Xilinx Inc. XC9572XL-7TQG100I
Xilinx Inc. XC9572XL-7TQG100I information
Type
Parameter
Factory Lead Time
10 Weeks
Contact Plating
Tin
Mount
Surface Mount
Mounting Type
Surface Mount
Package / Case
100-LQFP
Number of Pins
100
Operating Temperature
-40°C~85°C TA
Packaging
Tray
Published
1996
Series
XC9500XL
JESD-609 Code
e3
Pbfree Code
yes
Part Status
Active
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Number of Terminations
100
ECCN Code
EAR99
Subcategory
Programmable Logic Devices
Technology
CMOS
Terminal Position
QUAD
Terminal Form
GULL WING
Peak Reflow Temperature (Cel)
260
Supply Voltage
3.3V
Terminal Pitch
0.5mm
Frequency
125MHz
Reflow Temperature-Max (s)
30
Base Part Number
XC9572XL
Pin Count
100
Operating Supply Voltage
3.3V
Programmable Type
In System Programmable (min 10K program/erase cycles)
Max Supply Voltage
3.6V
Min Supply Voltage
3V
Number of I/O
72
Memory Type
FLASH
Propagation Delay
7.5 ns
Turn On Delay Time
7.5 ns
Number of Logic Elements/Cells
4
Number of Gates
1600
Speed Grade
7
Output Function
MACROCELL
Number of Macro Cells
72
JTAG BST
YES
Voltage Supply - Internal
3V~3.6V
Height Seated (Max)
1.6mm
Radiation Hardening
No
RoHS Status
ROHS3 Compliant
- Datasheets :
- Environmental Information :
- PCN Assembly/Origin :
XC9572XL-7TQG100I Overview
There are 72 macro cells in the network, which are high-power cell sites that provide radio coverage (tower, antenna, or mast) for a mobile phone network.The product is contained in a 100-LQFP package.In this case, there are 72 I/Os programmed.100terminations have been programmed into the device.This electrical part has a terminal position of QUADand is connected to the ground.An electrical supply voltage of 3.3V is used to power it.It belongs to the family [0].As a result, it is packaged as Tray.To ensure its reliability, the operating temperature is set to [0].Chips should be mounted by Surface Mount.The FPGA belongs to the XC9500XL series.In this chip, the 100pins are programmed.XC9572XLcontains its related parts.The 1600gates serve as building blocks for digital circuits.In order to achieve high efficiency, the supply voltage should be maintained at [0].In order to store data, FLASHis used.The electronic part is mounted by Surface Mount.The 100pins are designed into the board.It operates with the maximal supply voltage of 3.6V.A minimum supply voltage of 3V is required for this device to operate.There is a maximum frequency of 125MHz.A fundamental building block consists of 4logic elements/cells.
XC9572XL-7TQG100I Features
100-LQFP package
72 I/Os
The operating temperature of -40°C~85°C TA
100 pin count
100 pins
XC9572XL-7TQG100I Applications
There are a lot of Xilinx Inc. XC9572XL-7TQG100I CPLDs applications.
- Address decoding
- Pattern recognition
- Page register
- State machine control
- Configurable Addressing of I/O Boards
- PULSE WIDTH MODULATION (PWM)
- Field programmable gate
- Software Configuration of Add-In Boards
- Complex programmable logic devices
- ToR/Aggregation/Core Switch and Router
- ImagePart NumberManufacturerPackage / CaseNumber of PinsPropagation DelayNumber of Macro CellsNumber of I/OMemory TypeMin Supply VoltageSupply VoltageView Compare
XC9572XL-7TQG100I
Xilinx Inc.100-LQFP
100
7.5 ns
72
72
FLASH
3 V
3.3 V
- LC4064V-75TN100CLattice Semiconductor Corporation
100-LQFP
100
7.5 ns
64
64
EEPROM
3 V
3.3 V
XC9572XL-7TQG100I
VS
LC4064V-75TN100C
- LC4064V-75T100ILattice Semiconductor Corporation
100-LQFP
100
7.5 ns
64
64
EEPROM
3 V
3.3 V
XC9572XL-7TQG100I
VS
LC4064V-75T100I
- XC9572XV-7TQ100CXilinx Inc.
100-LQFP
100
7.5 ns
72
72
FLASH
-
2.5 V
XC9572XL-7TQG100I
VS
XC9572XV-7TQ100C
- LC4064V-75T100CLattice Semiconductor Corporation
100-LQFP
100
7.5 ns
64
64
EEPROM
3 V
-
XC9572XL-7TQG100I
VS
LC4064V-75T100C
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After the electronic components have passed the quality inspection of Aztec Electronics, there are generally the following five packaging forms for electronic components: Tape, Tube, Tray, Bulk and Ammo.
Tape/Reel | Tube | Tray | Bulk | Ammo |
Weave bulk chips into tapes and pack them into reels through SMD components packaging Tape Machine. Reel is the most commonly used. | When packaging, arrange the components in the same direction and put them into plastic tubes one at a time. | Choose tray package with the same specifications as the original manufacturer, put the components into the tray and use the strapping machine. | Bulk packaging means that the SMD components are freely packaged in a formed plastic box or bag. | Adhesive tape cut continuously in predetermined quantities. The cut strips are placed in boxes for safekeeping. |
Choose electronic components that are vacuum-sealed against water, dust, moisture, oxidation, corrosion, and even UV or RF pollution.
How to pack electronic components in cartons?
1. Choose the right box for your electronic components2. Use anti-static bubble film protect electronic component
3. Put it into the box, no buffer dead corner, 360-degree package.
4. Labeled as fragile to ensure that the courier knows what needs to be done with the package.
