Texas Instruments LMV321IDBVR
LMV321IDBVR
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Texas Instruments LMV321IDBVR information
Type
Parameter
Factory Lead Time
6 Weeks
Lifecycle Status
ACTIVE (Last Updated: 6 days ago)
Contact Plating
Tin
Mount
Surface Mount
Mounting Type
Surface Mount
Package / Case
SC-74A, SOT-753
Number of Pins
5
Operating Temperature
-40°C~125°C
Packaging
Cut Tape (CT)
JESD-609 Code
e4
Pbfree Code
yes
Part Status
Active
Moisture Sensitivity Level (MSL)
1 (Unlimited)
Number of Terminations
5
ECCN Code
EAR99
Terminal Finish
Nickel/Palladium/Gold (Ni/Pd/Au)
Subcategory
Operational Amplifier
Packing Method
TR
Technology
BIPOLAR
Terminal Position
DUAL
Terminal Form
GULL WING
Peak Reflow Temperature (Cel)
260
Number of Functions
1
Supply Voltage
2.7V
Base Part Number
LMV321
Pin Count
5
Output Type
Rail-to-Rail
Number of Channels
1
Operating Supply Current
130μA
Nominal Supply Current
250μA
Output Current
160mA
Slew Rate
1V/μs
Architecture
VOLTAGE-FEEDBACK
Amplifier Type
General Purpose
Common Mode Rejection Ratio
50 dB
Current - Input Bias
15nA
Voltage - Supply, Single/Dual (±)
2.7V~5.5V ±1.35V~2.75V
Output Current per Channel
160mA
Input Offset Voltage (Vos)
1.7mV
Bandwidth
1MHz
Unity Gain BW-Nom
1000 kHz
Voltage Gain
100dB
Power Supply Rejection Ratio (PSRR)
50dB
Low-Offset
NO
Frequency Compensation
YES
Low-Bias
NO
Micropower
YES
Programmable Power
NO
Max Junction Temperature (Tj)
150°C
Ambient Temperature Range High
125°C
Height
1.45mm
Length
2.9mm
Width
1.6mm
Thickness
1.2mm
Radiation Hardening
No
REACH SVHC
No SVHC
RoHS Status
ROHS3 Compliant
Lead Free
Lead Free
- Datasheets :
- PCN Assembly/Origin :
LMV321IDBVR Description
The LMV321IDBVR devices are low-voltage (2.7 V to 5.5 V) operational amplifiers with rail-to-rail output swing in single, dual, and quad configurations. These devices are the most cost-effective options for applications that require low-voltage operation, minimal area, and low cost. These amplifiers are specifically developed for low-voltage operation (2.7 V to 5 V), with performance characteristics that meet or surpass those of the LM358 and LM324 devices, which run from 5 V to 30 V. These devices can be used for a range of applications because their package sizes are half the size of the DBV (SOT-23) package.
LMV321IDBVR Features
?LMV321A, LMV324A, and LMV358A are the improved versions.
? Performance at 2.7 and 5 volts
? Operating temperature range: –40°C to +125°C
? There are no crossover distortions.
LMV321IDBVR Applications
? Desktop computers
? HVAC (heating, ventilation, and air conditioning) is an acronym for heating, ventilation, and air conditioning.
? AC induction motor control
? Laptops and netbooks
? Media players on the go
? Telecommunications DC/DC module: digital
? Audio mixers for professionals
? Fridges and freezers
- ImagePart NumberManufacturerPackage / CaseNumber of PinsSlew RateInput Offset Voltage (Vos)Power Supply Rejection Ratio (PSRR)Common Mode Rejection RatioSupply VoltageOperating Supply CurrentView Compare
LMV321IDBVR
NASC-74A, SOT-753
5
1V/μs
1.7 mV
50 dB
50 dB
2.7 V
130 μA
- AD8541ARTZ-REEL7Analog Devices Inc.
SC-74A, SOT-753
5
0.92V/μs
6 mV
76 dB
45 dB
3 V
65 μA
LMV321IDBVR
VS
AD8541ARTZ-REEL7
- LMV321M5X/NOPBNA
SC-74A, SOT-753
5
1V/μs
7 mV
50 dB
50 dB
5 V
130 μA
LMV321IDBVR
VS
LMV321M5X/NOPB
- LMV321M5XNA
SC-74A, SOT-753
5
1V/μs
7 mV
50 dB
50 dB
5 V
130 μA
LMV321IDBVR
VS
LMV321M5X
- LMV321Q1M5/NOPBNA
SC-74A, SOT-753
5
1V/μs
1.7 mV
50 dB
50 dB
5 V
130 μA
LMV321IDBVR
VS
LMV321Q1M5/NOPB
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How to Ship Electronic Components?
