Texas Instruments TXS0102YZPR
TXS0102YZPR
In Stock:94131
Qty
Unit Price
Ext Price
1
$0.970000
$0.970000
10
$0.911000
$9.110000
100
$0.859800
$85.980000
500
$0.811180
$405.590000
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Texas Instruments TXS0102YZPR information
Type
Parameter
Factory Lead Time
12 Weeks
Lifecycle Status
ACTIVE (Last Updated: 2 days ago)
Contact Plating
Copper, Silver, Tin
Mount
Surface Mount
Mounting Type
Surface Mount
Package / Case
8-XFBGA, DSBGA
Number of Pins
8
Weight
2.296311mg
Operating Temperature
-40°C~85°C TA
Packaging
Tape & Reel (TR)
JESD-609 Code
e1
Feature
Auto-Direction Sensing
Pbfree Code
yes
Part Status
Active
Moisture Sensitivity Level (MSL)
1 (Unlimited)
Number of Terminations
8
ECCN Code
EAR99
Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)
Subcategory
Other Interface ICs
Terminal Position
BOTTOM
Terminal Form
BALL
Peak Reflow Temperature (Cel)
260
Number of Functions
1
Supply Voltage
1.8V
Terminal Pitch
0.5mm
Base Part Number
TXS0102
Pin Count
8
Output Type
Open Drain, Push-Pull
Number of Channels
2
Number of Circuits
1
Max Supply Voltage
5.5V
Min Supply Voltage
1.65V
Output Current
1mA
Number of Bits
2
Propagation Delay
260 ns
Quiescent Current
14.4μA
Turn On Delay Time
102 ns
Logic Function
Translator
Data Rate
24Mbps
Output Characteristics
3-STATE
Rise Time
165ns
Interface IC Type
INTERFACE CIRCUIT
High Level Output Current
-20μA
Channel Type
Bidirectional
Low Level Output Current
1mA
Supply Voltage1-Nom
2.5V
Translator Type
Voltage Level
Voltage - VCCA
1.65V~3.6V
Voltage - VCCB
2.3V~5.5V
Height
500μm
Length
1.25mm
Width
2.25mm
Thickness
310μm
Radiation Hardening
No
REACH SVHC
No SVHC
RoHS Status
ROHS3 Compliant
Lead Free
Lead Free
- PCN Design/Specification :
- PCN Assembly/Origin :
- PCN Packaging :
TXS0102YZPR Overview
Package 8-XFBGA, DSBGA includes it.Tape & Reel (TR) is the way in which it is packaged.In this configuration, the output is set to Open Drain, Push-Pull.This electrical device has a translator type of Voltage Level.Electronic parts are mounted using the Surface Mount method.A Bidirectional channel type is associated with this electrical device.Level translators is -40°C~85°C TA at the operating temperature.1 circuits are used to achieve its superior flexibility.There are 8 terminations, which are the practice of ending a transmission line with a device that matches the characteristic impedance of the line.A base part number TXS0102 indicates the related parts.This device is powered by a supply voltage of 1.8V which is applied to it.Level translators is equipped wLevel translatorsh 8 pin count.There are 8 pins on it.An electronic part with 2 bits is designed.5.5V is the maximum supply voltage it can handle.There is a minimum supply voltage of 1.65V for it.In the VCCA, the supply rail is set to 1.65V~3.6V.VCCB is configured with a supply rail that starts at 2.3V~5.5V.Mounting this electronic component is done using the Surface Mount method.There are 2 channels.As part of Other Interface ICs, this part is included.The quiescent current consumed by it is 14.4μA because it is unaffected by external factors.Operating can ensure that Auto-Direction Sensing is achieved.The output current of 1mA makes it feature maximum design flexibility.
TXS0102YZPR Features
8-XFBGA, DSBGA package
1 circuits
8 pin count
8 pins
TXS0102YZPR Applications
There are a lot of Texas Instruments TXS0102YZPR voltage translators & level shifters applications.
- One Fabrication Site
- Industrial equipment
- Motor Drives
- GPIO
- Wearable Health and Fitness Devices
- One Assembly and Test Site
- Driving indicator LEDs or buzzers
- Product Traceability
- Monitors
- Available in Military (–55°C/125°C) Temperature Range
- ImagePart NumberManufacturerPackage / CaseNumber of PinsLogic FunctionNumber of CircuitsPropagation DelayLow Level Output CurrentHigh Level Output CurrentMin Supply VoltageSupply VoltageSupply Voltage1-NomView Compare
TXS0102YZPR
NA8-XFBGA, DSBGA
8
Translator
1
260 ns
1 mA
-20 μA
1.65 V
1.8 V
2.5 V
- SN74LVC2G126YZPRNA
8-XFBGA, DSBGA
8
Buffer, Inverting
-
3.2 ns
-
-
-
1.8 V
-
TXS0102YZPR
VS
SN74LVC2G126YZPR
- SN74LVC2G241YZPRNA
8-XFBGA, DSBGA
8
Buffer, Inverting
-
4.3 ns
-
-
-
1.8 V
-
TXS0102YZPR
VS
SN74LVC2G241YZPR
- SN74LVC2G86YZPRNA
8-XFBGA, DSBGA
8
OR, XOR
-
3.6 ns
-
-
-
1.8 V
-
TXS0102YZPR
VS
SN74LVC2G86YZPR
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We take great care when shipping electronics overseas. Both the U.S. and U.K. governments have imposed restrictions on air transport of electronics, according to the International Air Transport Association.
