Texas Instruments LM324ADR
LM324ADR
In Stock:94131
Qty
Unit Price
Ext Price
1
$0.240000
$0.240000
10
$0.231000
$2.310000
100
$0.218000
$21.800000
500
$0.205640
$102.820000
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Texas Instruments LM324ADR information
Type
Parameter
Factory Lead Time
6 Weeks
Lifecycle Status
ACTIVE (Last Updated: 6 days ago)
Contact Plating
Gold
Mount
Surface Mount
Mounting Type
Surface Mount
Package / Case
14-SOIC (0.154, 3.90mm Width)
Number of Pins
14
Operating Temperature
0°C~70°C
Packaging
Tape & Reel (TR)
JESD-609 Code
e3
Pbfree Code
yes
Part Status
Active
Moisture Sensitivity Level (MSL)
1 (Unlimited)
Number of Terminations
14
ECCN Code
EAR99
Terminal Finish
Matte Tin (Sn)
Subcategory
Operational Amplifier
Packing Method
TR
Technology
BIPOLAR
Terminal Position
DUAL
Terminal Form
GULL WING
Peak Reflow Temperature (Cel)
260
Number of Functions
4
Supply Voltage
5V
Terminal Pitch
1.27mm
Base Part Number
LM324
Pin Count
14
Operating Supply Voltage
16V
Power Supplies
+-1.5/+-16/3/32V
Number of Channels
4
Operating Supply Current
1.4mA
Nominal Supply Current
3mA
Output Current
30mA
Slew Rate
0.5V/μs
Architecture
VOLTAGE-FEEDBACK
Amplifier Type
General Purpose
Common Mode Rejection Ratio
65 dB
Current - Input Bias
20nA
Voltage - Supply, Single/Dual (±)
3V~32V ±1.5V~16V
Output Current per Channel
60mA
Input Offset Voltage (Vos)
3mV
Bandwidth
1.2MHz
Unity Gain BW-Nom
1200 kHz
Voltage Gain
100dB
Average Bias Current-Max (IIB)
0.2μA
Power Supply Rejection Ratio (PSRR)
65dB
Low-Offset
NO
Frequency Compensation
YES
Supply Voltage Limit-Max
32V
Current - Output / Channel
40mA
Low-Bias
NO
Micropower
YES
Bias Current-Max (IIB) @25C
0.1μA
Programmable Power
NO
Dual Supply Voltage
9V
Input Offset Current-Max (IIO)
0.075μA
Height
1.75mm
Length
8.65mm
Width
3.91mm
Thickness
1.58mm
Radiation Hardening
No
REACH SVHC
No SVHC
RoHS Status
ROHS3 Compliant
Lead Free
Lead Free
- PCN Design/Specification :
- PCN Assembly/Origin :
- Datasheets :
LM324ADR Overview
Op amp is packaged in 14-SOIC (0.154, 3.90mm Width) case. There are two types of operational amplifiers in this circuit. A Tape & Reel (TR) case is used for delivering the op amp. There have been a total of 14 terminations over the past year. Buffer amplifier has a total of 14 pins. The linear amplifier should be run at 5V at all times, so please keep that in mind when using it. There are two types of Operational Amplifier op amps in this case, and this device falls into one of them. 14 pins are available on the instrumentation amplifier. Regarding input offset voltage, op amp rates 3mV. Surface Mount is the recommended mounting type of operational amplifiers. It is important to note that this linear amplifier works well at a temperature of 0°C~70°C when it comes to operating temperatureOperational amplifier can operate supply current at 1.4mA. It is recommended to keep the voltage gain at 100dB at all times. Instrumentation amplifier has 4 channels on it. The operating supply voltage of the buffer op amp is rated at 16V. This linear amplifier pack is based on the TR axis.
LM324ADR Features
14 Pins
supply voltage of 5V
100dB voltage gain
LM324ADR Applications
There are a lot of Texas Instruments LM324ADR Instrumentational OP Amps applications.
