Xilinx Inc. XC9572XL-10TQG100I
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Xilinx Inc. XC9572XL-10TQG100I information
Type
Parameter
Factory Lead Time
10 Weeks
Contact Plating
Tin
Mount
Surface Mount
Mounting Type
Surface Mount
Package / Case
100-LQFP
Number of Pins
100
Operating Temperature
-40°C~85°C TA
Packaging
Tray
Published
1996
Series
XC9500XL
JESD-609 Code
e3
Pbfree Code
yes
Part Status
Active
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Number of Terminations
100
ECCN Code
EAR99
Subcategory
Programmable Logic Devices
Technology
CMOS
Terminal Position
QUAD
Terminal Form
GULL WING
Peak Reflow Temperature (Cel)
260
Supply Voltage
3.3V
Terminal Pitch
0.5mm
Frequency
100MHz
Reflow Temperature-Max (s)
30
Base Part Number
XC9572XL
Pin Count
100
Qualification Status
Not Qualified
Operating Supply Voltage
3.3V
Programmable Type
In System Programmable (min 10K program/erase cycles)
Max Supply Voltage
3.6V
Min Supply Voltage
3V
Number of I/O
72
Memory Type
FLASH
Propagation Delay
10 ns
Turn On Delay Time
10 ns
Number of Logic Elements/Cells
4
Number of Gates
1600
Speed Grade
10
Output Function
MACROCELL
Number of Macro Cells
72
JTAG BST
YES
Voltage Supply - Internal
3V~3.6V
Height
1.4mm
Length
14mm
Width
14mm
RoHS Status
ROHS3 Compliant
Lead Free
Lead Free
- Datasheets :
- Environmental Information :
- PCN Assembly/Origin :
XC9572XL-10TQG100I Overview
There are 72 macro cells. A macro cell is a cell in a mobile phone network that provides radio coverage through the use of a high-power cell site (tower, antenna or mast).It is contained in package [0].It is equipped with 72I/O ports.There are 100 terminations programmed into the device.There is a QUADterminal position on the electrical part in question.A voltage of 3.3V is used as the power supply for this device.This part is included in Programmable Logic Devices.It is recommended that the chip be packaged by Tray.To ensure reliability, the device operates at a temperature of [0].The chip should be mounted by Surface Mount.The XC9500XLseries FPGA is one of these types.It is programmed with 100 pins.According to the XC9572XL, its related parts can be found.As a building block for digital circuits, there are 1600gates.If high efficiency is to be achieved, the supply voltage should be maintained at [0].Data is stored using [0].Surface Mountis the mounting point of this electronic part.The 100pins are designed into the board.It operates at a maximum supply voltage of 3.6V volts.It operates with the minimal supply voltage of 3V.There is a maximum frequency of 100MHz.An elementary building block consists of 4logic elements/cells.
XC9572XL-10TQG100I Features
100-LQFP package
72 I/Os
The operating temperature of -40°C~85°C TA
100 pin count
100 pins
XC9572XL-10TQG100I Applications
There are a lot of Xilinx Inc. XC9572XL-10TQG100I CPLDs applications.
- Boolean function generators
- Power automation
- Power up sequencing
- Digital systems
- Auxiliary Power Supply Isolated and Non-isolated
- ROM patching
- Preset swapping
- Multiple DIP Switch Replacement
- Protection relays
- Programmable power management
- ImagePart NumberManufacturerPackage / CaseNumber of PinsPropagation DelayNumber of Macro CellsNumber of I/OMemory TypeMin Supply VoltageSupply VoltageView Compare
XC9572XL-10TQG100I
Xilinx Inc.100-LQFP
100
10 ns
72
72
FLASH
3 V
3.3 V
- XCR3064XL-10VQG100CXilinx Inc.
100-TQFP
100
10 ns
64
68
EEPROM
3 V
3.3 V
XC9572XL-10TQG100I
VS
XCR3064XL-10VQG100C
- LC4064V-10TN100ILattice Semiconductor Corporation
100-LQFP
100
10 ns
64
64
EEPROM
3 V
3.3 V
XC9572XL-10TQG100I
VS
LC4064V-10TN100I
- CY37064VP100-100AXICypress Semiconductor Corp
100-LQFP
100
12 ns
64
69
EEPROM
3 V
3.3 V
XC9572XL-10TQG100I
VS
CY37064VP100-100AXI
- CY37064VP100-100AXCCypress Semiconductor Corp
100-LQFP
100
12 ns
64
69
EEPROM
3 V
-
XC9572XL-10TQG100I
VS
CY37064VP100-100AXC
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2.Are the Xilinx's XC9572XL-10TQG100I price and stock displayed on the website accurate?
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After the electronic components have passed the quality inspection of Aztec Electronics, there are generally the following five packaging forms for electronic components: Tape, Tube, Tray, Bulk and Ammo.
Tape/Reel | Tube | Tray | Bulk | Ammo |
Weave bulk chips into tapes and pack them into reels through SMD components packaging Tape Machine. Reel is the most commonly used. | When packaging, arrange the components in the same direction and put them into plastic tubes one at a time. | Choose tray package with the same specifications as the original manufacturer, put the components into the tray and use the strapping machine. | Bulk packaging means that the SMD components are freely packaged in a formed plastic box or bag. | Adhesive tape cut continuously in predetermined quantities. The cut strips are placed in boxes for safekeeping. |
Choose electronic components that are vacuum-sealed against water, dust, moisture, oxidation, corrosion, and even UV or RF pollution.
How to pack electronic components in cartons?
1. Choose the right box for your electronic components2. Use anti-static bubble film protect electronic component
3. Put it into the box, no buffer dead corner, 360-degree package.
4. Labeled as fragile to ensure that the courier knows what needs to be done with the package.