Xilinx Inc. XC2C256-7TQG144I
Xilinx Inc. XC2C256-7TQG144I information
Type
Parameter
Factory Lead Time
10 Weeks
Contact Plating
Tin
Mount
Surface Mount
Mounting Type
Surface Mount
Package / Case
144-LQFP
Number of Pins
144
Operating Temperature
-40°C~85°C TA
Packaging
Tray
Published
2001
Series
CoolRunner II
JESD-609 Code
e3
Pbfree Code
yes
Part Status
Active
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Number of Terminations
144
Termination
SMD/SMT
ECCN Code
EAR99
Additional Feature
REAL DIGITAL DESIGN TECHNOLOGY
HTS Code
8542.39.00.01
Subcategory
Programmable Logic Devices
Technology
CMOS
Terminal Position
QUAD
Terminal Form
GULL WING
Peak Reflow Temperature (Cel)
260
Supply Voltage
1.8V
Terminal Pitch
0.5mm
Frequency
256MHz
Reflow Temperature-Max (s)
30
Base Part Number
XC2C256
Pin Count
144
Qualification Status
Not Qualified
Operating Supply Voltage
1.8V
Programmable Type
In System Programmable
Max Supply Voltage
1.9V
Min Supply Voltage
1.7V
Number of I/O
118
Propagation Delay
5.7 ns
Turn On Delay Time
7.5 ns
Number of Logic Elements/Cells
16
Number of Gates
6000
Speed Grade
7
Output Function
MACROCELL
Number of Macro Cells
256
JTAG BST
YES
Voltage Supply - Internal
1.7V~1.9V
Delay Time tpd(1) Max
6.7ns
Height Seated (Max)
1.6mm
Length
20mm
Width
20mm
REACH SVHC
No SVHC
RoHS Status
ROHS3 Compliant
- Datasheets :
- Environmental Information :
- PCN Design/Specification :
- PCN Assembly/Origin :
XC2C256-7TQG144I Overview
256 macrocells are present in the mobile phone network, which offer radio coverage from a high-power cell tower, antenna, or mast.The item is enclosed in a 144-LQFP package.The device is programmed with 118 I/Os.It is programmed that device terminations will be 144 .This electrical part has a terminal position of QUADand is connected to the ground.Power is provided by a supply voltage of 1.8V volts.The part is included in Programmable Logic Devices.Trayis the packaging method.Due to its reliability, it is operated at a temperature of [0].The chip should be mounted by Surface Mount.It belongs to the CoolRunner IIseries of FPGAs.With 144pins programmed, the chip is ready to use.If you use this device, you will also find [0].The XC2C256contains its related parts.For digital circuits, there are 6000gates. These devices serve as building blocks.Optimal efficiency requires a supply voltage of [0].A Surface Mountis mounted on this electronic component.There are 144pins on it.A voltage of 1.9V is the maximum supply voltage for this device.Despite its minimal supply voltage of [0], it is capable of operating.A frequency of 256MHzcan be achieved.An elementary building block consists of 16logic elements/cells.
XC2C256-7TQG144I Features
144-LQFP package
118 I/Os
The operating temperature of -40°C~85°C TA
144 pin count
144 pins
XC2C256-7TQG144I Applications
There are a lot of Xilinx Inc. XC2C256-7TQG144I CPLDs applications.
- Wireless Infrastructure Base Band Unit and Remote Radio Unit
- POWER-SAVING MODES
- I/O expansion
- Discrete logic functions
- Complex programmable logic devices
- I2C BUS INTERFACE
- Timing control
- D/T registers and latches
- Pattern recognition
- Cross-Matrix Switch
- ImagePart NumberManufacturerPackage / CaseNumber of PinsPropagation DelayNumber of Macro CellsNumber of I/OMin Supply VoltageSupply VoltageMax Supply VoltageView Compare
XC2C256-7TQG144I
Xilinx Inc.144-LQFP
144
5.7 ns
256
118
1.7 V
1.8 V
1.9 V
- XC2C384-10TQG144CXilinx Inc.
144-LQFP
144
7.1 ns
384
118
1.7 V
1.8 V
1.9 V
XC2C256-7TQG144I
VS
XC2C384-10TQG144C
- XC2C128-7TQG144IXilinx Inc.
144-LQFP
144
5.7 ns
128
100
1.7 V
1.8 V
1.9 V
XC2C256-7TQG144I
VS
XC2C128-7TQG144I
LC4256ZE-5TN144CLattice Semiconductor Corporation144-LQFP
144
5.8 ns
256
96
1.7 V
1.8 V
1.9 V
XC2C256-7TQG144I
VS
LC4256ZE-5TN144C
LC4256ZC-45T176CLattice Semiconductor Corporation176-LQFP
176
4.5 ns
256
128
1.7 V
1.8 V
1.9 V
XC2C256-7TQG144I
VS
LC4256ZC-45T176C
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After the electronic components have passed the quality inspection of Aztec Electronics, there are generally the following five packaging forms for electronic components: Tape, Tube, Tray, Bulk and Ammo.
Tape/Reel | Tube | Tray | Bulk | Ammo |
Weave bulk chips into tapes and pack them into reels through SMD components packaging Tape Machine. Reel is the most commonly used. | When packaging, arrange the components in the same direction and put them into plastic tubes one at a time. | Choose tray package with the same specifications as the original manufacturer, put the components into the tray and use the strapping machine. | Bulk packaging means that the SMD components are freely packaged in a formed plastic box or bag. | Adhesive tape cut continuously in predetermined quantities. The cut strips are placed in boxes for safekeeping. |
Choose electronic components that are vacuum-sealed against water, dust, moisture, oxidation, corrosion, and even UV or RF pollution.
How to pack electronic components in cartons?
1. Choose the right box for your electronic components2. Use anti-static bubble film protect electronic component
3. Put it into the box, no buffer dead corner, 360-degree package.
4. Labeled as fragile to ensure that the courier knows what needs to be done with the package.
