Xilinx Inc. XC95288XL-10TQG144I
Xilinx Inc. XC95288XL-10TQG144I information
Type
Parameter
Factory Lead Time
10 Weeks
Mount
Surface Mount
Mounting Type
Surface Mount
Package / Case
144-LQFP
Number of Pins
144
Operating Temperature
-40°C~85°C TA
Packaging
Tray
Published
1996
Series
XC9500XL
JESD-609 Code
e3
Pbfree Code
yes
Part Status
Active
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Number of Terminations
144
ECCN Code
EAR99
Terminal Finish
Matte Tin (Sn)
Additional Feature
YES
HTS Code
8542.39.00.01
Subcategory
Programmable Logic Devices
Technology
CMOS
Terminal Position
QUAD
Terminal Form
GULL WING
Peak Reflow Temperature (Cel)
260
Supply Voltage
3.3V
Terminal Pitch
0.5mm
Frequency
100MHz
Reflow Temperature-Max (s)
30
Base Part Number
XC95288XL
Pin Count
144
Qualification Status
Not Qualified
Operating Supply Voltage
3.3V
Programmable Type
In System Programmable (min 10K program/erase cycles)
Max Supply Voltage
3.6V
Min Supply Voltage
3V
Number of I/O
117
Memory Type
FLASH
Propagation Delay
10 ns
Number of Logic Elements/Cells
16
Number of Gates
6400
Speed Grade
10
Output Function
MACROCELL
Number of Macro Cells
288
JTAG BST
YES
Voltage Supply - Internal
3V~3.6V
Height
1.4mm
Length
20mm
Width
20mm
RoHS Status
ROHS3 Compliant
Lead Free
Lead Free
- Datasheets :
- Environmental Information :
- PCN Design/Specification :
- PCN Assembly/Origin :
XC95288XL-10TQG144I Overview
288macrocells exist, which are cells in a mobile phone network that are primarily composed of high-power towers, antennas, or masts.In the 144-LQFPpackage, you will find it.This device has 117 I/O ports programmed into it.There are 144 terminations, which are the practice of ending a transmission line with a device that matches the characteristic impedance of the line.This electrical part has a terminal position of QUADand is connected to the ground.An electrical supply voltage of 3.3V is used to power it.It is included in Programmable Logic Devices.It is recommended that the chip be packaged by Tray.During operation, the operating temperature is kept at -40°C~85°C TA to ensure its reliability.Ideally, the chip should be mounted by Surface Mount.The XC9500XLseries comprises this type of FPGA.With 144pins programmed, the chip is ready to use.This device can also display [0].The XC95288XLshows its related parts.6400gates are used to construct digital circuits.The supply voltage should be maintained at 3.3V for high efficiency.In order to store data, FLASHis used.A Surface Mountis mounted on this electronic component.It is designed with 144 pins.A voltage of 3.6V is the maximum supply voltage for this device.Initially, it requires a voltage of 3Vas the minimum supply voltage.There is 100MHz frequency that can be achieved.In order to form a fundamental building block, there are 16logic elements/cells.
XC95288XL-10TQG144I Features
144-LQFP package
117 I/Os
The operating temperature of -40°C~85°C TA
144 pin count
144 pins
XC95288XL-10TQG144I Applications
There are a lot of Xilinx Inc. XC95288XL-10TQG144I CPLDs applications.
- SUPERVISORY FUNCTION (LVD AND WATCHDOG)
- Protection relays
- Reset swapping
- LED Lighting systems
- Wide Vin Industrial low power SMPS
- Random logic replacement
- High speed graphics processing
- SFP, QSFP, QSFP-DD, OSFP, Mini-SAS HD Port Management
- STANDARD SERIAL INTERFACE UART
- Field programmable gate
- ImagePart NumberManufacturerPackage / CaseNumber of PinsPropagation DelayNumber of Macro CellsNumber of I/OMemory TypeMin Supply VoltageSupply VoltageView Compare
XC95288XL-10TQG144I
Xilinx Inc.144-LQFP
144
10 ns
288
117
FLASH
3 V
3.3 V
- XCR3256XL-7TQ144CXilinx Inc.
144-LQFP
144
7.5 ns
256
120
EEPROM
3 V
3.3 V
XC95288XL-10TQG144I
VS
XCR3256XL-7TQ144C
- XCR3256XL-10TQG144CXilinx Inc.
144-LQFP
144
10 ns
256
120
EEPROM
3 V
3.3 V
XC95288XL-10TQG144I
VS
XCR3256XL-10TQG144C
- XCR3256XL-10TQG144IXilinx Inc.
144-LQFP
144
10 ns
256
120
EEPROM
-
3.3 V
XC95288XL-10TQG144I
VS
XCR3256XL-10TQG144I
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After the electronic components have passed the quality inspection of Aztec Electronics, there are generally the following five packaging forms for electronic components: Tape, Tube, Tray, Bulk and Ammo.
Tape/Reel | Tube | Tray | Bulk | Ammo |
Weave bulk chips into tapes and pack them into reels through SMD components packaging Tape Machine. Reel is the most commonly used. | When packaging, arrange the components in the same direction and put them into plastic tubes one at a time. | Choose tray package with the same specifications as the original manufacturer, put the components into the tray and use the strapping machine. | Bulk packaging means that the SMD components are freely packaged in a formed plastic box or bag. | Adhesive tape cut continuously in predetermined quantities. The cut strips are placed in boxes for safekeeping. |
Choose electronic components that are vacuum-sealed against water, dust, moisture, oxidation, corrosion, and even UV or RF pollution.
How to pack electronic components in cartons?
1. Choose the right box for your electronic components2. Use anti-static bubble film protect electronic component
3. Put it into the box, no buffer dead corner, 360-degree package.
4. Labeled as fragile to ensure that the courier knows what needs to be done with the package.
