Microchip Technology MCP6002T-I/SN
MCP6002T-I/SN
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Microchip Technology MCP6002T-I/SN information
Type
Parameter
Factory Lead Time
8 Weeks
Mount
Surface Mount
Mounting Type
Surface Mount
Package / Case
8-SOIC (0.154, 3.90mm Width)
Number of Pins
8
Operating Temperature
-40°C~85°C
Packaging
Tape & Reel (TR)
Published
2005
JESD-609 Code
e3
Pbfree Code
yes
Part Status
Active
Moisture Sensitivity Level (MSL)
1 (Unlimited)
Number of Terminations
8
ECCN Code
EAR99
Terminal Finish
Matte Tin (Sn)
Subcategory
Operational Amplifier
Packing Method
TAPE AND REEL
Technology
CMOS
Terminal Position
DUAL
Terminal Form
GULL WING
Peak Reflow Temperature (Cel)
260
Number of Functions
2
Supply Voltage
5V
Reflow Temperature-Max (s)
40
Base Part Number
MCP6002
Pin Count
8
Output Type
Rail-to-Rail
Operating Supply Voltage
5.5V
Number of Elements
2
Operating Supply Current
100μA
Nominal Supply Current
100μA
Output Current
23mA
Slew Rate
0.6V/μs
Architecture
VOLTAGE-FEEDBACK
Amplifier Type
General Purpose
Common Mode Rejection Ratio
60 dB
Current - Input Bias
1pA
Voltage - Supply, Single/Dual (±)
1.8V~6V
Output Current per Channel
23mA
Input Offset Voltage (Vos)
4.5mV
Bandwidth
1MHz
Unity Gain BW-Nom
1000 kHz
Voltage Gain
112dB
Power Supply Rejection Ratio (PSRR)
86dB
Low-Offset
NO
Frequency Compensation
YES
Supply Voltage Limit-Max
7V
Low-Bias
YES
Micropower
YES
Max Frequency
1kHz
Programmable Power
NO
Height
1.5mm
Length
8.65mm
Width
3.9mm
Radiation Hardening
No
RoHS Status
ROHS3 Compliant
Lead Free
Lead Free
- Datasheets :
- PCN Design/Specification :
- PCN Packaging :
- ConflictMineralStatement :
microchip-dsc1123ci5400000-conflictmineralstatement-4089.pdf
MCP6002T-I/SN Overview
The linear amplifier is packaged in a 8-SOIC (0.154, 3.90mm Width) case which makes it easy for the consumer to handle. An op amp ic of the General Purpose type. Instrumentation amplifier is delivered in a Tape & Reel (TR) case. It is estimated that there will be at least 8 terminations this year. In total, there are 8 pins on this op amp ic. It is important to remember that this op amp should be operated at a voltage of 5V volts. Instrumentation amplifier is a part of Operational Amplifier. 8 pins are available on the instrumentation amplifier. Regarding input offset voltage, buffer amplifier rates 4.5mV voltage. The mounting type that is recommended for this electrical part is Surface Mount. In relation to the operating temperature of this buffer op amp, it works well at an average of -40°C~85°C . Using an 100μA supply current, this operational amplifier ics can be operated. 112dB should remain the voltage gain. This op amp ic outputs Rail-to-Rail signals, which is one of the many benefits it has. There is an operating supply voltage rating of 2 for this operational amplifier, which is rated at the manufacturer. The operating supply voltage of instrumentation amplifier is rated 5.5V voltage. A TAPE AND REEL-shaped amplifier is used to pack the buffer amps.
MCP6002T-I/SN Features
8 Pins
supply voltage of 5V
112dB voltage gain
Output Type: Rail-to-Rail
MCP6002T-I/SN Applications
There are a lot of Microchip Technology MCP6002T-I/SN Instrumentational OP Amps applications.
