Xilinx Inc. XC7Z020-1CLG484C
XC7Z020-1CLG484C
In Stock:94131
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$84.340000
$84.340000
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$79.570000
$795.700000
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Xilinx Inc. XC7Z020-1CLG484C information
Type
Parameter
Factory Lead Time
10 Weeks
Contact Plating
Copper, Silver, Tin
Package / Case
484-LFBGA, CSPBGA
Surface Mount
YES
Number of Pins
2
Operating Temperature
0°C~85°C TJ
Packaging
Tray
Published
2009
Series
Zynq®-7000
JESD-609 Code
e1
Part Status
Active
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Number of Terminations
484
ECCN Code
3A991.D
Terminal Finish
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
Technology
CMOS
Terminal Position
BOTTOM
Terminal Form
BALL
Peak Reflow Temperature (Cel)
260
Supply Voltage
1V
Terminal Pitch
0.8mm
Frequency
667MHz
Reflow Temperature-Max (s)
30
Base Part Number
XC7Z020
JESD-30 Code
S-PBGA-B484
Interface
CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
Max Supply Voltage
3.3V
Min Supply Voltage
1.2V
Number of I/O
130
RAM Size
256KB
Core Processor
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Peripherals
DMA
Connectivity
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture
MCU, FPGA
Data Bus Width
32b
Core Architecture
ARM
Boundary Scan
YES
Speed Grade
-1
Primary Attributes
Artix™-7 FPGA, 85K Logic Cells
Height Seated (Max)
1.6mm
Length
19mm
Radiation Hardening
No
RoHS Status
ROHS3 Compliant
- Datasheets :
- Environmental Information :
- PCN Design/Specification :
- PCN Assembly/Origin :
This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).
A core processor Dual ARM? Cortex?-A9 MPCore? with CoreSight? is used to build this SoC.Its package is 484-LFBGA, CSPBGA.A SoC chip with 256KB RAM is provided for users to enjoy reliable performance.The internal architecture of this SoC design utilizes the MCU, FPGA technique.The system on a chip is part of the series Zynq?-7000.In general, this SoC meaning should operate at a temperature of 0°C~85°C TJ on a regular basis.As one of the most important things to note is that this SoC security combines Artix?-7 FPGA, 85K Logic Cells together.An advanced Tray package houses this SoC system on a chip.An integral part of this SoC consists of a total of 130 I/Os.A power supply with a 1V voltage rating should be utilized when using this system on chip SoC.system on a chip benefits from 484 terminations.XC7Z020 can help you find system on chips with similar specs and purposes.The wireless SoC works at a frequency of 667MHz.There is no doubt that the SoC meaning is based on the core architecture of ARM.The computer SoC is available in 2-pin form.Voltage of maximum supply is 3.3V.The SoC security receives at least 1.2V watts of power.
Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM
There are a lot of Xilinx Inc.
XC7Z020-1CLG484C System On Chip (SoC) applications.
- Body control module
- Smart appliances
- Microcontroller based SoC ( RISC-V, ARM)
- USB hard disk enclosure
- RISC-V
- High-end PLC
- Optical drive
- Temperature Sensors
- Flow Sensors
- Personal Computers
- ImagePart NumberManufacturerPackage / CaseNumber of PinsNumber of I/ORAM SizePeripheralsTerminal PositionPackagingTerminal PitchView Compare
XC7Z020-1CLG484C
Xilinx Inc.484-LFBGA, CSPBGA
2
130
256KB
DMA
BOTTOM
Tray
0.8 mm
- XC7Z020-3CLG484EXilinx Inc.
484-LFBGA, CSPBGA
484
130
256KB
DMA
BOTTOM
Tray
0.8 mm
XC7Z020-1CLG484C
VS
XC7Z020-3CLG484E
- XC7Z020-2CLG484IXilinx Inc.
484-LFBGA, CSPBGA
484
130
256KB
DMA
BOTTOM
Tray
0.8 mm
XC7Z020-1CLG484C
VS
XC7Z020-2CLG484I
XC7Z010-1CLG400CXilinx Inc.400-LFBGA, CSPBGA
400
130
256KB
DMA
BOTTOM
Tray
0.8 mm
XC7Z020-1CLG484C
VS
XC7Z010-1CLG400C
M2GL005-VFG400Microsemi Corporation400-LFBGA
400
169
87.9 kB
-
BOTTOM
Tray
0.8 mm
XC7Z020-1CLG484C
VS
M2GL005-VFG400
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After the electronic components have passed the quality inspection of Aztec Electronics, there are generally the following five packaging forms for electronic components: Tape, Tube, Tray, Bulk and Ammo.
Tape/Reel | Tube | Tray | Bulk | Ammo |
Weave bulk chips into tapes and pack them into reels through SMD components packaging Tape Machine. Reel is the most commonly used. | When packaging, arrange the components in the same direction and put them into plastic tubes one at a time. | Choose tray package with the same specifications as the original manufacturer, put the components into the tray and use the strapping machine. | Bulk packaging means that the SMD components are freely packaged in a formed plastic box or bag. | Adhesive tape cut continuously in predetermined quantities. The cut strips are placed in boxes for safekeeping. |
Choose electronic components that are vacuum-sealed against water, dust, moisture, oxidation, corrosion, and even UV or RF pollution.
How to pack electronic components in cartons?
1. Choose the right box for your electronic components2. Use anti-static bubble film protect electronic component
3. Put it into the box, no buffer dead corner, 360-degree package.
4. Labeled as fragile to ensure that the courier knows what needs to be done with the package.
