Texas Instruments LM324APWR
LM324APWR
In Stock:94131
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Texas Instruments LM324APWR information
Type
Parameter
Factory Lead Time
6 Weeks
Lifecycle Status
ACTIVE (Last Updated: 6 days ago)
Contact Plating
Gold
Mount
Surface Mount
Mounting Type
Surface Mount
Package / Case
14-TSSOP (0.173, 4.40mm Width)
Number of Pins
14
Operating Temperature
0°C~70°C
Packaging
Cut Tape (CT)
JESD-609 Code
e3
Pbfree Code
yes
Part Status
Active
Moisture Sensitivity Level (MSL)
1 (Unlimited)
Number of Terminations
14
ECCN Code
EAR99
Terminal Finish
Matte Tin (Sn)
Subcategory
Operational Amplifier
Packing Method
TR
Technology
BIPOLAR
Terminal Position
DUAL
Terminal Form
GULL WING
Peak Reflow Temperature (Cel)
260
Number of Functions
4
Supply Voltage
5V
Base Part Number
LM324
Pin Count
14
Operating Supply Voltage
16V
Power Supplies
+-1.5/+-16/3/32V
Number of Channels
4
Operating Supply Current
1.4mA
Nominal Supply Current
3mA
Output Current
20mA
Slew Rate
0.5V/μs
Architecture
VOLTAGE-FEEDBACK
Amplifier Type
General Purpose
Common Mode Rejection Ratio
65 dB
Current - Input Bias
20nA
Voltage - Supply, Single/Dual (±)
3V~32V ±1.5V~16V
Output Current per Channel
60mA
Input Offset Voltage (Vos)
3mV
Bandwidth
1.2MHz
Unity Gain BW-Nom
1200 kHz
Voltage Gain
100dB
Average Bias Current-Max (IIB)
0.2μA
Power Supply Rejection Ratio (PSRR)
65dB
Low-Offset
NO
Frequency Compensation
YES
Supply Voltage Limit-Max
32V
Current - Output / Channel
40mA
Low-Bias
NO
Micropower
YES
Bias Current-Max (IIB) @25C
0.1μA
Programmable Power
NO
Input Offset Current-Max (IIO)
0.075μA
Height
1.2mm
Length
5mm
Width
4.4mm
Thickness
1mm
Radiation Hardening
No
REACH SVHC
No SVHC
RoHS Status
ROHS3 Compliant
Lead Free
Lead Free
- Datasheets :
LM324APWR Overview
A 14-TSSOP (0.173, 4.40mm Width) case is used to package the op amp. A General Purpose-type buffer amplifier is shown here. Upon delivery, op amp ic is packaged in a Cut Tape (CT) case. There is a growing number of terminations approaching the number of 14. The total number of pins on linear amplifier is 14. The linear amplifier should be run at 5V at all times, so please keep that in mind when using it. A type of Operational Amplifier op amp ic can be identified by the fact that this is a type of Operational Amplifier device. 14 pins are located on the operational amplifiers. Op amp rates 3mV as input offset voltage. Surface Mount is the recommended mounting type for this linear amplifier. In terms of operating temperature, this instrumentation amplifier is well suited to a temperature range of 0°C~70°C. The buffer amplifier is capable of operating from a supply current of 1.4mA . It is recommended to keep the voltage gain at 100dB at all times. Op amp ic has 4 channels. The operating supply voltage of instrumentation amplifier is rated 16V voltage. An buffer amplifier is packed in a TR-shape according to the design.
LM324APWR Features
14 Pins
supply voltage of 5V
100dB voltage gain
LM324APWR Applications
There are a lot of Texas Instruments LM324APWR Instrumentational OP Amps applications.
