Xilinx Inc. XC9572XL-10VQG64C
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Xilinx Inc. XC9572XL-10VQG64C information
Type
Parameter
Factory Lead Time
10 Weeks
Contact Plating
Tin
Mount
Surface Mount
Mounting Type
Surface Mount
Package / Case
64-TQFP
Number of Pins
64
Operating Temperature
0°C~70°C TA
Packaging
Tray
Published
1996
Series
XC9500XL
JESD-609 Code
e3
Pbfree Code
yes
Part Status
Active
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Number of Terminations
64
ECCN Code
EAR99
Subcategory
Programmable Logic Devices
Technology
CMOS
Terminal Position
QUAD
Terminal Form
GULL WING
Peak Reflow Temperature (Cel)
260
Supply Voltage
3.3V
Terminal Pitch
0.5mm
Frequency
100MHz
Reflow Temperature-Max (s)
30
Base Part Number
XC9572XL
Pin Count
64
Operating Supply Voltage
3.3V
Programmable Type
In System Programmable (min 10K program/erase cycles)
Max Supply Voltage
3.6V
Min Supply Voltage
3V
Number of I/O
52
Memory Type
FLASH
Propagation Delay
10 ns
Turn On Delay Time
10 ns
Number of Logic Elements/Cells
4
Number of Gates
1600
Speed Grade
10
Output Function
MACROCELL
Number of Macro Cells
72
JTAG BST
YES
Voltage Supply - Internal
3V~3.6V
Height Seated (Max)
1.2mm
Radiation Hardening
No
RoHS Status
ROHS3 Compliant
Lead Free
Lead Free
- Datasheets :
- Environmental Information :
- PCN Assembly/Origin :
XC9572XL-10VQG64C Overview
Currently, there are 72 macro cells, which are low-power cell sites (towers, antennas, masts) that serve as radio coverage.In the 64-TQFPpackage, you will find it.There are 52 I/Os on the board.There are 64 terminations programmed into the device.This electrical part has a terminal position of QUADand is connected to the ground.Power is provided by a supply voltage of 3.3V volts.It is a part of family [0].Trayshould be used to package the chip.During operation, the operating temperature is kept at 0°C~70°C TA to ensure its reliability.Ensure that the chip is mounted by Surface Mount.It belongs to the XC9500XLseries of FPGAs.A chip with 64pins is programmed.In accordance with the [0], its related parts are listed.A digital circuit can be constructed using 1600gates.High efficiency requires the supply voltage to be maintained at [0].It is recommended that data be stored in [0].This device is mounted by Surface Mount.The device has a pinout of [0].This device operates at a voltage of 3.6V when the maximum supply voltage is applied.It is powered by 3Vas its minimum supply voltage.The frequency that can be achieved is 100MHz.The fundamental building block consists of 4logic elements/cells.
XC9572XL-10VQG64C Features
64-TQFP package
52 I/Os
The operating temperature of 0°C~70°C TA
64 pin count
64 pins
XC9572XL-10VQG64C Applications
There are a lot of Xilinx Inc. XC9572XL-10VQG64C CPLDs applications.
- Page register
- Custom state machines
- DMA control
- SFP, QSFP, QSFP-DD, OSFP, Mini-SAS HD Port Management
- Preset swapping
- ANALOG-TO-DIGITAL CONVERTOR (ADC)
- Multiple DIP Switch Replacement
- Software Configuration of Add-In Boards
- ROM patching
- I2C BUS INTERFACE
- ImagePart NumberManufacturerPackage / CaseNumber of PinsPropagation DelayNumber of Macro CellsNumber of I/OMemory TypeMin Supply VoltageSupply VoltageView Compare
XC9572XL-10VQG64C
Xilinx Inc.64-TQFP
64
10 ns
72
52
FLASH
3 V
3.3 V
LC4064V-10TN48ILattice Semiconductor Corporation48-LQFP
48
10 ns
64
32
EEPROM
3 V
3.3 V
XC9572XL-10VQG64C
VS
LC4064V-10TN48I
LA4064V-75TN48ELattice Semiconductor Corporation48-TQFP
48
7.5 ns
64
32
EEPROM
3 V
3.3 V
XC9572XL-10VQG64C
VS
LA4064V-75TN48E
- LC4064V-75T48ELattice Semiconductor Corporation
48-LQFP
48
7.5 ns
64
32
EEPROM
3 V
3.3 V
XC9572XL-10VQG64C
VS
LC4064V-75T48E
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1. Understand the shipping rules of the destination country
Different countries have different regulations for shipping electronic equipment, check for certain certifications, and read the destination country's guidelines before shipping to prevent delays or confiscation of goods by customs.
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2.Are the Xilinx's XC9572XL-10VQG64C price and stock displayed on the website accurate?
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After the electronic components have passed the quality inspection of Aztec Electronics, there are generally the following five packaging forms for electronic components: Tape, Tube, Tray, Bulk and Ammo.
Tape/Reel | Tube | Tray | Bulk | Ammo |
Weave bulk chips into tapes and pack them into reels through SMD components packaging Tape Machine. Reel is the most commonly used. | When packaging, arrange the components in the same direction and put them into plastic tubes one at a time. | Choose tray package with the same specifications as the original manufacturer, put the components into the tray and use the strapping machine. | Bulk packaging means that the SMD components are freely packaged in a formed plastic box or bag. | Adhesive tape cut continuously in predetermined quantities. The cut strips are placed in boxes for safekeeping. |
Choose electronic components that are vacuum-sealed against water, dust, moisture, oxidation, corrosion, and even UV or RF pollution.
How to pack electronic components in cartons?
1. Choose the right box for your electronic components2. Use anti-static bubble film protect electronic component
3. Put it into the box, no buffer dead corner, 360-degree package.
4. Labeled as fragile to ensure that the courier knows what needs to be done with the package.
