Xilinx Inc. XC7Z030-1FBG676I
XC7Z030-1FBG676I
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Xilinx Inc. XC7Z030-1FBG676I information
Type
Parameter
Factory Lead Time
10 Weeks
Contact Plating
Copper, Silver, Tin
Package / Case
676-BBGA, FCBGA
Surface Mount
YES
Number of Pins
676
Operating Temperature
-40°C~100°C TJ
Packaging
Tray
Published
2009
Series
Zynq®-7000
JESD-609 Code
e1
Part Status
Active
Moisture Sensitivity Level (MSL)
4 (72 Hours)
Number of Terminations
676
ECCN Code
3A991.D
Terminal Finish
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
HTS Code
8542.39.00.01
Technology
CMOS
Terminal Position
BOTTOM
Terminal Form
BALL
Peak Reflow Temperature (Cel)
245
Supply Voltage
1V
Terminal Pitch
1mm
Frequency
667MHz
Reflow Temperature-Max (s)
30
Base Part Number
XC7Z030
Operating Supply Voltage
1V
Supply Voltage-Max (Vsup)
1.05V
Interface
CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
Number of I/O
130
RAM Size
256KB
Core Processor
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Peripherals
DMA
Connectivity
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture
MCU, FPGA
Data Bus Width
32b
Core Architecture
ARM
Boundary Scan
YES
Speed Grade
-1
RAM (words)
256000
Primary Attributes
Kintex™-7 FPGA, 125K Logic Cells
Bus Compatibility
CAN; ETHERNET; I2C; SPI; UART; USB
Height Seated (Max)
2.54mm
Length
27mm
Radiation Hardening
No
RoHS Status
ROHS3 Compliant
- Datasheets :
- Environmental Information :
- PCN Design/Specification :
- PCN Assembly/Origin :
This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).
Based on the core processor(s) Dual ARM? Cortex?-A9 MPCore? with CoreSight?, this SoC has been developed.This system on a chip is packaged as 676-BBGA, FCBGA by the manufacturer.Users will enjoy reliable performance with this SoC chip, which has implemented 256KB RAM.As far as its internal architecture is concerned, this SoC design employs the MCU, FPGA technique.The Zynq?-7000 series contains this system on chip SoC.Temperatures should be -40°C~100°C TJ on average for this SoC meaning.As one of the most important things to note is that this SoC security combines Kintex?-7 FPGA, 125K Logic Cells together.Featured in the state-of-the-art Tray package, this SoC system on a chip provides outstanding performance.An integral part of this SoC consists of a total of 130 I/Os.A power supply with a 1V voltage rating should be utilized when using this system on chip SoC.The SoCs wireless is considered unreliable if the voltage exceeds 1.05V.As a result, there are 676 terminations in total, which does really benefit system on a chip.Search XC7Z030 for system on chips with similar specs and purposes.At 667MHz, the wireless SoC works.In order to operate the SoC meaning, it must be based on the core architecture of ARM.There is a 676-pin version of this computer SoC available.
Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM
There are a lot of Xilinx Inc.
XC7Z030-1FBG676I System On Chip (SoC) applications.
- Microcontroller
- Communication interfaces ( I2C, SPI )
- Medical
- Efficient hardware for training of neural networks
- Central alarm system
- Functional safety for critical applications in the automotive
- USB hard disk enclosure
- Apple smart watch
- PC peripherals
- System-on-chip (SoC)
- ImagePart NumberManufacturerPackage / CaseNumber of PinsData Bus WidthInterfaceSupply VoltagePeripheralsTechnologyJESD-609 CodeView Compare
XC7Z030-1FBG676I
Xilinx Inc.676-BBGA, FCBGA
676
32 b
CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
1 V
DMA
CMOS
e1
- XC7Z030-2FFG676IXilinx Inc.
676-BBGA, FCBGA
676
32 b
CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
1 V
DMA
CMOS
e1
XC7Z030-1FBG676I
VS
XC7Z030-2FFG676I
MCIMX6D7CVT08ACNXP USA Inc.624-FBGA, FCBGA
-
-
-
-
-
CMOS
e1
XC7Z030-1FBG676I
VS
MCIMX6D7CVT08AC
- MCIMX6D6AVT08ACNXP USA Inc.
624-FBGA, FCBGA
-
-
-
1.4 V
-
CMOS
e1
XC7Z030-1FBG676I
VS
MCIMX6D6AVT08AC
- XC7Z030-2FBG676EXilinx Inc.
676-BBGA, FCBGA
676
32 b
CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
1 V
DMA
CMOS
e1
XC7Z030-1FBG676I
VS
XC7Z030-2FBG676E
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