- Test and measurement instruments
- Weak signal detection
- Semiconductor detectors
- Information processing
- Measurements of Wheatstone bridge
- Automatic control
- Blood pressure sensors
- Polarized electrodes
- Biopotential
- Strain gauges
- ImagePart NumberManufacturerPackage / CaseNumber of PinsSlew RateInput Offset Voltage (Vos)Power Supply Rejection Ratio (PSRR)Common Mode Rejection RatioSupply VoltageOperating Supply CurrentView Compare
LM324APWR
NA14-TSSOP (0.173, 4.40mm Width)
14
0.5V/μs
3 mV
65 dB
65 dB
5 V
1.4 mA
- LM324KAPWRNA
14-TSSOP (0.173, 4.40mm Width)
14
0.5V/μs
3 mV
-
65 dB
5 V
1.4 mA
LM324APWR
VS
LM324KAPWR
LM324ADTBGON Semiconductor14-TSSOP (0.173, 4.40mm Width)
14
0.6V/μs
3 mV
65 dB
65 dB
5 V
1.4 mA
LM324APWR
VS
LM324ADTBG
- LM324ADTBR2GON Semiconductor
14-TSSOP (0.173, 4.40mm Width)
14
0.6V/μs
3 mV
65 dB
65 dB
5 V
1.4 mA
LM324APWR
VS
LM324ADTBR2G
- LM324APWNA
14-TSSOP (0.173, 4.40mm Width)
14
0.5V/μs
3 mV
-
65 dB
5 V
1.4 mA
LM324APWR
VS
LM324APW
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2.Are the Texas Instruments Incorporated (TI)'s LM324APWR price and stock displayed on the website accurate?
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After the electronic components have passed the quality inspection of Aztec Electronics, there are generally the following five packaging forms for electronic components: Tape, Tube, Tray, Bulk and Ammo.
Tape/Reel | Tube | Tray | Bulk | Ammo |
Weave bulk chips into tapes and pack them into reels through SMD components packaging Tape Machine. Reel is the most commonly used. | When packaging, arrange the components in the same direction and put them into plastic tubes one at a time. | Choose tray package with the same specifications as the original manufacturer, put the components into the tray and use the strapping machine. | Bulk packaging means that the SMD components are freely packaged in a formed plastic box or bag. | Adhesive tape cut continuously in predetermined quantities. The cut strips are placed in boxes for safekeeping. |
Choose electronic components that are vacuum-sealed against water, dust, moisture, oxidation, corrosion, and even UV or RF pollution.
How to pack electronic components in cartons?
1. Choose the right box for your electronic components2. Use anti-static bubble film protect electronic component
3. Put it into the box, no buffer dead corner, 360-degree package.
4. Labeled as fragile to ensure that the courier knows what needs to be done with the package.
Texas Instruments Incorporated (TI) was founded in 1930 and is headquartered in Dallas, Texas, USA. Haviv Ilan is the President and CEO. They design, manufacture, test and sell analog and embedded semiconductors. Industrial and automotive markets are the best markets for their products .
The company focuses on amplifiers, audio, clock and timing, data converters, die and wafer services, DLP® products, interfaces, isolation devices, logic, microcontrollers (MCUs) and processors, motor drivers, power management, radio frequency & Microwaves, Sensors, Switches & Multiplexers, Wireless Connectivity.
Their values: Trustworthy, Inclusive, Innovative, Competitive, Results-oriented
Acquisition history：
In October 1999, TI acquired power Trends
In 2000, TI acquired Burr Brown (BB) at approximately $7.6 billion.
In September 2011, TI acquired National semiconductor(NS.NSC) for US$6.5 billion.
In 2021, TI acquired an operational 300mm fabrication plant located in Lehi, Utah from Micron for $900 million.
Main application fields:
Automotive, Communications Equipment, Enterprise Systems, Industrial Applications, Aerospace and Defense, Appliances, Building Automation, Factory Automation and Control, Grid Infrastructure, Industrial Transportation (non-automotive and non-light truck), Lighting, Medical, Motor Drives, Power Delivery, Pro Audio, Video & Signage, Retail Automation & Payments, Test & Measurement, Personal Electronics.