- Automotive sensors
- Power generator
- Displayers for aircraft and air transportation control systems
- Switching amplifier
- Video conversion and routing
- Subtraction operation circuits
- Gaming industry
- E-book readers
- Comparator
- Integrator circuits
- ImagePart NumberManufacturerPackage / CaseNumber of PinsSlew RateInput Offset Voltage (Vos)Power Supply Rejection Ratio (PSRR)Common Mode Rejection RatioSupply VoltageOperating Supply CurrentView Compare
LM324ADR
NA14-SOIC (0.154, 3.90mm Width)
14
0.5V/μs
3 mV
65 dB
65 dB
5 V
1.4 mA
LM324ADGON Semiconductor14-SOIC (0.154, 3.90mm Width)
14
0.6V/μs
3 mV
65 dB
65 dB
5 V
1.4 mA
LM324ADR
VS
LM324ADG
- LM324ADNA
14-SOIC (0.154, 3.90mm Width)
14
0.5V/μs
3 mV
65 dB
65 dB
5 V
1.4 mA
LM324ADR
VS
LM324AD
- LM324ADRG4NA
14-SOIC (0.154, 3.90mm Width)
14
0.5V/μs
3 mV
-
65 dB
5 V
1.4 mA
LM324ADR
VS
LM324ADRG4
LM324ADR2GON Semiconductor14-SOIC (0.154, 3.90mm Width)
14
0.6V/μs
3 mV
65 dB
65 dB
5 V
1.4 mA
LM324ADR
VS
LM324ADR2G
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1. Understand the shipping rules of the destination country
Different countries have different regulations for shipping electronic equipment, check for certain certifications, and read the destination country's guidelines before shipping to prevent delays or confiscation of goods by customs.
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From providing pick-up service to checking the status with real-time order number, conveniently track packages. At present, the logistics providers we cooperate with more include DHL, UPS, Fedex, TXT.
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The shipping cost of electronic products depends on the size and weight of the package and the shipping distance. You can first ask us about the size/weight of the products we sell to estimate the shipping cost.
4. How long does it take to ship the electronic components?
If electronic component in stock, it is usually shipped before 5 o'clock on the same day, and it usually takes 5-10 working days to complete it by international express.
If it is a scheduled component, it needs to wait for the arrival of the parts, and then it will be inspected before delivery. If there are special circumstances, the sales staff will confirm with you. Weekends and holidays will also affect the delivery time of electronic products.
1. We provide 365 days warranty for all electronic components.
2. If you need a test report, please let us know. We have a long-term cooperative testing laboratory. If you have familiar testing laboratory, we can also ship to your designated laboratory for testing.
3. Where does Aztec Electronics mainly purchase electronic components from?
Distributors, free market, 48 global large-scale OEM factories in close contact with us (Great Price advantage, 100% original)
2.Are the Texas Instruments Incorporated (TI)'s LM324ADR price and stock displayed on the website accurate?
Aztec Electronics inventory fluctuates greatly and cannot be updated in time, it is recommended to confirm the order with Aztec Electronics salesperson or online customer service before payment.
You Also Ask
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Need Any Service, please feel free contact us.
After the electronic components have passed the quality inspection of Aztec Electronics, there are generally the following five packaging forms for electronic components: Tape, Tube, Tray, Bulk and Ammo.
Tape/Reel | Tube | Tray | Bulk | Ammo |
Weave bulk chips into tapes and pack them into reels through SMD components packaging Tape Machine. Reel is the most commonly used. | When packaging, arrange the components in the same direction and put them into plastic tubes one at a time. | Choose tray package with the same specifications as the original manufacturer, put the components into the tray and use the strapping machine. | Bulk packaging means that the SMD components are freely packaged in a formed plastic box or bag. | Adhesive tape cut continuously in predetermined quantities. The cut strips are placed in boxes for safekeeping. |
Choose electronic components that are vacuum-sealed against water, dust, moisture, oxidation, corrosion, and even UV or RF pollution.
How to pack electronic components in cartons?
1. Choose the right box for your electronic components2. Use anti-static bubble film protect electronic component
3. Put it into the box, no buffer dead corner, 360-degree package.
4. Labeled as fragile to ensure that the courier knows what needs to be done with the package.
Texas Instruments Incorporated (TI) was founded in 1930 and is headquartered in Dallas, Texas, USA. Haviv Ilan is the President and CEO. They design, manufacture, test and sell analog and embedded semiconductors. Industrial and automotive markets are the best markets for their products .
The company focuses on amplifiers, audio, clock and timing, data converters, die and wafer services, DLP® products, interfaces, isolation devices, logic, microcontrollers (MCUs) and processors, motor drivers, power management, radio frequency & Microwaves, Sensors, Switches & Multiplexers, Wireless Connectivity.
Their values: Trustworthy, Inclusive, Innovative, Competitive, Results-oriented
Acquisition history：
In October 1999, TI acquired power Trends
In 2000, TI acquired Burr Brown (BB) at approximately $7.6 billion.
In September 2011, TI acquired National semiconductor(NS.NSC) for US$6.5 billion.
In 2021, TI acquired an operational 300mm fabrication plant located in Lehi, Utah from Micron for $900 million.
Main application fields:
Automotive, Communications Equipment, Enterprise Systems, Industrial Applications, Aerospace and Defense, Appliances, Building Automation, Factory Automation and Control, Grid Infrastructure, Industrial Transportation (non-automotive and non-light truck), Lighting, Medical, Motor Drives, Power Delivery, Pro Audio, Video & Signage, Retail Automation & Payments, Test & Measurement, Personal Electronics.
