Texas Instruments TXS0102DCUR
TXS0102DCUR
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Texas Instruments TXS0102DCUR information
Type
Parameter
Factory Lead Time
6 Weeks
Lifecycle Status
ACTIVE (Last Updated: 3 days ago)
Mounting Type
Surface Mount
Package / Case
8-VFSOP (0.091, 2.30mm Width)
Surface Mount
YES
Number of Pins
8
Weight
9.610488mg
Operating Temperature
-40°C~85°C TA
Packaging
Tape & Reel (TR)
JESD-609 Code
e4
Feature
Auto-Direction Sensing
Pbfree Code
yes
Part Status
Active
Moisture Sensitivity Level (MSL)
1 (Unlimited)
Number of Terminations
8
ECCN Code
EAR99
Terminal Finish
Nickel/Palladium/Gold (Ni/Pd/Au)
Subcategory
Other Interface ICs
Terminal Position
DUAL
Terminal Form
GULL WING
Peak Reflow Temperature (Cel)
260
Number of Functions
1
Supply Voltage
1.8V
Terminal Pitch
0.5mm
Base Part Number
TXS0102
Pin Count
8
Output Type
Open Drain, Push-Pull
Number of Channels
2
Number of Circuits
1
Max Supply Voltage
5.5V
Min Supply Voltage
1.65V
Nominal Supply Current
14.4μA
Output Current
1mA
Number of Bits
2
Propagation Delay
4.6 ns
Quiescent Current
14.4μA
Turn On Delay Time
260 ns
Logic Function
Translator
Data Rate
24Mbps
Output Characteristics
3-STATE
Rise Time
165ns
Interface IC Type
INTERFACE CIRCUIT
High Level Output Current
-20μA
Channel Type
Bidirectional
Low Level Output Current
1mA
Supply Voltage1-Nom
2.5V
Max Junction Temperature (Tj)
150°C
Ambient Temperature Range High
85°C
Translator Type
Voltage Level
Voltage - VCCA
1.65V~3.6V
Voltage - VCCB
2.3V~5.5V
Height
900μm
Length
2.3mm
Width
2mm
Thickness
850μm
Radiation Hardening
No
REACH SVHC
No SVHC
RoHS Status
ROHS3 Compliant
Lead Free
Lead Free
- Datasheets :
TXS0102DCUR Overview
Embedded in the 8-VFSOP (0.091, 2.30mm Width) package, it is available for you to use.A Tape & Reel (TR) package is used to package it.Level translators uses Open Drain, Push-Pull as level translatorss output configuration.Its translator type is Voltage Level.Surface Mount is the way in which this electronic part is mounted.This electrical device has channel type Bidirectional.A temperature of -40°C~85°C TA is used for operation.Level translators achieves superior flexibilLevel translatorsy by using 1 circuLevel translatorss.Usually, when a transmission line is terminated, there are 8 termination points used.Parts that are related to TXS0102 can be identified based on its base part number.In order for it to operate, it needs to be powered by a voltage of 1.8V.A total of 8 pins are included.Designed with 8 pins, it is compatible with a wide range of devices.There are 2 bits in this electronic part, which means it is designed in such a way.Supports a voltage of 5.5V as its maximum supply voltage.The minimal supply voltage is 1.65V.From 1.65V~3.6V, the supply rail of the VCCA is configured.2.3V~5.5V is the configuration of the VCCB supply rail.There are no channels.As part of Other Interface ICs, this part is included.Level translators consumes 14.4μA of quiescent current wLevel translatorshout being affected by external factors. When operating, Auto-Direction Sensing is guaranteed.The output current of 1mA makes it feature maximum design flexibility.
TXS0102DCUR Features
8-VFSOP (0.091, 2.30mm Width) package
1 circuits
8 pin count
8 pins
TXS0102DCUR Applications
There are a lot of Texas Instruments TXS0102DCUR voltage translators & level shifters applications.
