Texas Instruments LF353D
LF353D
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Texas Instruments LF353D information
Type
Parameter
Factory Lead Time
6 Weeks
Lifecycle Status
ACTIVE (Last Updated: 2 days ago)
Contact Plating
Gold
Mount
Surface Mount
Mounting Type
Surface Mount
Package / Case
8-SOIC (0.154, 3.90mm Width)
Number of Pins
8
Operating Temperature
0°C~70°C
Packaging
Tube
JESD-609 Code
e4
Pbfree Code
yes
Part Status
Active
Moisture Sensitivity Level (MSL)
1 (Unlimited)
Number of Terminations
8
ECCN Code
EAR99
Subcategory
Operational Amplifier
Max Power Dissipation
500mW
Technology
JFET
Terminal Position
DUAL
Terminal Form
GULL WING
Peak Reflow Temperature (Cel)
260
Number of Functions
2
Supply Voltage
15V
Base Part Number
LF353
Pin Count
8
Number of Channels
2
Voltage
15V
Operating Supply Current
3.6mA
Nominal Supply Current
6.5mA
Power Dissipation
500mW
Slew Rate
13V/μs
Architecture
VOLTAGE-FEEDBACK
Amplifier Type
J-FET
Common Mode Rejection Ratio
70 dB
Current - Input Bias
50pA
Voltage - Supply, Single/Dual (±)
±3.5V~18V
Input Offset Voltage (Vos)
10mV
Bandwidth
3MHz
Neg Supply Voltage-Nom (Vsup)
-15V
Unity Gain BW-Nom
3000 kHz
Voltage Gain
100dB
Low-Offset
NO
Frequency Compensation
YES
Voltage - Input Offset
5mV
Low-Bias
YES
Micropower
NO
Programmable Power
NO
Dual Supply Voltage
9V
Input Offset Current-Max (IIO)
0.004μA
Height
1.75mm
Length
4.9mm
Width
3.91mm
Thickness
1.58mm
Radiation Hardening
No
REACH SVHC
No SVHC
RoHS Status
ROHS3 Compliant
Lead Free
Lead Free
- PCN Design/Specification :
- Datasheets :
LF353D Overview
The linear amplifier is packaged in a 8-SOIC (0.154, 3.90mm Width) case. The instrumentation amplifier in this picture is of the J-FET-type. In the case of Tube cases, linear amplifier will be delivered. In recent months, the number of terminations has approached 8. In this case, there are 8 pins on the board. Please take in mind that this instrumentation amplifier should be run at 15V. Instrumentation amplifier is a part of Operational Amplifier. An 8-pin op amp ic is included in the package. In terms of the input offset voltage, instrumentation amplifier rates at 10mV. It is recommended that this electronic component be mounted using the Surface Mount mounting type. In relation to the operating temperature of this buffer op amp, it works well at an average of 0°C~70°C . A supply current of 3.6mA can be used to operate this linear amplifier. 100dB should be the voltage gain. The op amp ic has 2 channels on it.
LF353D Features
8 Pins
supply voltage of 15V
100dB voltage gain
LF353D Applications
There are a lot of Texas Instruments LF353D Instrumentational OP Amps applications.
- Hand-held batteries
- Fast A/D and D/A converters
- RF cable systems
- Commercial audio systems
- Differentiator circuits
- High input resistance broadband
- Proportional counter tubes
- Radiation thermometry transducers
- Signal transformation
- Power transmission
- ImagePart NumberManufacturerPackage / CaseNumber of PinsSlew RateInput Offset Voltage (Vos)Common Mode Rejection RatioSupply VoltageOperating Supply CurrentNumber of TerminationsView Compare
LF353D
NA8-SOIC (0.154, 3.90mm Width)
8
13V/μs
10 mV
70 dB
15 V
3.6 mA
8
- LF353DG4NA
8-SOIC (0.154, 3.90mm Width)
8
13V/μs
10 mV
70 dB
15 V
3.6 mA
8
LF353D
VS
LF353DG4
TL072CPSRNA8-SOIC (0.209, 5.30mm Width)
8
13V/μs
10 mV
70 dB
15 V
1.4 mA
8
LF353D
VS
TL072CPSR
TL072CDTSTMicroelectronics8-SOIC (0.154, 3.90mm Width)
8
16V/μs
10 mV
70 dB
15 V
1.4 mA
8
LF353D
VS
TL072CDT
- LF353DRNA
8-SOIC (0.154, 3.90mm Width)
8
13V/μs
10 mV
70 dB
15 V
3.6 mA
8
LF353D
VS
LF353DR
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How to Ship Electronic Components?
