Xilinx Inc. XC7Z030-1FBG676C
XC7Z030-1FBG676C
In Stock:94131
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Xilinx Inc. XC7Z030-1FBG676C information
Type
Parameter
Factory Lead Time
10 Weeks
Contact Plating
Copper, Silver, Tin
Package / Case
676-BBGA, FCBGA
Surface Mount
YES
Number of Pins
676
Operating Temperature
0°C~85°C TJ
Packaging
Tray
Published
2009
Series
Zynq®-7000
JESD-609 Code
e1
Part Status
Active
Moisture Sensitivity Level (MSL)
4 (72 Hours)
Number of Terminations
676
ECCN Code
3A991.D
Terminal Finish
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
HTS Code
8542.39.00.01
Technology
CMOS
Terminal Position
BOTTOM
Terminal Form
BALL
Peak Reflow Temperature (Cel)
245
Supply Voltage
1V
Terminal Pitch
1mm
Frequency
667MHz
Reflow Temperature-Max (s)
30
Base Part Number
XC7Z030
Operating Supply Voltage
1V
Supply Voltage-Max (Vsup)
1.05V
Interface
CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
Number of I/O
130
RAM Size
256KB
Core Processor
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Peripherals
DMA
Connectivity
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture
MCU, FPGA
Data Bus Width
32b
Core Architecture
ARM
Boundary Scan
YES
Speed Grade
-1
RAM (words)
256000
Primary Attributes
Kintex™-7 FPGA, 125K Logic Cells
Bus Compatibility
CAN; ETHERNET; I2C; SPI; UART; USB
Height Seated (Max)
2.54mm
Length
27mm
Radiation Hardening
No
RoHS Status
ROHS3 Compliant
- Datasheets :
- Environmental Information :
- PCN Design/Specification :
- PCN Assembly/Origin :
This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).
A core processor Dual ARM? Cortex?-A9 MPCore? with CoreSight? is used to build this SoC.According to the manufacturer, this system on a chip has a package of 676-BBGA, FCBGA.A SoC chip with 256KB RAM is provided for users to enjoy reliable performance.This SoC design employs the MCU, FPGA technique for its internal architecture.The Zynq?-7000 series contains this system on chip SoC.In general, this SoC meaning should operate at a temperature of 0°C~85°C TJ on a regular basis.It is important to note that this SoC security combines Kintex?-7 FPGA, 125K Logic Cells.It comes in a state-of-the-art Tray package.This SoC part contains a total of 130 I/Os in total.It is recommended to use a 1V power supply.In the SoCs wireless, high voltages above 1.05V are considered dangerous and should not be used.In total, there are 676 terminations, which makes system on a chip possible.XC7Z030 can help you find system on chips with similar specs and purposes.In this wireless SoC, the frequency is set to 667MHz.In order to operate the SoC meaning, it must be based on the core architecture of ARM.The computer SoC is the 676-pin version.
Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM
There are a lot of Xilinx Inc.
XC7Z030-1FBG676C System On Chip (SoC) applications.
- AC drive control module
- Industrial AC-DC
- Industrial automation devices
- Functional safety for critical applications in the automotive
- Medical Pressure
- Functional safety for critical applications in the industrial sectors
- Robotics
- Defense
- AC-input BLDC motor drive
- Cyberphysical system-on-chip
- ImagePart NumberManufacturerPackage / CaseNumber of PinsData Bus WidthInterfaceSupply VoltagePeripheralsTechnologyJESD-609 CodeView Compare
XC7Z030-1FBG676C
Xilinx Inc.676-BBGA, FCBGA
676
32 b
CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
1 V
DMA
CMOS
e1
- XC7Z030-2FFG676IXilinx Inc.
676-BBGA, FCBGA
676
32 b
CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
1 V
DMA
CMOS
e1
XC7Z030-1FBG676C
VS
XC7Z030-2FFG676I
- MCIMX6D7CVT08ACNXP USA Inc.
624-FBGA, FCBGA
-
-
-
-
-
CMOS
e1
XC7Z030-1FBG676C
VS
MCIMX6D7CVT08AC
- MCIMX6D6AVT08ACNXP USA Inc.
624-FBGA, FCBGA
-
-
-
1.4 V
-
CMOS
e1
XC7Z030-1FBG676C
VS
MCIMX6D6AVT08AC
- XC7Z030-2FBG676EXilinx Inc.
676-BBGA, FCBGA
676
32 b
CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
1 V
DMA
CMOS
e1
XC7Z030-1FBG676C
VS
XC7Z030-2FBG676E
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