We take great care when shipping electronics overseas. Both the U.S. and U.K. governments have imposed restrictions on air transport of electronics, according to the International Air Transport Association.
1. Understand the shipping rules of the destination country
Different countries have different regulations for shipping electronic equipment, check for certain certifications, and read the destination country's guidelines before shipping to prevent delays or confiscation of goods by customs.
2. Choose a reliable express logistics provider
From providing pick-up service to checking the status with real-time order number, conveniently track packages. At present, the logistics providers we cooperate with more include DHL, UPS, Fedex, TXT.
Of course, if you have a long-term cooperative freight forwarder or your own company's logistics account, you can pick up the goods directly from our warehouse
3. How much does it cost to ship the electronic components?
The shipping cost of electronic products depends on the size and weight of the package and the shipping distance. You can first ask us about the size/weight of the products we sell to estimate the shipping cost.
4. How long does it take to ship the electronic components?
If electronic component in stock, it is usually shipped before 5 o'clock on the same day, and it usually takes 5-10 working days to complete it by international express.
If it is a scheduled component, it needs to wait for the arrival of the parts, and then it will be inspected before delivery. If there are special circumstances, the sales staff will confirm with you. Weekends and holidays will also affect the delivery time of electronic products.
1. We provide 365 days warranty for all electronic components.
2. If you need a test report, please let us know. We have a long-term cooperative testing laboratory. If you have familiar testing laboratory, we can also ship to your designated laboratory for testing.
3. Where does Aztec Electronics mainly purchase electronic components from?
Distributors, free market, 48 global large-scale OEM factories in close contact with us (Great Price advantage, 100% original)
2.Are the Texas Instruments Incorporated (TI)'s LMV321IDBVR price and stock displayed on the website accurate?
Aztec Electronics inventory fluctuates greatly and cannot be updated in time, it is recommended to confirm the order with Aztec Electronics salesperson or online customer service before payment.
You Also Ask
- How to test electronic components and quality inspections?
- How to transport your electronic components safely?
Need Any Service, please feel free contact us.
After the electronic components have passed the quality inspection of Aztec Electronics, there are generally the following five packaging forms for electronic components: Tape, Tube, Tray, Bulk and Ammo.
Tape/Reel | Tube | Tray | Bulk | Ammo |
Weave bulk chips into tapes and pack them into reels through SMD components packaging Tape Machine. Reel is the most commonly used. | When packaging, arrange the components in the same direction and put them into plastic tubes one at a time. | Choose tray package with the same specifications as the original manufacturer, put the components into the tray and use the strapping machine. | Bulk packaging means that the SMD components are freely packaged in a formed plastic box or bag. | Adhesive tape cut continuously in predetermined quantities. The cut strips are placed in boxes for safekeeping. |
Choose electronic components that are vacuum-sealed against water, dust, moisture, oxidation, corrosion, and even UV or RF pollution.
How to pack electronic components in cartons?
1. Choose the right box for your electronic components2. Use anti-static bubble film protect electronic component
3. Put it into the box, no buffer dead corner, 360-degree package.
4. Labeled as fragile to ensure that the courier knows what needs to be done with the package.
Texas Instruments Incorporated (TI) was founded in 1930 and is headquartered in Dallas, Texas, USA. Haviv Ilan is the President and CEO. They design, manufacture, test and sell analog and embedded semiconductors. Industrial and automotive markets are the best markets for their products .
The company focuses on amplifiers, audio, clock and timing, data converters, die and wafer services, DLP® products, interfaces, isolation devices, logic, microcontrollers (MCUs) and processors, motor drivers, power management, radio frequency & Microwaves, Sensors, Switches & Multiplexers, Wireless Connectivity.
Their values: Trustworthy, Inclusive, Innovative, Competitive, Results-oriented
Acquisition history:
In October 1999, TI acquired power Trends
In 2000, TI acquired Burr Brown (BB) at approximately $7.6 billion.
In September 2011, TI acquired National semiconductor(NS.NSC) for US$6.5 billion.
In 2021, TI acquired an operational 300mm fabrication plant located in Lehi, Utah from Micron for $900 million.
Main application fields:
Automotive, Communications Equipment, Enterprise Systems, Industrial Applications, Aerospace and Defense, Appliances, Building Automation, Factory Automation and Control, Grid Infrastructure, Industrial Transportation (non-automotive and non-light truck), Lighting, Medical, Motor Drives, Power Delivery, Pro Audio, Video & Signage, Retail Automation & Payments, Test & Measurement, Personal Electronics.