1. Understand the shipping rules of the destination country
Different countries have different regulations for shipping electronic equipment, check for certain certifications, and read the destination country's guidelines before shipping to prevent delays or confiscation of goods by customs.
2. Choose a reliable express logistics provider
From providing pick-up service to checking the status with real-time order number, conveniently track packages. At present, the logistics providers we cooperate with more include DHL, UPS, Fedex, TXT.
Of course, if you have a long-term cooperative freight forwarder or your own company's logistics account, you can pick up the goods directly from our warehouse
3. How much does it cost to ship the electronic components?
The shipping cost of electronic products depends on the size and weight of the package and the shipping distance. You can first ask us about the size/weight of the products we sell to estimate the shipping cost.
4. How long does it take to ship the electronic components?
If electronic component in stock, it is usually shipped before 5 o'clock on the same day, and it usually takes 5-10 working days to complete it by international express.
If it is a scheduled component, it needs to wait for the arrival of the parts, and then it will be inspected before delivery. If there are special circumstances, the sales staff will confirm with you. Weekends and holidays will also affect the delivery time of electronic products.
1. We provide 365 days warranty for all electronic components.
2. If you need a test report, please let us know. We have a long-term cooperative testing laboratory. If you have familiar testing laboratory, we can also ship to your designated laboratory for testing.
3. Where does Aztec Electronics mainly purchase electronic components from?
Distributors, free market, 48 global large-scale OEM factories in close contact with us (Great Price advantage, 100% original)
2.Are the Texas Instruments Incorporated (TI)'s TXS0102YZPR price and stock displayed on the website accurate?
Aztec Electronics inventory fluctuates greatly and cannot be updated in time, it is recommended to confirm the order with Aztec Electronics salesperson or online customer service before payment.
You Also Ask
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Need Any Service, please feel free contact us.
After the electronic components have passed the quality inspection of Aztec Electronics, there are generally the following five packaging forms for electronic components: Tape, Tube, Tray, Bulk and Ammo.
Tape/Reel | Tube | Tray | Bulk | Ammo |
Weave bulk chips into tapes and pack them into reels through SMD components packaging Tape Machine. Reel is the most commonly used. | When packaging, arrange the components in the same direction and put them into plastic tubes one at a time. | Choose tray package with the same specifications as the original manufacturer, put the components into the tray and use the strapping machine. | Bulk packaging means that the SMD components are freely packaged in a formed plastic box or bag. | Adhesive tape cut continuously in predetermined quantities. The cut strips are placed in boxes for safekeeping. |
Choose electronic components that are vacuum-sealed against water, dust, moisture, oxidation, corrosion, and even UV or RF pollution.
How to pack electronic components in cartons?
1. Choose the right box for your electronic components2. Use anti-static bubble film protect electronic component
3. Put it into the box, no buffer dead corner, 360-degree package.
4. Labeled as fragile to ensure that the courier knows what needs to be done with the package.
Texas Instruments Incorporated (TI) was founded in 1930 and is headquartered in Dallas, Texas, USA. Haviv Ilan is the President and CEO. They design, manufacture, test and sell analog and embedded semiconductors. Industrial and automotive markets are the best markets for their products .
The company focuses on amplifiers, audio, clock and timing, data converters, die and wafer services, DLP® products, interfaces, isolation devices, logic, microcontrollers (MCUs) and processors, motor drivers, power management, radio frequency & Microwaves, Sensors, Switches & Multiplexers, Wireless Connectivity.
Their values: Trustworthy, Inclusive, Innovative, Competitive, Results-oriented
Acquisition history:
In October 1999, TI acquired power Trends
In 2000, TI acquired Burr Brown (BB) at approximately $7.6 billion.
In September 2011, TI acquired National semiconductor(NS.NSC) for US$6.5 billion.
In 2021, TI acquired an operational 300mm fabrication plant located in Lehi, Utah from Micron for $900 million.
Main application fields:
Automotive, Communications Equipment, Enterprise Systems, Industrial Applications, Aerospace and Defense, Appliances, Building Automation, Factory Automation and Control, Grid Infrastructure, Industrial Transportation (non-automotive and non-light truck), Lighting, Medical, Motor Drives, Power Delivery, Pro Audio, Video & Signage, Retail Automation & Payments, Test & Measurement, Personal Electronics.