- Subtraction operation circuits
- Strain gauges
- Industrial applications including automation
- Digital cameras
- single/dual op amp sum and difference circuits
- E-book readers
- Exponential operation circuits
- Addition operation circuits
- Weak signal detection
- Voltage regulation circuit
- ImagePart NumberManufacturerPackage / CaseNumber of PinsSlew RateInput Offset Voltage (Vos)Power Supply Rejection Ratio (PSRR)Common Mode Rejection RatioSupply VoltageOperating Supply CurrentView Compare
MCP6002T-I/SN
Microchip Technology8-SOIC (0.154, 3.90mm Width)
8
0.6V/μs
4.5 mV
86 dB
60 dB
5 V
100 μA
- LM258DGON Semiconductor
8-SOIC (0.154, 3.90mm Width)
8
0.6V/μs
5 mV
65 dB
70 dB
5 V
1.5 mA
MCP6002T-I/SN
VS
LM258DG
- MCP6002-I/SNMicrochip Technology
8-SOIC (0.154, 3.90mm Width)
8
0.6V/μs
4.5 mV
86 dB
60 dB
5 V
-
MCP6002T-I/SN
VS
MCP6002-I/SN
- MCP6002-E/SNMicrochip Technology
8-SOIC (0.154, 3.90mm Width)
8
0.6V/μs
4.5 mV
86 dB
60 dB
5 V
-
MCP6002T-I/SN
VS
MCP6002-E/SN
- MCP6402T-E/MNYMicrochip Technology
8-WFDFN Exposed Pad
8
0.5V/μs
4.5 mV
63 dB
56 dB
1.8 V
-
MCP6002T-I/SN
VS
MCP6402T-E/MNY
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1. Understand the shipping rules of the destination country
Different countries have different regulations for shipping electronic equipment, check for certain certifications, and read the destination country's guidelines before shipping to prevent delays or confiscation of goods by customs.
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The shipping cost of electronic products depends on the size and weight of the package and the shipping distance. You can first ask us about the size/weight of the products we sell to estimate the shipping cost.
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If electronic component in stock, it is usually shipped before 5 o'clock on the same day, and it usually takes 5-10 working days to complete it by international express.
If it is a scheduled component, it needs to wait for the arrival of the parts, and then it will be inspected before delivery. If there are special circumstances, the sales staff will confirm with you. Weekends and holidays will also affect the delivery time of electronic products.
1. We provide 365 days warranty for all electronic components.
2. If you need a test report, please let us know. We have a long-term cooperative testing laboratory. If you have familiar testing laboratory, we can also ship to your designated laboratory for testing.
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Distributors, free market, 48 global large-scale OEM factories in close contact with us (Great Price advantage, 100% original)
2.Are the Microchip Technology's MCP6002T-I/SN price and stock displayed on the website accurate?
Aztec Electronics inventory fluctuates greatly and cannot be updated in time, it is recommended to confirm the order with Aztec Electronics salesperson or online customer service before payment.
You Also Ask
- How to test electronic components and quality inspections?
- How to transport your electronic components safely?
Need Any Service, please feel free contact us.
After the electronic components have passed the quality inspection of Aztec Electronics, there are generally the following five packaging forms for electronic components: Tape, Tube, Tray, Bulk and Ammo.
Tape/Reel | Tube | Tray | Bulk | Ammo |
Weave bulk chips into tapes and pack them into reels through SMD components packaging Tape Machine. Reel is the most commonly used. | When packaging, arrange the components in the same direction and put them into plastic tubes one at a time. | Choose tray package with the same specifications as the original manufacturer, put the components into the tray and use the strapping machine. | Bulk packaging means that the SMD components are freely packaged in a formed plastic box or bag. | Adhesive tape cut continuously in predetermined quantities. The cut strips are placed in boxes for safekeeping. |
Choose electronic components that are vacuum-sealed against water, dust, moisture, oxidation, corrosion, and even UV or RF pollution.
How to pack electronic components in cartons?
1. Choose the right box for your electronic components2. Use anti-static bubble film protect electronic component
3. Put it into the box, no buffer dead corner, 360-degree package.
4. Labeled as fragile to ensure that the courier knows what needs to be done with the package.