- Wireless and Telecom Infrastructures
- Advanced Driver Assistance System (ADAS)
- Motor Drives
- Eliminate slow or noisy input signals
- Infotainment Head Unit
- Telecom
- ADAS Fusion
- SMBus
- Public Signage
- Available in Military (–55°C/125°C) Temperature Range
- ImagePart NumberManufacturerPackage / CaseNumber of PinsLogic FunctionNumber of CircuitsPropagation DelayLow Level Output CurrentHigh Level Output CurrentMin Supply VoltageSupply VoltageSupply Voltage1-NomMax Supply VoltageView Compare
TXS0102DCUR
NA8-VFSOP (0.091, 2.30mm Width)
8
Translator
1
4.6 ns
1 mA
-20 μA
1.65 V
1.8 V
2.5 V
5.5 V
- SN74LVC2T45DCURG4NA
8-VFSOP (0.091, 2.30mm Width)
8
Transceiver, Translator
1
3.5 ns
32 mA
-32 mA
1.65 V
1.8 V
-
5.5 V
TXS0102DCUR
VS
SN74LVC2T45DCURG4
- SN74LVC2T45DCURNA
8-VFSOP (0.091, 2.30mm Width)
8
Transceiver, Translator
1
45.2 ns
32 mA
-32 mA
1.65 V
1.8 V
-
5.5 V
TXS0102DCUR
VS
SN74LVC2T45DCUR
74LVC2T45DC-Q100HNexperia USA Inc.8-VFSOP (0.091, 2.30mm Width)
8
Transceiver, Translator
1
5.1 ns
32 mA
-32 mA
1.2 V
1.5 V
-
5.5 V
TXS0102DCUR
VS
74LVC2T45DC-Q100H
- TXS0102QDCURQ1NA
8-VFSOP (0.091, 2.30mm Width)
8
Translator
1
10 ns
1 mA
-20 μA
1.65 V
1.8 V
-
5.5 V
TXS0102DCUR
VS
TXS0102QDCURQ1
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After the electronic components have passed the quality inspection of Aztec Electronics, there are generally the following five packaging forms for electronic components: Tape, Tube, Tray, Bulk and Ammo.
Tape/Reel | Tube | Tray | Bulk | Ammo |
Weave bulk chips into tapes and pack them into reels through SMD components packaging Tape Machine. Reel is the most commonly used. | When packaging, arrange the components in the same direction and put them into plastic tubes one at a time. | Choose tray package with the same specifications as the original manufacturer, put the components into the tray and use the strapping machine. | Bulk packaging means that the SMD components are freely packaged in a formed plastic box or bag. | Adhesive tape cut continuously in predetermined quantities. The cut strips are placed in boxes for safekeeping. |
Choose electronic components that are vacuum-sealed against water, dust, moisture, oxidation, corrosion, and even UV or RF pollution.
How to pack electronic components in cartons?
1. Choose the right box for your electronic components2. Use anti-static bubble film protect electronic component
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Texas Instruments Incorporated (TI) was founded in 1930 and is headquartered in Dallas, Texas, USA. Haviv Ilan is the President and CEO. They design, manufacture, test and sell analog and embedded semiconductors. Industrial and automotive markets are the best markets for their products .
The company focuses on amplifiers, audio, clock and timing, data converters, die and wafer services, DLP® products, interfaces, isolation devices, logic, microcontrollers (MCUs) and processors, motor drivers, power management, radio frequency & Microwaves, Sensors, Switches & Multiplexers, Wireless Connectivity.
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Acquisition history：
In October 1999, TI acquired power Trends
In 2000, TI acquired Burr Brown (BB) at approximately $7.6 billion.
In September 2011, TI acquired National semiconductor(NS.NSC) for US$6.5 billion.
In 2021, TI acquired an operational 300mm fabrication plant located in Lehi, Utah from Micron for $900 million.
Main application fields:
Automotive, Communications Equipment, Enterprise Systems, Industrial Applications, Aerospace and Defense, Appliances, Building Automation, Factory Automation and Control, Grid Infrastructure, Industrial Transportation (non-automotive and non-light truck), Lighting, Medical, Motor Drives, Power Delivery, Pro Audio, Video & Signage, Retail Automation & Payments, Test & Measurement, Personal Electronics.
