STMicroelectronics L298P013TR
L298P013TR
STMicroelectronics L298P013TR information
Type
Parameter
Factory Lead Time
10 Weeks
Lifecycle Status
ACTIVE (Last Updated: 6 months ago)
Mount
Surface Mount
Mounting Type
Surface Mount
Package / Case
20-SOIC (0.433, 11.00mm Width) Exposed Pad
Number of Pins
20
Operating Temperature
-40°C~150°C TJ
Packaging
Tape & Reel (TR)
JESD-609 Code
e3
Part Status
Active
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Number of Terminations
20
ECCN Code
EAR99
Terminal Finish
Matte Tin (Sn) - annealed
Applications
DC Motors, Relays, Solenoids, Stepper Motors
Max Power Dissipation
25W
Technology
Bipolar
Voltage - Supply
4.5V~7V
Terminal Position
DUAL
Terminal Form
GULL WING
Peak Reflow Temperature (Cel)
245
Number of Functions
2
Supply Voltage
5V
Terminal Pitch
1.27mm
Reflow Temperature-Max (s)
30
Base Part Number
L298
Pin Count
20
Max Output Current
2A
Operating Supply Voltage
42V
Number of Channels
4
Interface
Logic
Operating Supply Current
50mA
Output Configuration
Half Bridge (4)
Output Current
4A
Output Characteristics
TOTEM-POLE
Collector Emitter Voltage (VCEO)
46V
Max Collector Current
4A
Output Polarity
TRUE
Input Characteristics
STANDARD
Voltage - Load
4.8V~46V
Fault Protection
Current Limiting, Over Temperature
Supply Voltage1-Nom
42V
Switching Frequency
25kHz
Built-in Protections
OVER CURRENT; THERMAL
Motor Type
Brushed
Load Type
Inductive
Height
3.3mm
Length
16mm
Width
11.1mm
Radiation Hardening
No
RoHS Status
ROHS3 Compliant
Lead Free
Lead Free
- Datasheets :
L298P013TR Overview
H bridge is packaged using Tape & Reel (TR).In an effort to save money, H bridge is included in the 20-SOIC (0.433, 11.00mm Width) Exposed Pad package.Reliabilbridge drivery can be improved by increasing 4.5V~7V's supply voltage.H bridge circuit is mounted in the way of Surface Mount.Motor driver H bridge's operating temperature enables -40°C~150°C TJ to function normally.There are a variety of applications for H bridge motor driver, including DC Motors, Relays, Solenoids, Stepper Motors.On the PCB H gate is mounted using Surface Mount.20 terminations are used to terminate transmission lines with H bridges that match their characteristic impedances.In a signal interface, the 20 pins serve as pronged contacts.Its base H bridge ic number of L298 is the basis to find more related H bridge ics.For the operation of the H bridge, a voltage supply of 5V is used.An ambient temperature of 2A enables a power supply to provide a maximum load current.The output and power supply pins are flowing wH-bridgeh current 4A.It is through the 20 pins that the bridge driver can perform its specific functions.To ensure high efficiency, the operating supply voltage is maintained at 42V.
L298P013TR Features
Available in 20-SOIC (0.433, 11.00mm Width) Exposed Pad Package / Case
Operating Temperature at the range of Surface Mount
Interface IC Type : L298
Number of Receivers: 42V
L298P013TR Applications
There are a lot of STMicroelectronics L298P013TR Full Bridge Drivers, Half-Bridge Drivers applications.
- PC peripherals
- Industrial Pumps
- DVD players
- Voltage Regulators for GPUs
- Small Form-Factor Voltage Regulator Modules
- DC-DC Converters
- Dual DC motor
- Telecom Microprocessor
- OA equipments
- Bipolar stepper motor
- ImagePart NumberManufacturerPackage / CaseNumber of PinsInterfaceSupply VoltageSupply Voltage1-NomRoHS StatusPart StatusJESD-609 CodeView Compare
L298P013TR
STMicroelectronics20-SOIC (0.433, 11.00mm Width) Exposed Pad
20
Logic
5 V
42 V
ROHS3 Compliant
Active
e3
MAX4053ACSE+Maxim Integrated16-SOIC (0.154, 3.90mm Width)
16
Logic
5 V
-
ROHS3 Compliant
Active
e3
L298P013TR
VS
MAX4053ACSE+
- MAX338CSE+Maxim Integrated
16-SOIC (0.154, 3.90mm Width)
16
Logic
15 V
-
ROHS3 Compliant
Active
e3
L298P013TR
VS
MAX338CSE+
RE46C104S14FMicrochip Technology14-SOIC (0.154, 3.90mm Width)
14
-
5 V
-
ROHS3 Compliant
Active
e3
L298P013TR
VS
RE46C104S14F
RE46C105E14FMicrochip Technology14-DIP (0.300, 7.62mm)
14
-
9 V
-
ROHS3 Compliant
Active
e3
L298P013TR
VS
RE46C105E14F
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After the electronic components have passed the quality inspection of Aztec Electronics, there are generally the following five packaging forms for electronic components: Tape, Tube, Tray, Bulk and Ammo.
Tape/Reel | Tube | Tray | Bulk | Ammo |
Weave bulk chips into tapes and pack them into reels through SMD components packaging Tape Machine. Reel is the most commonly used. | When packaging, arrange the components in the same direction and put them into plastic tubes one at a time. | Choose tray package with the same specifications as the original manufacturer, put the components into the tray and use the strapping machine. | Bulk packaging means that the SMD components are freely packaged in a formed plastic box or bag. | Adhesive tape cut continuously in predetermined quantities. The cut strips are placed in boxes for safekeeping. |
Choose electronic components that are vacuum-sealed against water, dust, moisture, oxidation, corrosion, and even UV or RF pollution.
How to pack electronic components in cartons?
1. Choose the right box for your electronic components2. Use anti-static bubble film protect electronic component
3. Put it into the box, no buffer dead corner, 360-degree package.
4. Labeled as fragile to ensure that the courier knows what needs to be done with the package.
