Xilinx Inc. XC7Z020-1CLG484I
XC7Z020-1CLG484I
In Stock:94131
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Xilinx Inc. XC7Z020-1CLG484I information
Type
Parameter
Factory Lead Time
10 Weeks
Contact Plating
Copper, Silver, Tin
Package / Case
484-LFBGA, CSPBGA
Surface Mount
YES
Number of Pins
484
Operating Temperature
-40°C~100°C TJ
Packaging
Tray
Published
2009
Series
Zynq®-7000
JESD-609 Code
e1
Pbfree Code
yes
Part Status
Active
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Number of Terminations
484
ECCN Code
3A991.D
Terminal Finish
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
HTS Code
8542.39.00.01
Technology
CMOS
Terminal Position
BOTTOM
Terminal Form
BALL
Peak Reflow Temperature (Cel)
260
Supply Voltage
1V
Terminal Pitch
0.8mm
Frequency
667MHz
Base Part Number
XC7Z020
Operating Supply Voltage
1V
Supply Voltage-Max (Vsup)
1.05V
Interface
CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
Number of I/O
130
RAM Size
256KB
Core Processor
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Peripherals
DMA
Connectivity
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture
MCU, FPGA
Data Bus Width
32b
Core Architecture
ARM
Boundary Scan
YES
Speed Grade
-1
RAM (words)
256000
Primary Attributes
Artix™-7 FPGA, 85K Logic Cells
Bus Compatibility
CAN; ETHERNET; I2C; SPI; UART; USB
Height Seated (Max)
1.6mm
Length
19mm
Radiation Hardening
No
RoHS Status
ROHS3 Compliant
- Datasheets :
- Environmental Information :
- PCN Design/Specification :
- PCN Assembly/Origin :
This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).
A core processor Dual ARM? Cortex?-A9 MPCore? with CoreSight? is used to build this SoC.The manufacturer assigns this system on a chip with a 484-LFBGA, CSPBGA package.With 256KB RAM implemented, this SoC chip provides users with a high level of performance.Using the MCU, FPGA technique, this SoC design's internal architecture is simple.Zynq?-7000 is the series in which this system on chip SoC falls under.Temperatures should be -40°C~100°C TJ on average for this SoC meaning.A significant feature of this SoC security is the combination of Artix?-7 FPGA, 85K Logic Cells.There is a state-of-the-art Tray package that houses this SoC system on a chip.As a whole, this SoC part includes 130 I/Os.A power supply with a 1V voltage rating should be utilized when using this system on chip SoC.It is unsafe to operate the SoCs wireless at voltages above 1.05V.Having 484 terminations in total makes system on a chip possible.XC7Z020 can help you find system on chips with similar specs and purposes.At 667MHz, the wireless SoC works.In terms of core architecture, the SoC meaning relies on ARM.This is the version with 484 pins.
Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM
There are a lot of Xilinx Inc.
XC7Z020-1CLG484I System On Chip (SoC) applications.
- Central alarm system
- Keyboard
- Industrial AC-DC
- Microprocessors
- ARM
- Embedded systems
- Personal Computers
- Special Issue Information
- Automated sorting equipment
- PC peripherals
- ImagePart NumberManufacturerPackage / CaseNumber of PinsNumber of I/OSupply VoltagePeripheralsMoisture Sensitivity Level (MSL)PackagingPart StatusView Compare
XC7Z020-1CLG484I
Xilinx Inc.484-LFBGA, CSPBGA
484
130
1 V
DMA
3 (168 Hours)
Tray
Active
- XC7Z020-3CLG484EXilinx Inc.
484-LFBGA, CSPBGA
484
130
1 V
DMA
3 (168 Hours)
Tray
Active
XC7Z020-1CLG484I
VS
XC7Z020-3CLG484E
- XC7Z020-2CLG484EXilinx Inc.
484-LFBGA, CSPBGA
484
130
1 V
DMA
3 (168 Hours)
Tray
Active
XC7Z020-1CLG484I
VS
XC7Z020-2CLG484E
- XC7Z020-2CLG484IXilinx Inc.
484-LFBGA, CSPBGA
484
130
1 V
DMA
3 (168 Hours)
Tray
Active
XC7Z020-1CLG484I
VS
XC7Z020-2CLG484I
A2F200M3F-1FGG484Microsemi Corporation484-BGA
484
MCU - 41, FPGA - 94
-
DMA, POR, WDT
3 (168 Hours)
Tray
Active
XC7Z020-1CLG484I
VS
A2F200M3F-1FGG484
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Tape/Reel | Tube | Tray | Bulk | Ammo |
Weave bulk chips into tapes and pack them into reels through SMD components packaging Tape Machine. Reel is the most commonly used. | When packaging, arrange the components in the same direction and put them into plastic tubes one at a time. | Choose tray package with the same specifications as the original manufacturer, put the components into the tray and use the strapping machine. | Bulk packaging means that the SMD components are freely packaged in a formed plastic box or bag. | Adhesive tape cut continuously in predetermined quantities. The cut strips are placed in boxes for safekeeping. |
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