Xilinx Inc. XC7Z007S-1CLG225C
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Xilinx Inc. XC7Z007S-1CLG225C information
Type
Parameter
Factory Lead Time
10 Weeks
Package / Case
225-LFBGA, CSPBGA
Surface Mount
YES
Operating Temperature
0°C~85°C TJ
Packaging
Tray
Published
2016
Series
Zynq®-7000
JESD-609 Code
e1
Pbfree Code
yes
Part Status
Active
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Number of Terminations
225
Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)
Technology
CMOS
Terminal Position
BOTTOM
Terminal Form
BALL
Peak Reflow Temperature (Cel)
260
Supply Voltage
1V
Terminal Pitch
0.8mm
Reflow Temperature-Max (s)
30
JESD-30 Code
S-PBGA-B225
Supply Voltage-Max (Vsup)
1.05V
Supply Voltage-Min (Vsup)
0.95V
Number of I/O
54
Speed
667MHz
RAM Size
256KB
Core Processor
Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Peripherals
DMA
Clock Frequency
667MHz
Connectivity
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture
MCU, FPGA
Core Architecture
ARM
Boundary Scan
YES
RAM (words)
256000
Primary Attributes
Artix™-7 FPGA, 23K Logic Cells
Bus Compatibility
CAN; ETHERNET; I2C; PCI; SPI; UART; USB
Height Seated (Max)
1.5mm
Length
13mm
Width
13mm
RoHS Status
ROHS3 Compliant
- Datasheets :
- Environmental Information :
This SoC is built on Single ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).
A core processor(s) Single ARM? Cortex?-A9 MPCore? with CoreSight? is integrated into this SoC.The manufacturer assigns this system on a chip with a 225-LFBGA, CSPBGA package as per the manufacturer's specifications.A 256KB RAM SoC chip provides reliable performance to users.The internal architecture of this SoC design is based on the MCU, FPGA technique.The system on a chip is part of the series Zynq?-7000.It is expected that this SoC meaning will operate at 0°C~85°C TJ on average.There is one thing to note about this SoC security: it combines Artix?-7 FPGA, 23K Logic Cells.An advanced Tray package houses this SoC system on a chip.As a whole, this SoC part is comprised of 54 inputs and outputs.Use a power supply with a voltage of 1V if possible.For the SoCs wireless, a voltage higher than 1.05V is considered unsafe.Power supplies of at least 0.95V are required.system on a chip benefits from 225 terminations.Core architecture of ARM underpins the SoC meaning.A 667MHz clock frequency is followed by this SoC.
Single ARM? Cortex?-A9 MPCore? with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM
Clock Frequency: 667MHz
There are a lot of Xilinx Inc.
XC7Z007S-1CLG225C System On Chip (SoC) applications.
- Robotics
- Self-aware system-on-chip (SoC)
- CNC control
- High-end PLC
- Apple smart watch
- Measurement tools
- Networked sensors
- Functional safety for critical applications in the aerospace
- Keywords
- Body control module
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We take great care when shipping electronics overseas. Both the U.S. and U.K. governments have imposed restrictions on air transport of electronics, according to the International Air Transport Association.
1. Understand the shipping rules of the destination country
Different countries have different regulations for shipping electronic equipment, check for certain certifications, and read the destination country's guidelines before shipping to prevent delays or confiscation of goods by customs.
2. Choose a reliable express logistics provider
From providing pick-up service to checking the status with real-time order number, conveniently track packages. At present, the logistics providers we cooperate with more include DHL, UPS, Fedex, TXT.
Of course, if you have a long-term cooperative freight forwarder or your own company's logistics account, you can pick up the goods directly from our warehouse
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The shipping cost of electronic products depends on the size and weight of the package and the shipping distance. You can first ask us about the size/weight of the products we sell to estimate the shipping cost.
4. How long does it take to ship the electronic components?
If electronic component in stock, it is usually shipped before 5 o'clock on the same day, and it usually takes 5-10 working days to complete it by international express.
If it is a scheduled component, it needs to wait for the arrival of the parts, and then it will be inspected before delivery. If there are special circumstances, the sales staff will confirm with you. Weekends and holidays will also affect the delivery time of electronic products.
1. We provide 365 days warranty for all electronic components.
2. If you need a test report, please let us know. We have a long-term cooperative testing laboratory. If you have familiar testing laboratory, we can also ship to your designated laboratory for testing.
3. Where does Aztec Electronics mainly purchase electronic components from?
Distributors, free market, 48 global large-scale OEM factories in close contact with us (Great Price advantage, 100% original)
2.Are the Xilinx's XC7Z007S-1CLG225C price and stock displayed on the website accurate?
Aztec Electronics inventory fluctuates greatly and cannot be updated in time, it is recommended to confirm the order with Aztec Electronics salesperson or online customer service before payment.
You Also Ask
- How to test electronic components and quality inspections?
- How to transport your electronic components safely?
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After the electronic components have passed the quality inspection of Aztec Electronics, there are generally the following five packaging forms for electronic components: Tape, Tube, Tray, Bulk and Ammo.
Tape/Reel | Tube | Tray | Bulk | Ammo |
Weave bulk chips into tapes and pack them into reels through SMD components packaging Tape Machine. Reel is the most commonly used. | When packaging, arrange the components in the same direction and put them into plastic tubes one at a time. | Choose tray package with the same specifications as the original manufacturer, put the components into the tray and use the strapping machine. | Bulk packaging means that the SMD components are freely packaged in a formed plastic box or bag. | Adhesive tape cut continuously in predetermined quantities. The cut strips are placed in boxes for safekeeping. |
Choose electronic components that are vacuum-sealed against water, dust, moisture, oxidation, corrosion, and even UV or RF pollution.
How to pack electronic components in cartons?
1. Choose the right box for your electronic components2. Use anti-static bubble film protect electronic component
3. Put it into the box, no buffer dead corner, 360-degree package.
4. Labeled as fragile to ensure that the courier knows what needs to be done with the package.
