Xilinx Inc. XC7Z045-1FBG676C
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Xilinx Inc. XC7Z045-1FBG676C information
Type
Parameter
Factory Lead Time
10 Weeks
Contact Plating
Copper, Silver, Tin
Package / Case
676-BBGA, FCBGA
Surface Mount
YES
Number of Pins
676
Operating Temperature
0°C~85°C TJ
Packaging
Tray
Published
2009
Series
Zynq®-7000
JESD-609 Code
e1
Part Status
Active
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Number of Terminations
676
ECCN Code
3A991.D
Terminal Finish
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
HTS Code
8542.39.00.01
Technology
CMOS
Terminal Position
BOTTOM
Terminal Form
BALL
Peak Reflow Temperature (Cel)
245
Supply Voltage
1V
Terminal Pitch
1mm
Frequency
667MHz
Reflow Temperature-Max (s)
30
Base Part Number
XC7Z045
Interface
CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
Max Supply Voltage
3.3V
Min Supply Voltage
1.2V
Number of I/O
130
RAM Size
256KB
Memory Type
ROMless
Core Processor
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Peripherals
DMA
Connectivity
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture
MCU, FPGA
Data Bus Width
32b
Number of Logic Elements/Cells
190000
Core Architecture
ARM
Boundary Scan
YES
Speed Grade
-1
RAM (words)
256000
Primary Attributes
Kintex™-7 FPGA, 350K Logic Cells
Bus Compatibility
CAN; ETHERNET; I2C; SPI; UART; USB
Height Seated (Max)
2.54mm
Length
27mm
Radiation Hardening
No
RoHS Status
ROHS3 Compliant
- Datasheets :
- Environmental Information :
- PCN Design/Specification :
- PCN Assembly/Origin :
- PCN Packaging :
This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).
There are Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processors in this SoC.Assigned with the package 676-BBGA, FCBGA, this system on a chip comes from the manufacturer.With 256KB RAM implemented, this SoC chip provides users with a high level of performance.The SoC design uses MCU, FPGA architecture for its internal architecture.It is part of the Zynq?-7000 series of system on a chips.This SoC meaning should have an average operating temperature of 0°C~85°C TJ when it is operating normally.Taking note of the fact that this SoC security combines Kintex?-7 FPGA, 350K Logic Cells is important.In the state-of-the-art Tray package, this SoC system on a chip is housed.As a whole, this SoC part includes 130 I/Os.Use a power supply with a voltage of 1V if possible.It is really beneficial to have system on a chip since there are 676 terminations in total.It is possible to find system on chips that are similar in specs and purpose by searching for XC7Z045.In this wireless SoC, the frequency is set to 667MHz.In terms of core architecture, the SoC meaning relies on ARM.This is the 676-pin version of the computer SoC.Voltage of maximum supply is 3.3V.A minimum of 1.2V are supplied to it.
Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM
There are a lot of Xilinx Inc.
XC7Z045-1FBG676C System On Chip (SoC) applications.
- Special Issue Editors
- String inverter
- Digital Media
- Industrial sectors
- POS Terminals
- PC peripherals
- Networked sensors
- Measurement testers
- Medical Pressure
- Automated sorting equipment
- ImagePart NumberManufacturerPackage / CaseNumber of PinsData Bus WidthInterfaceMemory TypeMin Supply VoltageSupply VoltageMax Supply VoltageView Compare
XC7Z045-1FBG676C
Xilinx Inc.676-BBGA, FCBGA
676
32 b
CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
ROMless
1.2 V
1 V
3.3 V
- XC7Z030-1FFG676IXilinx Inc.
676-BBGA, FCBGA
676
32 b
CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
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-
1 V
-
XC7Z045-1FBG676C
VS
XC7Z030-1FFG676I
MCIMX6D7CVT08ACNXP USA Inc.624-FBGA, FCBGA
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-
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XC7Z045-1FBG676C
VS
MCIMX6D7CVT08AC
- XC7Z030-1FBG676CXilinx Inc.
676-BBGA, FCBGA
676
32 b
CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
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-
1 V
-
XC7Z045-1FBG676C
VS
XC7Z030-1FBG676C
- XC7Z030-1FFG676CXilinx Inc.
676-BBGA, FCBGA
676
32 b
CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
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-
1 V
-
XC7Z045-1FBG676C
VS
XC7Z030-1FFG676C
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Tape/Reel | Tube | Tray | Bulk | Ammo |
Weave bulk chips into tapes and pack them into reels through SMD components packaging Tape Machine. Reel is the most commonly used. | When packaging, arrange the components in the same direction and put them into plastic tubes one at a time. | Choose tray package with the same specifications as the original manufacturer, put the components into the tray and use the strapping machine. | Bulk packaging means that the SMD components are freely packaged in a formed plastic box or bag. | Adhesive tape cut continuously in predetermined quantities. The cut strips are placed in boxes for safekeeping. |
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