ON Semiconductor NCP1393BDR2G
NCP1393BDR2G
ON Semiconductor NCP1393BDR2G information
Type
Parameter
Factory Lead Time
21 Weeks
Lifecycle Status
ACTIVE, NOT REC (Last Updated: 5 days ago)
Mount
Surface Mount
Mounting Type
Surface Mount
Package / Case
8-SOIC (0.154, 3.90mm Width)
Number of Pins
8
Operating Temperature
-40°C~150°C TJ
Packaging
Tape & Reel (TR)
Published
2008
JESD-609 Code
e3
Feature
Bootstrap Circuit, Internal Oscillator
Pbfree Code
yes
Part Status
Not For New Designs
Moisture Sensitivity Level (MSL)
1 (Unlimited)
Number of Terminations
8
ECCN Code
EAR99
Terminal Finish
Tin (Sn)
Applications
AC Loads, Bulbs, General Purpose
Subcategory
MOSFET Drivers
Technology
Power MOSFET
Voltage - Supply
16V
Terminal Position
DUAL
Terminal Form
GULL WING
Number of Functions
1
Supply Voltage
12V
Frequency
250kHz
Base Part Number
NCP1393
Pin Count
8
Number of Outputs
2
Max Output Current
1A
Interface
On/Off
Output Configuration
Half Bridge (2)
Output Current
1A
Propagation Delay
20 μs
Turn On Delay Time
20 μs
Halogen Free
Halogen Free
Rise Time
40ns
Fall Time (Typ)
20 ns
Fault Protection
Shoot-Through
Rds On (Typ)
5m Ω LS, 12m Ω HS
High Side Driver
YES
Load Type
Inductive, Capacitive, Resistive
Height
1.5mm
Length
5mm
Width
4mm
Radiation Hardening
No
RoHS Status
ROHS3 Compliant
Lead Free
Lead Free
- Datasheets :
- Environmental Information :
- PCN Design/Specification :
- PCN Packaging :
- RohsStatement :
NCP1393BDR2G Overview
In order to package H bridge, Tape & Reel (TR) is used.The 8-SOIC (0.154, 3.90mm Width) package includes H bridge to save money.Bridge driver is possible to ensure improved reliabilbridge drivery by varying the supply voltage of 16V.H bridge circuit is mounted in the way of Surface Mount.-40°C~150°C TJ can work normally at motor driver H bridges operating temperature.H bridge motor driver is pretty useful in a wide range of applications, including AC Loads, Bulbs, General Purpose.Using Surface Mount, the board is mounted.Bootstrap Circuit, Internal Oscillator is one of full bridges specific characteristics.Transmission lines are terminated with 8 terminations with the H bridge that matches their characteristic impedance.An interface using 8 pins is used to provide pronged contact.The base H bridge ic number of NCP1393 can be used to find related H bridge ics.The H bridge is powered by a voltage supply of 12V.The maximum load current that power supply can provide at a specified ambient temperature reaches 1A.There is 1A current flowing through the output and power supply pins.It is through 8 pins that this bridge driver is able to perform its specific functions.It has a 2 output.There are many similarities between this H bridge motor driver and other components in the subcategory of MOSFET Drivers.
NCP1393BDR2G Features
Available in 8-SOIC (0.154, 3.90mm Width) Package / Case
Operating Temperature at the range of Surface Mount
Interface IC Type : NCP1393
NCP1393BDR2G Applications
There are a lot of ON Semiconductor NCP1393BDR2G Full Bridge Drivers, Half-Bridge Drivers applications.
- Voltage Regulators for DDR memory arrays
- DVD players
- Audio-visual equipment
- Industrial Automation
- High-Performance Gaming Motherboards
- High-Current DC-DC Point-of-Load Converters
- Desktop Computers
- Networking Microprocessor Voltage Regulators
- Voltage Regulators
- V-Core
- ImagePart NumberManufacturerPackage / CaseNumber of PinsMax Output CurrentOutput CurrentRise TimeSupply VoltageMountFall Time (Typ)View Compare
NCP1393BDR2G
ON Semiconductor8-SOIC (0.154, 3.90mm Width)
8
1 A
1 A
40 ns
12 V
Surface Mount
20 ns
- NCP1392BDR2GON Semiconductor
8-SOIC (0.154, 3.90mm Width)
8
1 A
500 mA
40 ns
12 V
Surface Mount
20 ns
NCP1393BDR2G
VS
NCP1392BDR2G
- NCP1392DDR2GON Semiconductor
8-SOIC (0.154, 3.90mm Width)
8
1 A
-
40 ns
12 V
Surface Mount
20 ns
NCP1393BDR2G
VS
NCP1392DDR2G
MIC4604YM-TRMicrochip Technology8-SOIC (0.154, 3.90mm Width)
8
1 A
-
20 ns
-
Surface Mount
20 ns
NCP1393BDR2G
VS
MIC4604YM-TR
- MIC4604YM-T5Microchip Technology
8-SOIC (0.154, 3.90mm Width)
8
1 A
-
20 ns
-
Surface Mount
20 ns
NCP1393BDR2G
VS
MIC4604YM-T5
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After the electronic components have passed the quality inspection of Aztec Electronics, there are generally the following five packaging forms for electronic components: Tape, Tube, Tray, Bulk and Ammo.
Tape/Reel | Tube | Tray | Bulk | Ammo |
Weave bulk chips into tapes and pack them into reels through SMD components packaging Tape Machine. Reel is the most commonly used. | When packaging, arrange the components in the same direction and put them into plastic tubes one at a time. | Choose tray package with the same specifications as the original manufacturer, put the components into the tray and use the strapping machine. | Bulk packaging means that the SMD components are freely packaged in a formed plastic box or bag. | Adhesive tape cut continuously in predetermined quantities. The cut strips are placed in boxes for safekeeping. |
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How to pack electronic components in cartons?
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3. Put it into the box, no buffer dead corner, 360-degree package.
4. Labeled as fragile to ensure that the courier knows what needs to be done with the package.
