Xilinx Inc. XC9572XL-10TQG100C
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Xilinx Inc. XC9572XL-10TQG100C information
Type
Parameter
Factory Lead Time
10 Weeks
Mount
Surface Mount
Mounting Type
Surface Mount
Package / Case
100-LQFP
Number of Pins
100
Operating Temperature
0°C~70°C TA
Packaging
Tray
Published
1996
Series
XC9500XL
JESD-609 Code
e3
Pbfree Code
yes
Part Status
Active
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Number of Terminations
100
Termination
SMD/SMT
ECCN Code
EAR99
Terminal Finish
Matte Tin (Sn)
Subcategory
Programmable Logic Devices
Technology
CMOS
Terminal Position
QUAD
Terminal Form
GULL WING
Peak Reflow Temperature (Cel)
260
Supply Voltage
3.3V
Terminal Pitch
0.5mm
Frequency
100MHz
Reflow Temperature-Max (s)
30
Base Part Number
XC9572XL
Pin Count
100
Operating Supply Voltage
3.3V
Programmable Type
In System Programmable (min 10K program/erase cycles)
Max Supply Voltage
3.6V
Min Supply Voltage
3V
Number of I/O
72
Memory Type
FLASH
Propagation Delay
10 ns
Turn On Delay Time
10 ns
Number of Logic Elements/Cells
4
Number of Gates
1600
Speed Grade
10
Output Function
MACROCELL
Number of Macro Cells
72
JTAG BST
YES
Voltage Supply - Internal
3V~3.6V
Height
1.4mm
Length
14mm
Width
14mm
Radiation Hardening
No
REACH SVHC
No SVHC
RoHS Status
ROHS3 Compliant
Lead Free
Lead Free
- Datasheets :
- Environmental Information :
- PCN Assembly/Origin :
XC9572XL-10TQG100C Overview
The mobile phone network has 72 macro cells, which are cells that provide radio coverage from high-power cell sites (towers, antennas, or masts).It is embedded in the 100-LQFP package.As a result, it has 72 I/O ports programmed.It is programmed to terminate devices at [0].This electrical part has a terminal position of QUADand is connected to the ground.It is powered from a supply voltage of 3.3V.This part is part of the family [0].Package the chip by Tray.The operating temperature of the machine is 0°C~70°C TA to ensure its reliability.Ideally, the chip should be mounted by Surface Mount.In terms of FPGAs, it belongs to the XC9500XL series.In this chip, the 100pins are programmed.There are related parts in [0].As a building block for digital circuits, there are 1600gates.In order to achieve high efficiency, the supply voltage should be maintained at [0].Data is stored using [0].It is mounted by Surface Mount.It is designed with 100 pins.It operates at a maximum supply voltage of 3.6V volts.Initially, it requires a voltage of 3Vas the minimum supply voltage.This frequency can be achieved at 100MHz.There are 4 logic elements/cells to form a fundamental building block.
XC9572XL-10TQG100C Features
100-LQFP package
72 I/Os
The operating temperature of 0°C~70°C TA
100 pin count
100 pins
XC9572XL-10TQG100C Applications
There are a lot of Xilinx Inc. XC9572XL-10TQG100C CPLDs applications.
- High speed graphics processing
- Voltage level translation
- Protection relays
- White goods (Washing, Cold, Aircon ,...)
- Timing control
- D/T registers and latches
- Power up sequencing
- Programmable polarity
- PULSE WIDTH MODULATION (PWM)
- SFP, QSFP, QSFP-DD, OSFP, Mini-SAS HD Port Management
- ImagePart NumberManufacturerPackage / CaseNumber of PinsPropagation DelayNumber of Macro CellsNumber of I/OMemory TypeMin Supply VoltageSupply VoltageView Compare
XC9572XL-10TQG100C
Xilinx Inc.100-LQFP
100
10 ns
72
72
FLASH
3 V
3.3 V
- XCR3064XL-10VQG100CXilinx Inc.
100-TQFP
100
10 ns
64
68
EEPROM
3 V
3.3 V
XC9572XL-10TQG100C
VS
XCR3064XL-10VQG100C
- LC4064V-10TN100ILattice Semiconductor Corporation
100-LQFP
100
10 ns
64
64
EEPROM
3 V
3.3 V
XC9572XL-10TQG100C
VS
LC4064V-10TN100I
- CY37064VP100-100AXICypress Semiconductor Corp
100-LQFP
100
12 ns
64
69
EEPROM
3 V
3.3 V
XC9572XL-10TQG100C
VS
CY37064VP100-100AXI
- CY37064VP100-100AXCCypress Semiconductor Corp
100-LQFP
100
12 ns
64
69
EEPROM
3 V
-
XC9572XL-10TQG100C
VS
CY37064VP100-100AXC
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1. We provide 365 days warranty for all electronic components.
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2.Are the Xilinx's XC9572XL-10TQG100C price and stock displayed on the website accurate?
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After the electronic components have passed the quality inspection of Aztec Electronics, there are generally the following five packaging forms for electronic components: Tape, Tube, Tray, Bulk and Ammo.
Tape/Reel | Tube | Tray | Bulk | Ammo |
Weave bulk chips into tapes and pack them into reels through SMD components packaging Tape Machine. Reel is the most commonly used. | When packaging, arrange the components in the same direction and put them into plastic tubes one at a time. | Choose tray package with the same specifications as the original manufacturer, put the components into the tray and use the strapping machine. | Bulk packaging means that the SMD components are freely packaged in a formed plastic box or bag. | Adhesive tape cut continuously in predetermined quantities. The cut strips are placed in boxes for safekeeping. |
Choose electronic components that are vacuum-sealed against water, dust, moisture, oxidation, corrosion, and even UV or RF pollution.
How to pack electronic components in cartons?
1. Choose the right box for your electronic components2. Use anti-static bubble film protect electronic component
3. Put it into the box, no buffer dead corner, 360-degree package.
4. Labeled as fragile to ensure that the courier knows what needs to be done with the package.