCN Assembly/Origin :
TXS0102DCTT Overview
Embedded in the 8-LSSOP, 8-MSOP (0.110, 2.80mm Width) package, it is available for you to use.Packaged as Tape & Reel (TR).Open Drain, Push-Pull is used for the output it is configured with.Level translators has the translator type Voltage Level.Electronic parts are mounted using the Surface Mount method.The Channel type of this electrical device is Bidirectional.Operation is performed at -40°C~85°C TA.In order to achieve its superior flexibility, 1 circuits are used.As part of the transmission line termination process, there are a total of 8 terminations.Parts that are related to TXS0102 can be identified based on its base part number.In order for it to operate, it needs to be powered by a voltage of 1.8V.The device has a pin count of 8.There are 8 pins on it.Electronic parts are designed with a number of bits of 2.Level translators supports the maximal supply voltage of 5.5V.In order for the machine to operate, the supply voltage must be 1.65V.1.65V~3.6V is the supply rail configuration on the VCCA.2.3V~5.5V is the configuration of the VCCB supply rail.This mount is done using the method of Surface Mount.2 is the number of channels.As part of Other Interface ICs, it belongs.Level translators consumes 14.4μA of quiescent current wLevel translatorshout being affected by outside factors.When operating, Auto-Direction Sensing is guaranteed.Because it features a 1mA output current, maximum design flexibility can be achieved.
TXS0102DCTT Features
8-LSSOP, 8-MSOP (0.110, 2.80mm Width) package
1 circuits
8 pin count
8 pins
TXS0102DCTT Applications
There are a lot of Texas Instruments TXS0102DCTT voltage translators & level shifters applications.
- Electronic Points of Sale
- Telematics
- UART
- Driving indicator LEDs or buzzers
- Notebook
- Servers
- General purpose I/O level shifting
- One Assembly and Test Site
- Controlled Baseline
- Public Signage
- ImagePart NumberManufacturerPackage / CaseNumber of PinsLogic FunctionNumber of CircuitsPropagation DelayLow Level Output CurrentHigh Level Output CurrentMin Supply VoltageSupply VoltageSupply Voltage1-NomView Compare
TXS0102DCTT
NA8-LSSOP, 8-MSOP (0.110, 2.80mm Width)
8
Translator
1
260 ns
1 mA
-20 μA
1.65 V
1.8 V
2.5 V
- SN74LVC2T45DCTTNA
8-LSSOP, 8-MSOP (0.110, 2.80mm Width)
8
Transceiver, Translator
1
17.7 ns
32 mA
-32 mA
1.65 V
1.8 V
-
TXS0102DCTT
VS
SN74LVC2T45DCTT
- SN74LVC2T45DCTRNA
8-LSSOP, 8-MSOP (0.110, 2.80mm Width)
8
Transceiver, Translator
1
45.2 ns
32 mA
-32 mA
1.65 V
1.8 V
-
TXS0102DCTT
VS
SN74LVC2T45DCTR
- SN74LVC2T45DCTRE4NA
8-LSSOP, 8-MSOP (0.110, 2.80mm Width)
8
Transceiver, Translator
1
45.2 ns
32 mA
-32 mA
1.65 V
1.8 V
-
TXS0102DCTT
VS
SN74LVC2T45DCTRE4
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After the electronic components have passed the quality inspection of Aztec Electronics, there are generally the following five packaging forms for electronic components: Tape, Tube, Tray, Bulk and Ammo.
Tape/Reel | Tube | Tray | Bulk | Ammo |
Weave bulk chips into tapes and pack them into reels through SMD components packaging Tape Machine. Reel is the most commonly used. | When packaging, arrange the components in the same direction and put them into plastic tubes one at a time. | Choose tray package with the same specifications as the original manufacturer, put the components into the tray and use the strapping machine. | Bulk packaging means that the SMD components are freely packaged in a formed plastic box or bag. | Adhesive tape cut continuously in predetermined quantities. The cut strips are placed in boxes for safekeeping. |
Choose electronic components that are vacuum-sealed against water, dust, moisture, oxidation, corrosion, and even UV or RF pollution.
How to pack electronic components in cartons?
1. Choose the right box for your electronic components2. Use anti-static bubble film protect electronic component
3. Put it into the box, no buffer dead corner, 360-degree package.
4. Labeled as fragile to ensure that the courier knows what needs to be done with the package.
Texas Instruments Incorporated (TI) was founded in 1930 and is headquartered in Dallas, Texas, USA. Haviv Ilan is the President and CEO. They design, manufacture, test and sell analog and embedded semiconductors. Industrial and automotive markets are the best markets for their products .
The company focuses on amplifiers, audio, clock and timing, data converters, die and wafer services, DLP® products, interfaces, isolation devices, logic, microcontrollers (MCUs) and processors, motor drivers, power management, radio frequency & Microwaves, Sensors, Switches & Multiplexers, Wireless Connectivity.
Their values: Trustworthy, Inclusive, Innovative, Competitive, Results-oriented
Acquisition history：
In October 1999, TI acquired power Trends
In 2000, TI acquired Burr Brown (BB) at approximately $7.6 billion.
In September 2011, TI acquired National semiconductor(NS.NSC) for US$6.5 billion.
In 2021, TI acquired an operational 300mm fabrication plant located in Lehi, Utah from Micron for $900 million.
Main application fields:
Automotive, Communications Equipment, Enterprise Systems, Industrial Applications, Aerospace and Defense, Appliances, Building Automation, Factory Automation and Control, Grid Infrastructure, Industrial Transportation (non-automotive and non-light truck), Lighting, Medical, Motor Drives, Power Delivery, Pro Audio, Video & Signage, Retail Automation & Payments, Test & Measurement, Personal Electronics.