We take great care when shipping electronics overseas. Both the U.S. and U.K. governments have imposed restrictions on air transport of electronics, according to the International Air Transport Association.
1. Understand the shipping rules of the destination country
Different countries have different regulations for shipping electronic equipment, check for certain certifications, and read the destination country's guidelines before shipping to prevent delays or confiscation of goods by customs.
2. Choose a reliable express logistics provider
From providing pick-up service to checking the status with real-time order number, conveniently track packages. At present, the logistics providers we cooperate with more include DHL, UPS, Fedex, TXT.
Of course, if you have a long-term cooperative freight forwarder or your own company's logistics account, you can pick up the goods directly from our warehouse
3. How much does it cost to ship the electronic components?
The shipping cost of electronic products depends on the size and weight of the package and the shipping distance. You can first ask us about the size/weight of the products we sell to estimate the shipping cost.
4. How long does it take to ship the electronic components?
If electronic component in stock, it is usually shipped before 5 o'clock on the same day, and it usually takes 5-10 working days to complete it by international express.
If it is a scheduled component, it needs to wait for the arrival of the parts, and then it will be inspected before delivery. If there are special circumstances, the sales staff will confirm with you. Weekends and holidays will also affect the delivery time of electronic products.
1. We provide 365 days warranty for all electronic components.
2. If you need a test report, please let us know. We have a long-term cooperative testing laboratory. If you have familiar testing laboratory, we can also ship to your designated laboratory for testing.
3. Where does Aztec Electronics mainly purchase electronic components from?
Distributors, free market, 48 global large-scale OEM factories in close contact with us (Great Price advantage, 100% original)
2.Are the Texas Instruments Incorporated (TI)'s LF353D price and stock displayed on the website accurate?
Aztec Electronics inventory fluctuates greatly and cannot be updated in time, it is recommended to confirm the order with Aztec Electronics salesperson or online customer service before payment.
You Also Ask
- How to test electronic components and quality inspections?
- How to transport your electronic components safely?
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After the electronic components have passed the quality inspection of Aztec Electronics, there are generally the following five packaging forms for electronic components: Tape, Tube, Tray, Bulk and Ammo.
Tape/Reel | Tube | Tray | Bulk | Ammo |
Weave bulk chips into tapes and pack them into reels through SMD components packaging Tape Machine. Reel is the most commonly used. | When packaging, arrange the components in the same direction and put them into plastic tubes one at a time. | Choose tray package with the same specifications as the original manufacturer, put the components into the tray and use the strapping machine. | Bulk packaging means that the SMD components are freely packaged in a formed plastic box or bag. | Adhesive tape cut continuously in predetermined quantities. The cut strips are placed in boxes for safekeeping. |
Choose electronic components that are vacuum-sealed against water, dust, moisture, oxidation, corrosion, and even UV or RF pollution.
How to pack electronic components in cartons?
1. Choose the right box for your electronic components2. Use anti-static bubble film protect electronic component
3. Put it into the box, no buffer dead corner, 360-degree package.
4. Labeled as fragile to ensure that the courier knows what needs to be done with the package.
Texas Instruments Incorporated (TI) was founded in 1930 and is headquartered in Dallas, Texas, USA. Haviv Ilan is the President and CEO. They design, manufacture, test and sell analog and embedded semiconductors. Industrial and automotive markets are the best markets for their products .
The company focuses on amplifiers, audio, clock and timing, data converters, die and wafer services, DLP® products, interfaces, isolation devices, logic, microcontrollers (MCUs) and processors, motor drivers, power management, radio frequency & Microwaves, Sensors, Switches & Multiplexers, Wireless Connectivity.
Their values: Trustworthy, Inclusive, Innovative, Competitive, Results-oriented
Acquisition history：
In October 1999, TI acquired power Trends
In 2000, TI acquired Burr Brown (BB) at approximately $7.6 billion.
In September 2011, TI acquired National semiconductor(NS.NSC) for US$6.5 billion.
In 2021, TI acquired an operational 300mm fabrication plant located in Lehi, Utah from Micron for $900 million.
Main application fields:
Automotive, Communications Equipment, Enterprise Systems, Industrial Applications, Aerospace and Defense, Appliances, Building Automation, Factory Automation and Control, Grid Infrastructure, Industrial Transportation (non-automotive and non-light truck), Lighting, Medical, Motor Drives, Power Delivery, Pro Audio, Video & Signage, Retail Automation & Payments, Test & Measurement, Personal Electronics.
